Patents Assigned to LSI
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Patent number: 6576981Abstract: A platen for use in a dry etching process for substrate production, the platen having a surface susceptible to chipping and/or particle generation from the dry etching process and a coating applied to at least a portion of the surface for rendering the surface less susceptible to chipping and/or particle generation, the coating comprising a silicon carbide coatingType: GrantFiled: July 3, 2001Date of Patent: June 10, 2003Assignee: LSI Logic CorporationInventor: Katsumi Aoki
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Patent number: 6577165Abstract: A system which simplifies the clock tuning process for a clock buffer tree. Essentially, a clock buffer tree is provided where the clock buffer tree includes clock buffers of different strengths. The different strength clock buffers which are in the clock buffer tree have the same pin-out configuration. Hence, it is easy and straightforward to upsize or downsize any of the clock buffers in the clock buffer tree, and it is guaranteed that the new cell will fit into the old cell's slot in the tree. Since none of the nets need to be modified, consistent timing results are achieved. Moreover, the new timing for the modified clock buffer can be anticipated because its wire loading does not change at all. The ease of clock tuning makes it much easier to design clock buffer trees and layouts, and allows the overall design to be completed faster and easier.Type: GrantFiled: October 25, 2001Date of Patent: June 10, 2003Assignee: LSI Logic CorporationInventors: Cyrus C. Cheung, Keith D. Au
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Patent number: 6572925Abstract: A process is provided for forming a low k fluorine and carbon-containing silicon oxide dielectric material by reacting with an oxidizing agent one or more silanes including one or more organofluoro silanes characterized by the absence of aliphatic C—H bonds. In one embodiment, the process is carried out using a mild oxidizing agent. Also provided is a low dielectric constant fluorine and carbon-containing silicon oxide dielectric material for use in an integrated circuit structure containing silicon atoms bonded to oxygen atoms, silicon atoms bonded to carbon atoms, and carbon atoms bonded to fluorine atoms, where the dielectric material is characterized by the absence of aliphatic C—H bonds and where the dielectric material has a ratio of carbon atoms to silicon atoms of C:Si greater than about 1:3.Type: GrantFiled: February 23, 2001Date of Patent: June 3, 2003Assignee: LSI Logic CorporationInventors: Vladimir Zubkov, Sheldon Aronowitz
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Patent number: 6573767Abstract: A power ground short circuit with adjustable activation delay and activation time period eliminates latent voltages in the power down/ off discharging circuitry. The circuit uses an internal back up power storage device to supply power on power down. A comparator determines when the power down condition occurs. Two timers are used to generate an activation signal for a charge pump. The charge pump is responsible for turning on a pair of transistors which bring the power bus voltage down to a zero level. A slew rate detector enables the comparator.Type: GrantFiled: October 11, 2001Date of Patent: June 3, 2003Assignee: LSI Logic CorporationInventor: Barry Caldwell
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Patent number: 6574762Abstract: An integrated circuit device is disclosed having a boundary scan chain and a hardwired BIST unit that is configurable via the control circuitry for the boundary scan chain. In one embodiment, the device includes application logic, a BIST unit, a boundary scan chain, a register, and a test access port. The application logic is the logic that provides the intended function of the chip. The BIST unit is configured to apply test patterns to the application logic to verify its functionality. The boundary scan chain is configured to sample input signals to the application logic and to control output signals from the application logic. The register stores an operational mode parameter for the BIST. The test access port provides external access to the boundary scan chain and the register, and is configured to control a clock signal to the BIST unit in accordance with the BIST operational mode parameter.Type: GrantFiled: March 31, 2000Date of Patent: June 3, 2003Assignee: LSI Logic CorporationInventors: Farzin Karimi, Thompson W. Crosby, V. Swamy Irrinki
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Patent number: 6574590Abstract: A procedure and processor are disclosed for avoiding lengthy delays in debug procedures during access by a memory mapped peripheral device. The processor includes in-circuit emulation means comprising one or more scan chains or serially connected registers for access by an external host computer system. The procedure comprises: a) the host computer system carrying out a debug procedure via said scan chains, and selectively interrupting such debug procedure for access to a peripheral memory mapped device; b) the host computer system writing into an area or memory of the processor a program for reading and/or writing data at a specified memory location; and c) the host computer system causing said processor to run said program, and then to return to said debug procedure.Type: GrantFiled: December 1, 1999Date of Patent: June 3, 2003Assignee: LSI Logic CorporationInventors: Simon Martin Kershaw, Graham Kirsch, Brendon Slade
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Patent number: 6573523Abstract: A system for identifying a substrate based on indicia formed in a surface of the substrate. The method includes forming the indicia having edge features and substantially flat features. The indicia is illuminated with incident illumination from an illumination source while moving the illumination source relative to the substrate, thereby scanning the incident illumination over the indicia. Reflected illumination having a first intensity level is received from the edge features of the indicia, and reflected illumination having a second intensity level is received from the substantially flat features of the indicia. The reflected illumination is detected to produce at least one output signal having a first amplitude level corresponding to the first intensity level and a second amplitude level corresponding to the second intensity level. The output signal is processed based at least in part upon the first and second intensity levels to form at least one image portion of the indicia.Type: GrantFiled: December 12, 2001Date of Patent: June 3, 2003Assignee: LSI Logic CorporationInventor: Thomas F. Long
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Patent number: 6574525Abstract: A reaction chamber of the type used to create a reaction at a surface of a substrate disposed within the reaction chamber. A transmitter produces a transmitted beam having first characteristics, where the transmitter is disposed outside of the reaction chamber. A view port is disposed in a boundary wall of the reaction chamber, where the view port is formed of a material that is transparent at least in part to the transmitted beam. The transmitter, the view port, and the substrate are aligned such that the transmitted beam is directable to and reflected at least in part from the surface of the substrate, thereby producing a reflected beam having second characteristics. A receiver is disposed outside of the reaction chamber, and the receiver receives the reflected beam from the surface of the substrate through the view port. The receiver also senses the second characteristics of the reflected beam and reports the second characteristics.Type: GrantFiled: March 25, 2002Date of Patent: June 3, 2003Assignee: LSI Logic CorporationInventors: Steven E. Reder, Hemanshu D. Bhatt
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Patent number: 6573113Abstract: An integrated circuit topography is provided which includes at least two rows of bonding pads. Each row of bonding pads is attributed a row of probe pads. One row of probe pads is contained within the scribe area and suffices as a sacrificial row of probe pads. The other row of probe pads is placed toward the interior of the integrated circuit. The rows of bonding pads and probe pads extend along parallel axis around all four sides of the integrated circuit. Every other bonding pad within one row of bonding pads is connected to every other probe pad within the scribe area, and every other bonding pad within the other rows of bonding pads is connected to every probe pad within the row of probe pads interior to the integrated circuit. This allows a fan-out configuration of the bonding pads to probe pads for purposes of probing electrical performance of the integrated circuit without having to use selected ones of the bonding pads.Type: GrantFiled: September 4, 2001Date of Patent: June 3, 2003Assignee: LSI Logic CorporationInventors: Qwai H. Low, William T. Bright, II, Ramaswamy Ranganathan
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Publication number: 20030099338Abstract: A method and apparatus for maintaining a fax transmission over a relay network that includes at least first and second portions and a relay portion that couples the first and second portions to each other. At a second gateway connecting the second portion to the relay portion, data frames received over the relay portion are processed to determine if they are corrupted, and signals are sent back to a first gateway to resend any data frames that are corrupted. The first gateway connects the first portion to the relay portion.Type: ApplicationFiled: February 9, 2001Publication date: May 29, 2003Applicant: LSI Logic CorporationInventors: JianWei Bei, Mehrdad Abrishami, Abhinandan Dodamani, Richard Meyers
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Patent number: 6570626Abstract: A video system is disclosed that processes OSD images and displays the OSD images on a display. At least some of the OSD images are represented by data sets that do not include a color palette. Each OSD data set includes a header comprising multiple bits of status and control information. One of the control bits indicates whether the OSD data set includes a color palette. Preferably that control bit is set to indicate no color palette in present and cleared to indicate the inclusion of a color palette in the OSD data set. By not including a color palette in an OSD data set, the corresponding OSD image can be represented with a smaller data set and can be transferred across a bus with a smaller bandwidth. If the control bit is set, indicating the absence of a color palette in the OSD data set, a color palette included in another OSD data set is used instead to draw the desired OSD image.Type: GrantFiled: June 26, 1998Date of Patent: May 27, 2003Assignee: LSI Logic CorporationInventors: Todd C. Mendenhall, Katsuhiro Muromachi
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Patent number: 6570990Abstract: A system controls reproduction of a video transmission between a transmitter and a receiver. The system includes an encryptor with an offset generator adapted to receive the encrypted frame key and to generate a sequence, of pseudo-random values for the color component; and an adder coupled to the offset generator and to the color component signal for providing an encoded color component signal. The system also includes a decryptor with a decryptor offset generator adapted to receive the encrypted frame key and to generate a decryptor pseudo-random value for the color component; and a subtractor coupled to the offset generator and to the color component signal for subtracting the offset signal from the color component signal.Type: GrantFiled: November 13, 1998Date of Patent: May 27, 2003Assignee: LSI Logic CorporationInventors: Leslie Kohn, David A. Barr, Didier Le Gall
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Patent number: 6569739Abstract: Embodiments of the invention include a method for blanket ion implanting a semiconductor substrate surface to induce uniform damage over desired portions of the surface thereby reducing non-uniform etch effects caused by the varying etch rates of surface materials and conditions during surface cleaning. The invention includes providing a semiconductor substrate having gate oxide regions and a sacrificial oxide layer of a predetermined thickness formed thereon. The surface of the substrate is pattern masked to reveal openings in the gate oxide regions and ion implanted through the openings in the pattern mask to form gate oxide regions. The pattern mask is removed from the substrate and a blanket implantation of the sacrificial oxide layer is performed. The substrate is then cleaned to remove the sacrificial oxide layer leaving the substrate in readiness for further processing.Type: GrantFiled: August 8, 2002Date of Patent: May 27, 2003Assignee: LSI Logic CorporationInventors: Arvind Kamath, Venkatesh P. Gopinath
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Patent number: 6570853Abstract: A method and apparatus in a source node for transmitting data to a target node. Responsive to a request to transmit data to the target node, a determination is made as to whether a selected period of time has passed without data transmitted from the source node being received by the target node. Responsive to detecting the selected period of time has passed without data transmitted from the source node being received by the target node, a determination is made as to whether space is available in the target node to receive the data. Responsive to a determination that space is unavailable in the target node, generating an indication that the target node is blocked is generated.Type: GrantFiled: October 4, 2000Date of Patent: May 27, 2003Assignee: LSI Logic CorporationInventors: Stephen M. Johnson, Timothy E. Hoglund, David M. Weber, John M. Adams, Mark A. Reber
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Patent number: 6569751Abstract: A method of forming a metallization interconnection system within a via. A first liner layer of titanium is deposited to a first thickness in the following manner. A substrate containing the via is placed within an ion metal plasma deposition chamber that contains a titanium target. The ion metal plasma deposition chamber is evacuated to a first base pressure. A first flow of argon is introduced to the ion metal plasma deposition chamber at a first deposition pressure. The substrate is biased to a first voltage. A plasma within the ion metal plasma deposition chamber is energized at a first power for a first length of time. A second liner layer of TixNy is deposited to a second thickness on top of the first liner layer of titanium in the following manner. A first flow of nitrogen and a second flow of argon are introduced to the ion metal plasma deposition chamber at a second deposition pressure. The substrate is biased to a second voltage.Type: GrantFiled: July 17, 2000Date of Patent: May 27, 2003Assignee: LSI Logic CorporationInventors: Prabhakar P. Tripathi, Zhihai Wang, Weidan Li
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Publication number: 20030095481Abstract: In the context of a DVD-RAM read-type architecture in which an optical storage medium (20) makes use of an eccentric wobble (164) to attain synchronisation information, a wobble PLL (179) is held in an acquired state whenever header regions (32, 33) embossed at regular intervals across the optical storage medium (20) are detected. More specifically, large dc variations associated with voltage spikes caused by header regions (32, 33) are scaled (260) relative to a dynamically varying amplitude envelope of the extracted wobble signal (164), such as to identify a start location (300) for each header region. The wobble PLL (179) is effectively allowed to free-run and hold state during periods of header, thereby mitigating the likelihood that the wobble PLL will loose lock during the header regions.Type: ApplicationFiled: October 23, 2001Publication date: May 22, 2003Applicant: LSI LOGIC CORPORATIONInventors: Stephen Williams, David I. Boddy, Nicholas A.I. Mihailovits
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Patent number: 6566268Abstract: A method of planarizing a wafer surface of a semiconductor wafer having an elevated portion extending therefrom is described. The method includes the step of positioning a fluid flow surface relative to the wafer surface so that (i) a space is defined between the wafer surface and the fluid flow surface, and (ii) the elevated portion of the semiconductor wafer is positioned in the space. The method also includes the step of advancing a fluid within the space so that the fluid contacts and erodes the elevated portion of the semiconductor wafer. An associated apparatus for planarizing a wafer surface of a semiconductor wafer having an elevated portion extending therefrom is also described.Type: GrantFiled: July 25, 2002Date of Patent: May 20, 2003Assignee: LSI Logic CorporationInventor: John Gregory
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Patent number: 6566171Abstract: Fuses, and optionally metal pads, are formed over a layer of low k dielectric material structure having first openings lined with conductive barrier material and filled to form metal interconnects in the upper surface of the low k dielectric material. A dielectric layer is formed over the low k dielectric material and over the metal interconnects, and patterned to form second openings therein communicating with the metal interconnects. A conductive barrier layer is formed over this dielectric layer in contact with the metal interconnects, and patterned to form fuse portions between some of the metal interconnects, and a liner over one or more of the metal interconnects. A dielectric layer is then formed over the patterned conductive barrier layer to form a window above each fuse, and patterned to form openings over at least some of the conductive barrier liners filled with metal to form metal pads.Type: GrantFiled: June 12, 2001Date of Patent: May 20, 2003Assignee: LSI Logic CorporationInventors: Yauh-Ching Liu, Ruggero Castagnetti, Ramnath Venkatraman
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Patent number: 6567899Abstract: A transportable memory apparatus including cache memory and a backup battery is provided that is capable of being removed from a first computer system and installed within a second computer system. The transportable memory apparatus includes a control bus that provides appropriate signals such that the presence and status of the transportable memory apparatus can be detected in order to permit the computer system that includes the transportable memory apparatus to be appropriately initialized. As such, methods for initializing a computer system that may include a transportable memory apparatus are also provided.Type: GrantFiled: July 1, 2002Date of Patent: May 20, 2003Assignee: LSI Logic CorporationInventors: Sukha R. Ghosh, Paresh Chatterjee, Stephen Scott Piper, Marc C. Karasek, Basavaraj Gurupadappa Hallyal
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Patent number: 6566922Abstract: A circuit generally comprising a first circuit and a phase lock loop. The first circuit may be configured to (i) collect a plurality of samples per cycle during a plurality of cycles of an input signal and (ii) calculate a phase offset and a frequency offset for the input signal relative to a clock signal in response to the samples. The phase lock loop may be configured to (i) preset a phase error signal to the phase offset and a frequency error signal to the frequency offset and (ii) generate the clock signal in response to the phase error signal and the frequency error signal.Type: GrantFiled: October 29, 2001Date of Patent: May 20, 2003Assignee: LSI Logic CorporationInventors: David L. Schell, Peter J. Windler