Abstract: An apparatus configured to process a digital video signal comprising an input circuit, a processing circuit and an encoder circuit. The input circuit may be configured to present a digital video signal comprising a plurality of frames. The processing circuit may be configured to detect scene changes in the digital video signal by analyzing (i) a current one of the plurality of frames and (ii) two or more other frames. The encoder circuit may be configured to generate an encoded signal in response to the digital video signal and the scene changes.

Abstract: A method for decoding a bitstream comprising the steps of (A) generating a first field picture in response to a frame picture of a first bitstream, (B) generating a second field picture in response to the frame picture of the first bitstream and (C) generating a second bitstream containing the first field picture and the second field picture.

Abstract: The present invention is directed to a system and method for generalize graph structuring for layered virtual volumes. In embodiments of the present invention, such a system and method are suitable for enabling implementation of storage area networking (SAN) features on RAID storage devices. In an aspect of the present invention, a method of providing access to volumes in an electronic storage device suitable for storing electronic data may include structuring a plurality of volumes accessible on an electronic storage device, the volumes being a unit of logical storage, wherein the plurality of volumes are structured as a graph structure. Interaction with the volumes is performed through the use of the graph structure.

Abstract: Various integrated circuits (ICs) are provided. One IC includes bonding pads and an input output (I/O) region surrounding a core region. The I/O region includes I/O cells having a width approximately equal to or less than a width of the bonding pads. The IC also includes core logic arranged within the I/O region. Another IC includes four rows of bonding pads. Each row is arranged parallel to a different side of a core region. I/O sub-regions are arranged proximate each side of the core region. Each I/O sub-region includes I/O cells and core logic. An additional IC includes a first I/O region surrounding a core region and a second I/O region surrounding the first I/O region. The IC also includes bonding pads arranged outside of I/O cells in the first and second I/O regions. A width of the I/O cells is approximately equal to a pitch of the bonding pads.

Abstract: A multiple layer power mesh design includes an L-shaped structure and a bow tie-shaped structure. The L-shaped structure provides a plurality of L-shaped power rails in each of four quadrants of the layer. The bow tie-shaped structure includes plurality of vertical power rails in each of a left and right triangularly-shaped portion of the layer. The vertical power rails of the bow tie-shaped structure provide and interface between the upper and lower quadrants of the L-shaped layer. The bow tie-shaped structure provides additional available space which can, for example, be used for routing signal traces. A T-shaped structure is also provided for use with the bow tie-shaped layer. The T-shaped layer provides for improved distances between the VDD and the VSS power rails.

Abstract: A method of generating synthesis scripts to synthesize integrated circuit (IC) designs described in a generic netlist into a gate-level description includes the steps of identifying hardware elements in a generic netlist, determining key pins for each of the identified hardware elements, extracting design structure and hierarchy from the generic netlist, generating script to cause a logic synthesis tool to apply bottom-up synthesis to modules and sub-modules of the IC design, generating script to cause a logic synthesis tool to apply top-down characterization to modules and sub-modules of the IC design, and generating script to cause a logic synthesis tool to repeat these bottom-up and top-down applications until constraints are satisfied.

Abstract: A register address generation tool is used during the design of semiconductor products. For those registers and/or memories that are addressable on a bus, the register address generation tool creates the interconnect RTL, header files, static timing analysis constraint files, and verification testcases. The tool also maintains coherence between what has been generated and the available resources for the design of the semiconductor product in a design. If there are any registers and/or memories that are not being used, the register address generation tool may further generate the RTL that will convert these unused resources to performance-enhancing features such as control registers, status registers, etc. The register address generation tool read a design database having an application set to determine what hardmacs and what transistor fabric is available. It also receives as input a bus specification and address parameters.

Abstract: A method for representing a motion for two blocks. The method generally includes the steps of (A) exchanging a particular value of a plurality of values with a memory, each of the values defining which of the two blocks use which of a plurality of motion vectors based upon one of a plurality of prediction types and (B) representing the motion for the two blocks with a group comprising the particular value and up to all of the motion vectors.

Abstract: Provided is a process for forming a barrier film to prevent resist poisoning in a semiconductor device by depositing a second nitrogen-free barrier layer on top of a first barrier layer containing nitrogen. A low-k dielectric layer is formed over the second barrier layer. This technique maintains the low electrical leakage characteristics of the first barrier layer and reduces nitrogen poisoning of a photoresist layer subsequently applied.

Abstract: A method for storing data of a plurality of components of an image in a memory system with four banks comprising the steps of (A) placing a first portion of data of a first component of the plurality of components into a first bank of the four banks and (B) placing a second portion of the data of the first component in a second bank of the four banks, where all of the data of the first component is stored in the first and second banks and occupies at least three pages in the memory system.

Abstract: An apparatus comprising a first processing circuit and a second processing circuit. The first processing circuit may be configured to generate (i) one or more prediction samples and (ii) a plurality of macroblocks, in response to each frame of an input video signal. The second processing circuit may be configured to (i) select one or more reference indices for each of the macroblocks from one or more sets of reference indices and (ii) generate said one or more prediction samples in response to said selected reference indices. Each of the selected reference indices is generally determined based upon minimum and maximum values for each of the one or more sets of reference indices.

Abstract: A method of forming a narrow isolation structure in a semiconducting substrate. The isolation structure is a trench that has a bottom and sidewalls, and that is to be filled with an isolating material. The isolating material has desired electrical properties and desired chemical properties, and is substantially reactively grown from the semiconducting substrate. A precursor material layer is formed on the bottom of the trench and on the sidewalls of the trench. The precursor material layer has electrical properties and chemical properties that are substantially similar to the desired electrical properties and the desired chemical properties of the isolating material. A substantial portion of the precursor material layer is removed from the bottom of the trench to expose the semiconducting substrate at the bottom of the trench, while leaving a substantial portion of the precursor material layer on the sidewalls of the trench.

Abstract: A data processing system comprising a block move engine, a memory, a register and a reader. The block move engine may be configured to process data. The memory may be configured to store data in the form of a linked list comprising a plurality of items of control data. The register may be associated with the block move engine and configured to control the block move engine, in response to the control data. The reader may be configured to read the control data from the memory and apply the control data to the register.

Abstract: A system, apparatus and/or method is provided for removing water vapor from a wafer processing chamber generated as a byproduct of wafer processing. A water vapor trap is used to collect the water vapor byproduct from the processing chamber interior. The water vapor trap has at least a portion thereof in communication with an interior of the processing chamber for collection of the water vapor and another portion thereof in communication with an exterior of the processing chamber. The portions are movable with respect to the interior and exterior of the processing chamber such that the portions may switch places. This allows the processing chamber to be in at least a substantially continuous mode of operation while still providing for the removal of water vapor byproduct via the water vapor trap. The “used” portion of the water vapor trap is regenerated while the “clean” portion is collecting water vapor.

Abstract: Embodiments of the invention include a calibration standard for semiconductor metrology tools. The standard comprises a substrate having a surface with a calibration layer formed thereon. A protective layer is formed over the underlying calibration layer. The calibration layer and protective layer are each formed to precise tolerances. The invention also includes methods for forming a calibration standard for semiconductor metrology tools.

Abstract: Multiple damascene layers in integrated circuits can form several advantageous designs or components that may lower cost or increase performance of certain designs. In embodiments for power bus signals, multiple damascene layers may be used to form traces with increased power capacity and lower cost. In other embodiments, multiple damascene layers may be used to form components such as capacitors and inductors with increased performance.

Abstract: A system for designing an integrated circuit (IC). The system generally comprising a circuit and a programmable portion used for diagnostics and finding bugs. The circuit generally comprises (i) a functional portion and (ii) a logic portion that may be connected to the functional portion. The logic portion generally includes one or more interfaces. The programmable portion may be configured to detect, correct and/or diagnose errors in the logic portion through the one or more interfaces.

Abstract: An integrated circuit having functional circuitry within a core portion of the integrated circuit. Input circuits are disposed on a first layer within a peripheral portion of the integrated circuit, where the input circuits are electrically connected to the functional circuitry. Power and ground buss lines are disposed on a second layer within the peripheral portion of the integrated circuit, where the second layer overlies the first layer. The power and ground buss lines overlie the input circuits, and are electrically connected to the input circuits. Bonding pads are disposed on a third layer within the peripheral portion of the integrated circuit, where the third layer overlies the second layer. The bonding pads overlie the power and ground buss lines and the input circuits, and are electrically connected to the input circuits.

Abstract: A method for checking power errors in an ASIC design is disclosed. The method includes providing a power checker software program with one or more power checker modules that each check a particular type of power element in the ASIC design. A power checker database is created that stores the following: individual power elements in the ASIC design, a connectivity graph of the power elements, and location bins corresponding to physical areas in ASIC design that identify the power elements that are located within each area. The method further includes providing a user with a choice of which power elements in the design to check, and executing the power checker modules corresponding to the selected power elements in order to check for errors in the selected power elements. Finally, any detected errors are output for the user.

Abstract: The present invention provides a method of forming a semiconductor device fuse and a semiconductor device fuse structure. A first dielectric layer is formed on top of a metal layer in a semiconductor device. The dielectric layer is patterned to provide access to at least two contacts in the metal layer. A conductive metal layer is deposited and patterned to form a fuse between the fuse contacts. A second dielectric layer is deposited on the conductive metal layer.