Abstract: Methods and systems for end-to-end data protection in a computer are disclosed. A data integrity field is generally associated with data transferred along a data path in a computer. A virtual end-to-end address can be established, which is associated with the data integrity field, wherein the virtual end-to-end address transfers encoded information to a controller of the computer through one or more addresses of a read and/or write request thereof. The encoded information can be utilized to identify an offending entity within the data path. An end-to-end access list can also be associated with the virtual end-to-end address, such that the end-to-end access list contains at least one entry for every data transfer request provided to an interface device. Data corruption is therefore preventable in the entire I/O path in a computer from a host bus adapter through to the actual physical drive.

Abstract: A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of the sidewalls. A portion of the lead frame within the sidewall has at least one aperture penetrating into the lead frame. The sidewall material extends into the aperture, thereby forming a strong interfacial bond that provides a low leakage, sidewall-lead-frame interface. The base has a reentrant feature that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby forming a low leakage base-sidewalls interface. The top surface of the base has a groove that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby enhancing the low leakage base-sidewall interface.

Abstract: A method of forming a planarized layer on a substrate, where the substrate is cleaned, and the layer is formed having a surface with high portions and low portions. A resistive mask is formed over the low portions of the layer, but not over the high portions of the layer. The surface of the layer is etched, where the high portions of the layer are exposed to the etch, but the low portions of the layer underlying the resistive mask are not exposed to the etch. The etch of the surface of the layer is continued until the high portions of the layer are at substantially the same level as the low portions of the layer, thereby providing an initial planarization of the surface of the layer. The resistive mask is removed from the surface of the layer, and all of the surface of the layer is planarized to provide a planarized layer.

Abstract: A process and apparatus are provided for tiling objects, such as design memories, in one or more respective object locations in a layout pattern. For each object, the following steps are performed recursively based on a comparison of at least one of a capacity and a width of the object and that of the respective object location: (1) do nothing; (2) reconfigure the object to have a different capacity and/or width; and (3) split the object into two or more separate objects. The recursion is repeated for each reconfigured object and each separated object.

Abstract: A method and apparatus are provided for receiving a list of design memories, wherein each type of design memory in the list has a name and at least one instance. A pre-placement model is associated with each named memory type in the list. The design memories in the list are mapped to an integrated circuit layout pattern, wherein at least one memory type comprises first and second instances that are mapped differently from one another. After mapping, at least one of the first and second instances is renamed to have a different name than the other. A post-placement model is then associated with each named memory type in the list, including a separate model for each renamed design memory.

Abstract: A method and computer program product for verifying an incremental change to an integrated circuit design include receiving as input an integrated circuit design database and an engineering change order. Objects in the integrated circuit design database are identified and marked to indicate a current state of the integrated circuit design database. The engineering change order is applied to the integrated circuit design database, and the integrated circuit design database is analyzed to generate a list of incremental changes to the integrated circuit design database resulting from the engineering change order. Objects in the integrated circuit design database included in the list of incremental changes are identified and marked to distinguish objects in the integrated circuit design database that were changed from the current state. The marked integrated circuit design database distinguishing the objects that were changed from the current state is generated as output.

Abstract: A circuit and a method for operating the circuit are disclosed. A first step of the method generally comprises generating a plurality of first intermediate signals in two parallel first operations each responsive to a respective half of a plurality of input signals. A second step involves generating a plurality of result signals in a plurality of first logical operations each responsive to at most two of the first intermediate signals. A third step includes generating a first output signal as a particular one of the result signals, wherein a first delay from the first intermediate signals to the first output signal is at most through one logical gate. A fourth step of the method generally comprises generating a second output signal for a second threshold function in a logical OR operation of the result signals except for the particular one result signal.

Abstract: A plurality of user-defined memories are mapped to pre-defined basic memories, such as defined on a base platform. The user-defined memories are dividing into classes of similar memories. A mapping technique is selected for members of a selected class of user-defined memories that minimizes the ratio (maxi,j(USEDi,j/AVAILi,j)) of basic memories that have been mapped to basic memories that are available for mapping. If the number of different memory mappings is smaller than a threshold the mapping technique is applied to each user-defined memory. If the number of different memory mappings is greater than the threshold, the groups are arranged in ordered queues of single memory types based on a mapping price and the mapping technique is selected based on a memory of each group and is applied to each user-defined memory in the respective group.

Abstract: A device and method are provided for testing the timing of an output signal from a circuit. The output signal can be sent from a circuit contained within a portion of an integrated circuit, and represents a response to a test pattern or stimuli applied to that circuit. The output signal is compared to an expected output signal to determine skew of that signal relative to the clocking of the circuit. Testing the output signal involves placing a characterization path within the functional path of the output signal, between the circuits being tested and an output terminal that can receive a measurement device. By placing the characterization path into the functional path, the output signal sees only a single load gate terminal of, for example, a logic gate. The reduced loading not only positively impacts the normal operation of the output signal, but also beneficially minimizes the possibility of any inaccuracies in the characterization testing.

Abstract: The present invention provides a memory device of a type that outputs a ready signal to the outside, and that is capable of achieving an enhanced data transfer rate and a uniform latency time. A memory device according to the present invention includes a ready signal sending portion, and the ready signal sending portion monitors a memory portion to detect the memory portion becoming ready for reading or writing of specified data. The ready signal sending portion generates a first ready signal that changes from a busy state to a ready state after the detection and an enabling signal that changes from a disable state to an enable state on the basis of a preset ready generating timing value. When the first ready signal is in the ready state and the enabling signal is in the enable state, the ready signal sending portion sends to the outside a second ready signal that is in a ready state.

Abstract: Locations of IC tags affixed to items are automatically recognized without requiring interrogators or antennas are allocated at respective inventory locations. To attain this object, interrogator 1 firstly transmits a unique ID readout command specifying read range, and corresponding IC tags 2a, 2b, 2c sequentially reply their unique IDs (Xa), (Xb), (Xc) respectively. At the same time, interrogator 1 transmits a probe signal send out command specifying ID, and corresponding IC tags 2a, 2b, 2c sequentially send out probe signals respectively. IC tag 2 that detects a probe signal with reception strength more than a predetermined level stores in its memory IDs (Xa), (Xb), (Xc) that interrogator 1 specified as adjacent ID. Then, interrogator 1 transmits an adjacent ID readout command specifying ID, and corresponding IC tags 2a, 2b, 2c sequentially reply adjacent IDs (Xb), (Xa.Xc), (Xb) stored in their memory respectively.

Abstract: Base platforms customizable into ICs are designed by identifying a plurality of macros for placement on the platform, each macro being defined in part by a plurality of elements that perform respective functions of the macro. Identical elements in a plurality of macros are identified, and a common element is placed on the platform for an identical element of at least two macros. All other elements of the macros are placed at locations on the platform relative to the common element as to satisfy macro placement rules for each macro. Identical elements can be identified by identifying similar elements in a plurality of macros, and creating a common element generic to the similar elements. The user designs a metalization layer to select macros and configure common elements to the selected macros.

Abstract: The present invention provides a method and BIST architecture for fast memory testing in a platform-based integrated circuit. The method may include steps as follows. An Mem-BIST controller transmitter is started to generate input signals for a memory in a platform using a deterministic and unconditional test algorithm. The input signals are delayed by a first group of pipelines by n clock cycles. The delayed input signals are received by the memory and an output signal is generated by the memory. The output signal is delayed by a second pipeline by m clock cycles. An Mem-BIST controller receiver is started to receive the delayed output signal for comparison.

Abstract: Methods and systems for improving delayed read handling in a loop of delayed commands among a larger set of commands in a queue of commands are disclosed. In general, when commands in a delayed loop are completed out of order, “holes” are left in the command queue. Skipping over such “holes” consumes multiple clock cycles before another command can be issued, as each “hole” must be examined first in order to determine that it no longer contains a valid read command. A loop of delayed read commands can thus be created from among a larger set of commands in a queue of commands with each command entry having a pointer to the next valid command. Valid delayed read commands in the loop of commands can then be processed by automatically advancing between any two valid delayed read commands among the loop of commands. In this manner, the time to advance between any two commands in the delayed read loop is constant and PCI read performance thereof can be dramatically improved.

Abstract: A methodology for generating scan based transition patterns (i.e., ATPG pattern generation for transition delay faults (“TDF”)) wherein when either a slow-to-rise (STR) or a slow-to-fall (STE) transition fault is detected, that specific fault is removed from a fault universe as well as its companion TDF, wherein the companion fault is a fault on the same node as the detected fault but has the opposite transition. In other words, if a slow-to-rise (STR) transition fault is detected, the slow-to-rise (STR) transition fault is removed from the fault universe as well as its corresponding slow-to-fall (STF) transition fault (and vise versa). By removing companion faults as well as those which are specifically detected, pattern generation run time is reduced as well as the total pattern count for the final delay test pattern.

Abstract: A method for calibrating read data strobe gating including the steps of: (A) performing a coarse timing adjustment configured to determine a coarse delay setting that produces invalid data, (B) performing a medium timing adjustment configured to adjust a medium delay setting and the coarse delay setting until valid data is detected, (C) performing a fine timing adjustment configured to adjust the medium delay setting and a fine delay setting until valid data is detected and (D) adding one-half cycle to a gating delay determined by the coarse, the medium and the fine delay settings.

Abstract: An integrated circuit, where a hard macro is resident within the integrated circuit. The hard macro receives a clock signal at a frequency that is below the operational frequency of the integrated circuit, and produces a clock signal having a frequency that is at least equal to the operational frequency of the integrated circuit. The hard macro has a first input that receives a first signal from the tester. A second input receives a second signal from the tester, offset by substantially ninety degrees from the phase of the first signal. A speed select input receives a signal, where the signal is selectively set at one of a logical high indicating a first multiplier to be applied in the hard macro, and a logical low indicating a second multiplier to be applied in the hard macro. A clock multiplication circuit receives the first signal, selectively receives the second signal, and receives the speed select signal, and produces the clock signal.

Abstract: An apparatus includes a first semiconductor die and at least one further semiconductor die. A substrate is attached to the first die and the further die and has an electrical interconnect pattern that interconnects contacts on the first die with respective contacts on the further die. Features of the interconnect pattern have positions on the substrate with smaller tolerances relative to positions of the contacts on the first die than to positions of the contacts on the further die.

Abstract: When a compression part outputs JPEG data which is discrete in the time direction, the valid data is accumulated in an FIFO. When the valid data of predetermined size is accumulated in the FIFO, an encapsulation part adds markers before and after the valid data and transmits JPEG stream data to a host control module. This stream data includes encapsulated data in which the valid data is encapsulated with the markers and invalid data. The host control module stores this stream data in an SDRAM without any change. Then, by searching data for the markers, the valid data is acquired and the JPEG data is reproduced.