Abstract: A severable horizontal portion of a fuse link is formed relative to a vertically configured structure in an IC to promote separation of the severable portion upon applying energy from a laser beam. The vertically configured structure may be a reduced vertical thickness of the severable portion, an elevated lower surface of the severable portion above adjoining portions of the fuse link, a protrusion which supports the severable portion at a height greater than a height of the adjoining portions of the fuse link, flowing the melted severable portion down sloped surfaces away from a break point, and a propellent material beneath the severable portion which explodes to ablate the severable portion.

Abstract: A system and method for reading and writing in a multilevel optical data system is disclosed. The system provides control signals for timing acquisition, level calibration, DC control, AGC, equalizer training and data synchronization. The user data is ECC protected and optionally convolutionally encoded before being combined with the control signals in an information block. The multilevel information block can be written to an optical disc as a series of multilevel marks. The optical disc may also contain an Address in Pregroove signal (AIP) to facilitate synchronization during writing of an information block. The AIP signal has an integer number of address frames per information block.

Abstract: An apparatus comprising a device and a resistor. The device generally comprises (i) a gate configured to receive an input voltage, (ii) a drain coupled to a first supply voltage, and (iii) a source coupled to an output. The resistive element is generally coupled between the source and a second supply voltage. The apparatus generally provides voltage tolerance between the input voltage and the output.

Abstract: A precision analog exponentiation circuit includes a precision analog exponentiation circuit includes a first transistor coupled to a reference current for generating a voltage at the first transistor, a second transistor coupled to the first transistor for generating an output current, a variable current source coupled to the first transistor and the second transistor for generating a sum of the reference current and the output current in response to a feedback signal, and a feedback amplifier coupled to the first transistor for generating the feedback signal wherein the variable current source maintains the voltage at the first transistor substantially equal to a reference voltage so that the output current is substantially equal to an exponential function of a control voltage coupled to the first transistor and the second transistor.

Abstract: A fluted signal pin provides expanded surface area for high frequency operation which minimizes inductive and capacitive effects. The signal pin may be mounted to a circuit board via a support stanchion or membrane during assembly or repair. The membrane may be permanent or removable by heat, water, and/ or detergent. A pin cap optionally is provided to ensure attachment to an overlying integrated circuit package.

Abstract: An arrangement for measuring pressure on a semiconductor wafer and an associated method for fabricating a semiconductor wafer are disclosed.

Abstract: The present invention may relate generally to a circuit for converting a first digital signal having a first sample rate to second digital signal having a second sample rate. The circuit may comprise a cascaded integration-comb filter and a fractional sample rate converter. The fractional sample rate converter may be configured to perform fractional sample rate conversion. A first of the cascaded integrator-comb filter and the fractional sample rate converter may be configured to receive the first signal having the first sample rate and to generate a third digital signal having a third sample rate different from the first and second sample rates. A second of the cascaded integrator-comb filter and the fractional sample rate converter may be configured to receive the third signal having the third sample rate and to generate the second signal having the second sample rate.

Abstract: An apparatus comprising (i) an input circuit configured to provide a predetermined voltage tolerance in response to a plurality of control signals and (ii) a control circuit configured to generate the plurality of control signals in response to one or more input signals.

Abstract: A method and system for automatically calibrating a masking process simulator using a calibration mask and process parameters to produce a calibration pattern on a wafer. A digital image is created of the calibration pattern, and the edges of the pattern are detected. Data defining the calibration mask and the process parameters are input to a process simulator to produce an alim image estimating the calibration pattern that would be produced by the masking process. The alim image and the detected edges of the digital image are then overlaid, and a distance between contours of the pattern in the alim image and the detected edges is measured. One or more mathematical algorithms are used to iteratively change the values of the processing parameters until a set of processing parameter values are found that produces a minimum distance between the contours of the pattern in the alim image and the detected edges.

Abstract: A method and system for decoding a biphase-mark input stream is disclosed. Aspects of the present invention include receiving an external biphase-mark input stream by a receiver module; recovering timing information from the input stream; decoding the input stream to generate decoded data and storing the decoded data in a data buffer; reading, by an audio out module, the decoded data from the data buffer at a rate determined by a programmable clock; using the timing information from the receiver module to calculate a sampling frequency of the input stream; and adjusting a frequency of the programmable clock to substantially match the sampling frequency so that the audio out module reads the decoded from the buffer at substantially the same rate that the receiver module inputs the decoded data into the data buffer.

Abstract: A system for monitoring and managing devices on network comprising one or more managed devices connected to the network and storage means for storing a device management application program associated with each of the managed devices. The system further includes a management station which is in communication with each of the managed devices across the network, and the management station is in communication with the storage means. When a user wishes to monitor, configure, or manage one of the managed devices on the network, the user preferably selects the managed device to be managed and the management station retrieves from the storage means the device management application program associated with the selected managed device. By the management station processing the management application program for the selected managed device, the management station allows the user to monitor the status of the managed device, as well as change the configuration of and fix errors with the managed device.

Abstract: A semiconductor device wherein Si—Ge is the base of a bipolar transistor and a Silicon layer is the emitter. A method of making such a semiconductor device including steps of forming a Silicon dioxide layer on a Silicon substrate, using a photo resist application and exposure to define where a HBT device will be placed. Plasma etching the Silicon dioxide layer to define an undercut, epitaxially growing an Si—Ge layer and a Silicon layer, and continuing manufacture to form one or more bipolar and CMOS devices and define interconnect and passivation.

Abstract: A battery charger method and apparatus are disclosed for providing detailed battery status and charging method information for a selected one of multiple batteries that are simultaneously coupled to the battery charger. The battery charger includes a controller. The controller selects one of the batteries to monitor and charge. The controller then starts a measurement cycle for the selected battery. During the measurement cycle, the controller determines current battery characteristics of the selected battery. The controller determines whether the selected battery is ready for charging by determining whether the battery characteristics of the selected battery are within a specified range. If the controller determines that the selected battery is ready for charging, the controller causes the battery charger to start charging the battery. If the controller determines that the selected battery is not ready for charging, the controller selects another battery to monitor and charge.

Abstract: A method of processing a substrate, where the substrate is transferred from an ambient environment into a clean environment. The substrate is heated to at least a first temperature within the clean environment, and then maintained at no less than the first temperature within the clean environment. The substrate is selectively transferred within the clean environment to more than one processing chambers, and processed in the more than one processing chambers. The substrate is transferred from the clean environment into the ambient environment.

Abstract: A method implements a change to a circuit design for a system formed on a semiconductor chip, the circuit design including at least one circuit core. The method includes providing in the circuit design at least one field programmable gate array (FPGA) core, extracting an incremental change to the circuit design by comparing a new resister-transfer-level (RTL) design and an old RTL design for the system, synthesizing the incremental change into a netlist for the at least one FPGA core, generating new metal layer interconnections so as to provide an input and an output for the at least one FPGA core in accordance with the incremental change, and programming the at least one FPGA core in accordance with the netlist. The at least one FPGA core is provided in an otherwise unused area of the chip.

Abstract: A method of forming a semiconductor on insulator structure in a monolithic semiconducting substrate with a bulk semiconductor structure. A first portion of a surface of the monolithic semiconducting substrate is recessed without effecting a second portion of the surface of the monolithic semiconducting substrate. An insulator precursor species is implanted beneath the surface of the recessed first portion of the monolithic semiconducting substrate, and a trench is etched around the implanted and recessed first portion of the monolithic semiconducting substrate. The insulator precursor species is activated to form an insulator layer beneath the surface of the recessed first portion of the monolithic semiconducting substrate. The semiconductor on insulator structure is formed in the first portion of the monolithic semiconducting substrate, and the bulk semiconductor structure is formed in the second portion of the monolithic semiconducting substrate.

Abstract: A package substrate having a first layer adapted to received an integrated circuit, with electrically conductive contacts adapted to send and receive signals to and from the integrated circuit. The first layer includes a ground plane. A second layer is disposed underneath the first layer, and has electrically conductive traces, including a single ended clock signal trace and a set of two differential clock signal traces. The single ended clock signal trace and the set of two differential clock signal traces are substantially surrounded by grounded guard traces from all other electrically conductive traces on the second layer. A first electrically nonconductive layer is disposed between the first layer and the second layer.

Abstract: A method for designing an input output cell of an integrated circuit. The input output cell has a required area, a width, and a height. The bonding pad pitch length between adjacent bonding pads of the integrated circuit is measured. The width of the input output cell is specified to be substantially equal to the bonding pad pitch length. The required area is divided by the width to determine a first value, and the height of the input output cell is specified to be substantially equal to the first value. In this manner, the width of the input output cells is no greater than the distance between two adjacent bonding pads, and thus the input output cells can be placed very close together, facilitating their use in input output limited integrated circuit designs. However, the height of the input output cells is no greater than is necessary to enclose the required area of the input output cell, thus facilitating their use in core limited integrated circuit designs.

Abstract: The present invention is directed to a scale-invariant topology and traffic allocation in multi-node system-on-chip switching fabrics. A method for allocating resources in a design of an integrated circuit may include receiving resource data for components of an integrated circuit. The resource data is suitable for indicating consumption by the components of at least one resource. Integrated circuit resources for the components of the integrated circuit are allocated according to a power law distribution as applied to the received resource data.

Abstract: A photoresist-free and ARC-free lip on the periphery of the upper surface of a semiconductor substrate adjacent the end edge of the substrate is formed by the steps of: forming an ARC layer on one surface of a semiconductor substrate; chemically treating the ARC layer to chemically terminate the ARC layer a first distance from the end edge of the substrate; forming a photoresist layer over the semiconductor substrate and over the ARC layer thereon; and exposing the peripheral portion of the photoresist layer to UV light followed by development of the exposed peripheral portion of the photoresist layer to photolithographically terminate the photoresist layer a second distance from the end edge of the substrate wherein the second distance is smaller than the first distance.