Abstract: A device includes a substrate and a package input terminal. The device includes a driver amplifier mounted to the substrate and configured to receive a radio frequency input signal. A first amplifier is mounted to the substrate. The first amplifier includes a first amplifier input terminal. A second amplifier is mounted to the substrate. The second amplifier includes a second amplifier input terminal. An inter-stage network is connected between the driver amplifier and the first amplifier and between the driver amplifier and the second amplifier. The inter-stage network includes a first capacitor connected between the driver amplifier and the first amplifier input terminal, and an inductor having a first terminal and a second terminal. The first terminal of the inductor is connected to the first capacitor. The inter-stage network includes a second capacitor connected between the second terminal of the inductor and the second amplifier input terminal.

Abstract: A substrate having a die attach area for receiving a semiconductor die includes a recessed area for receiving die attach adhesive. The recessed area prevents die attach adhesive from bleeding into the surrounding area and onto substrate connection sites, where it could compromise a wire bond formed on such a connection site. The recessed area has a zig-zag pattern, which allows for sufficient amounts of adhesive to be used to securely attach the die to the substrate, yet does not enlarge the recessed area such that the package size may be adversely affected.

Abstract: Disclosed is a digital processor comprising an instruction memory having a first input, a second input, a first output, and a second output. A program counter register is in communication with the first input of the instruction memory. The program counter register is configured to store an address of an instruction to be fetched. A data pointer register is in communication with the second input of the instruction memory. The data pointer register is configured to store an address of a data value in the instruction memory. An instruction buffer is in communication with the first output of the instruction memory. The instruction buffer is arranged to receive an instruction according to a value at the program counter register. A data buffer is in communication with the second output of the instruction memory. The data buffer is arranged to receive a data value according to a value at the data pointer register.

Abstract: According to a first aspect of the present disclosure, an electronic device is provided which comprises: a substrate; an integrated circuit; a layer of glue between the substrate and the integrated circuit; a set of driving electrodes coupled to the glue and to the integrated circuit; a receiving electrode coupled to the glue and to the integrated circuit; a counter electrode coupled to the glue and to the substrate; wherein the glue comprises conductive particles which electrically connect the receiving electrode, the counter electrode and at least a part of the set of driving electrodes, such that, if drive currents are provided to said set of driving electrodes, at least a part of the drive currents flows to the receiving electrode through the conductive particles and the counter electrode. According to a second aspect of the present disclosure, a corresponding method of manufacturing an electronic device is conceived.

Abstract: The present disclosure provides embodiments of package devices and methods for making package devices for a semiconductor die. One embodiment includes a die mounting structure having a finished bond pad that includes a copper bond pad and a cobalt-containing layer over a top surface of the copper bond pad, and a wire bond structure that is bonded to a top surface of the cobalt-containing layer of the finished bond pad, where cobalt-containing material of the cobalt-containing layer is located between a bottom surface of the wire bond structure and the top surface of the copper bond pad such that the cobalt-containing material is present under a center portion of the wire bond structure.

Abstract: An on-chip built-in self-test (BIST) circuit (10) uses a controller (16), analog-to-digital converter (ADC) (15), and digital-to-analog converter (DAC) (12) to sense voltage and/or temperature measures at predetermined circuit locations (19), to detect one or more idle states for an analog block during normal operation, to initiate a built-in self-test of the analog block during the idle state(s) by sending input test signals over a first bus (13) to the analog block, and to process analog test signals received over a second bus (14) from the analog block to generate digital built-in self-test results for the analog block so that the performance analyzer can analyze the digital built-in self-test results in combination with any voltage and/or temperature measurements to evaluate selected performance measures for the analog block against one or more performance criteria.

Abstract: Embodiments of methods and systems for automatic power control (APC) in a communications device that communicates via inductive coupling are described. In an embodiment, a method for APC in a communications device that communicates via inductive coupling involves obtaining multiple system parameters, determining an APC configuration of the communications device from the system parameters, and controlling a transmission configuration of the communications device based on the APC configuration. Other embodiments are also described.

Abstract: A software update architecture, system, apparatus, and methodology are provided for performing block-based swapping of OTA software stored as a plurality of compressed blocks in a first, smaller NVM with the system software stored as a plurality of decompressed blocks in a second, larger NVM by using a first decompressor circuit and first scratch memory to sequentially decompress each compressed code block of OTA software for storage in decompressed form as updated system software in the second, larger NVM while using a first compressor circuit and second scratch memory to sequentially compress each decompressed code block of system software for storage in compressed form as backup system software in the first, smaller NVM.

Abstract: A touch sensitive capacitive keypad system (100) is provided with an analog-to-digital converter, a keypad sensing electrode (114) coupled to measure capacitance voltages using a configurable electrode scan rate, and a controller (120) configured to provide scan-rate independent capacitance voltage measurements from the keypad sensing electrode to the analog-to-digital converter when there is a change in the configurable electrode scan rate by repetitively sampling a capacitance voltage measurements (e.g., 524a-f) from the keypad sensing electrode over a plurality of sequential electrode scan cycles and then discarding a predetermined number of the capacitance voltage measurements (e.g., 524a-b) to generate the scan-rate independent capacitance voltage measurements (e.g., 524c-f) that are provided to the analog-to-digital converter.

Abstract: An integrated circuit includes a digital logic circuit having a first transistor and a second transistor, a replica circuit having a first transistor and a second transistor which replicate the first transistor and second transistor of the digital logic circuit, and a storage circuit configured to store a static state indicator. The circuit also includes a comparison circuit configured to compare threshold voltages of the first and second transistor of the replica circuit, and having an output coupled to provide the static state indicator to the storage circuit, and a selection circuit configured to provide the state indicator to an input of the digital logic circuit and an input of the replica circuit during a lower power mode and to provide a run mode signal instead of the state indicator to the input of the digital logic signal and the input of the replica circuit during a high power mode.

Abstract: A method for implementing a non-volatile counter using non-volatile memory is disclosed. In an embodiment, the method involves distributing operations for storing a low word of a counter in non-volatile memory across memory cells in a memory array in the non-volatile memory, and storing additional bits of the counter in the non-volatile memory in memory cells outside of the memory array, wherein the location in the memory array at which the low word is stored is determined for each count based on the upper bits of the counter.

Abstract: A host device includes a first serial peripheral interface (SPI) and a second SPI to communicate with an embedded multimedia card (eMMC) device. The host device has a mode controller that controls the first SPI to toggle between first transmission and first reception modes for command transmission and response reception, respectively. The mode controller controls the second SPI to toggle between second transmission and second reception modes for data transmission and data reception, respectively.

Abstract: Embodiments are provided for a packaged semiconductor device that includes a package substrate that in turn includes an embedded die configured to process a radio frequency (RF) signal; a printed circuit board (PCB) attached to a front side of the package substrate, where the PCB includes a cavity; and an antenna enabling element attached to the front side of the package substrate within the cavity, the antenna enabling element configured to convey the RF signal through the cavity.

Abstract: Embodiments of laterally diffused metal oxide semiconductor (LDMOS) transistors are provided. An LDMOS transistor includes a substrate having a source region, channel region, and a drain region. A first implant is formed to a first depth in the substrate. A gate electrode is formed over the channel region in the substrate between the source region and the drain region. A second implant is formed in the source region of the substrate; the second implant is laterally diffused under the gate electrode a predetermined distance. A third implant is formed to a second depth in the drain region of the substrate; the second depth is less than the first depth.

Abstract: A resistive sensor includes a current input sigma-delta converter that uses a switched offset voltage source to provide scalable gain and more linear operation. The sigma-delta converter includes an integrator, a quantizer, and a decimator. In one embodiment, the resistive sensor and offset voltage source are coupled to provide an input current at a first node. The integrator has a first input terminal coupled to the first node, and an output terminal. The quantizer has a first input terminal coupled to the output terminal of the integrator, a second input terminal for receiving a clock signal, and an output terminal coupled to provide a feedback signal to control the offset voltage source. The decimator has an input terminal coupled to the output terminal of the quantizer, and an output terminal for providing an output signal. The switched offset voltage source provides scalable gain and good linearity.

Abstract: A power supply is disclosed. The power supply includes a first switch and a second switch. The gate of the first switch is coupled to the gate of the second switch. The power supply further includes a cutoff switch coupled between the first switch and an input voltage port. A comparator is included for comparing a voltage at a feedback port with a fixed reference voltage. The comparator opens the cutoff switch when the voltage at the feedback port is lower than the fixed reference voltage.

Abstract: Embodiments of a radio frequency identification (RFID) reader are provided herein, which include an RFID interrogator; a detection surface for a game piece, the detection surface comprising a plurality of reader antennas in a geometric arrangement; and antenna switching circuitry coupled between the RFID interrogator and the plurality of reader antennas; wherein the antenna switching circuitry is configured to consecutively activate each one of the plurality of reader antennas for at least a detection time window, and wherein the RFID interrogator is configured to: for each reader antenna, detect whether a response signal is received by the reader antenna during the detection time window, and determine a geometric orientation of the game piece based on a subset of reader antennas that received the response signal.

Abstract: A wireless charging transmitter has a phase-shift controlled inverter, a capacitor, a transmitter coil, and a control circuit. The phase-shift controlled inverter has an input for receiving a phase-shift signal, and first and second output terminals for providing an inverter output voltage. The capacitor has a first terminal coupled to the first output terminal of the phase-shift controlled inverter, and a second terminal. The transmitter coil having a first terminal coupled to the second terminal of the capacitor, and a second terminal coupled to the second terminal of the phase-shift controlled inverter. The control circuit has an input coupled to the second terminal of the capacitor for sampling a capacitor voltage of the capacitor, and an output for providing the phase-shift signal corrected for the phase error. The control circuit determines the phase error of the capacitor voltage relative to a phase of an inverter output voltage to ensure the wireless charging transmitter operates in resonance.

Abstract: A heat transportation mechanism that is thermally conductive, but not electrically conductive, is provided so as to permit transportation of heat generated by a semiconductor device die to the exterior of a semiconductor device package. Embodiments can use a thermally conductive polymer structure, added to the package mold compound, to transport heat through the mold compound. The thermally conductive polymer structure can be fixed to the semiconductor device die prior to molding or can be included in an overmolding compound slug prior to performing the overmolding process. Flexibility of placement of the thermally conductive polymer structure is provided by using dielectric compounds.

Abstract: A key generator including a low-power key adjust circuit, and a high-power key adjust circuit. The low-power key adjust circuit including a storage location to store an original key, a shifter to shift the original key by a number of steps to shift to create a first key, and an output to provide the first key. The high-power key adjust circuit including an input coupled to the output of the low-power key adjust circuit to receive the first key, a scrambler to scramble the first key to create a scrambled key, and select circuitry to select either the first key or the scrambled key to output from the high-power key adjust circuit based on a bit in a configuration register.