Abstract: Performance of a semiconductor device is improved without increasing an area size of a semiconductor chip. For example, a source electrode of a power transistor and an upper electrode of a capacitor element have an overlapping portion. In other word, the upper electrode of the capacitor element is formed over the source electrode of the power transistor through a capacitor insulating film. That is, the power transistor and the capacitor element are arranged in a laminated manner in a thickness direction of the semiconductor chip. As a result, it becomes possible to add a capacitor element to be electrically coupled to the power transistor while suppressing an increase in planar size of the semiconductor chip.

Abstract: In a semiconductor device, a width of a second epitaxial layer is greater than a width of a first epitaxial layer, and a thickness of an end portion of the second epitaxial layer, which is in contact with an element isolation portion, is smaller than a thickness of an end portion of the first epitaxial layer, which is in contact with the element isolation portion, and a second shortest distance between the element isolation portion and a second plug is greater than a first shortest distance between the element isolation portion and a first plug.

Abstract: Provided herein are various systems, methods and architectures for enabling a microcontroller manufacturer to provide certain modification and configuration functionality to product vendors, while still maintaining the level of control needed to ensure that a product vendor does not inadvertently (or otherwise) create code that causes the microcontroller to not work properly. In one embodiment, this functionality can be performed through the steps of displaying a set of microcontroller properties that are available for configuration, receiving user information regarding a first value corresponding to a first microcontroller property, determining whether the user information results in a valid microcontroller configuration, and in response to determining that the user information results in a valid microcontroller configuration, generating compiled code for the microcontroller.

Abstract: A semiconductor device including an optical waveguide and a p-type semiconductor portion is configured as follows. The optical waveguide includes: a first semiconductor layer formed on an insulating layer; an insulating layer formed on the first semiconductor layer; and a second semiconductor layer formed on the insulating layer. The p-type semiconductor portion includes the first semiconductor layer. The film thickness of the p-type semiconductor portion is smaller than that of the optical waveguide. By forming the insulating layer between the first semiconductor layer and the second semiconductor layer, control of the film thicknesses of the optical waveguide and the p-type semiconductor portion is facilitated. Specifically, when the unnecessary second semiconductor layer is removed by etching in a step of forming the p-type semiconductor portion, the insulating layer which is the lower layer functions as an etching stopper, and the film thickness of the p-type semiconductor portion can be easily adjusted.

Abstract: Performance of a semiconductor device is enhanced. A semiconductor device is a semiconductor device obtained by sealing in a sealing portion first, second, and third semiconductor chips each incorporating a power transistor for high-side switch, fourth, fifth, and sixth semiconductor chips each incorporating a power transistor for low-side switch, and a semiconductor chip incorporating a control circuit controlling these chips. The source pads of the fourth, fifth, and sixth semiconductor chips are electrically coupled to a plurality of leads LD9 and a plurality of leads LD10 via a metal plate. As viewed in a plane, the leads LD9 intersect with a side MRd4 of the sealing portion and the leads LD10 intersect with a side MRd2 of the sealing portion.

Abstract: A multi-thread processor includes a plurality of hardware threads that generates a plurality of mutually independent instruction streams, respectively and a scheduler that schedules the plurality of hardware threads.

Abstract: Provided is a cryptographic communication system including a first semiconductor device and a second semiconductor device. The first semiconductor device includes a common key generation unit that generates a common key CK(a) by using a unique code UC(a) and correction data CD(a), and an encryption unit that encrypts the common key CK(a) generated in the common key generation unit by using a public key PK(b) of the second semiconductor device. The second semiconductor device includes a secret key generation unit that generates a secret key SK(b) by using a unique code UC(b) and correction data CD(b), and a decryption unit that decrypts the common key CK(a) encrypted in the encryption unit by using the secret key SK(b).

Abstract: A recessed portion is formed in a top surface of an isolation insulation film filling an isolation trench between a p+ source region and a p+ drain region. A p? drift region is located below the isolation trench and connected to the p+ drain region. A gate electrode fills the recessed portion. An n-type impurity region is located below the p? drift region and directly below the recessed portion.

Abstract: A semiconductor device includes: a first conductivity type semiconductor substrate made of silicon carbide; a second conductivity type body region in a device region of the semiconductor substrate; a first conductivity type source region formed in the body region; and a gate electrode formed on the body region through gate insulating films. The semiconductor device further includes, in a termination region of the semiconductor substrate, second conductivity type RESURF layers, and an edge termination region formed in the RESURF layers. Then, the RESURF layers and a front surface of the semiconductor substrate adjacent to the RESURF layers are covered by an oxidation-resistant insulating film.

Abstract: A semiconductor device, a signal processing system, and a signal processing method are provided that regulate a change of characteristics in the event of aged deterioration. The semiconductor device of the present invention includes a reference voltage generation circuit that generates a reference voltage, an analog signal processing circuit that outputs a first processing signal according to the reference voltage, a test signal output section that outputs, as a test signal, a second processing signal having a lower voltage than the first processing signal, an input section that receives a regulation signal for the outputted test signal, and a regulator circuit that regulates the output of the analog signal processing circuit in response to the regulation signal.

Abstract: Characteristics of a semiconductor device using a nitride semiconductor are improved. A semiconductor device of the present invention includes a buffer layer, a channel layer, a barrier layer, a mesa-type 2DEG dissolving layer, a source electrode, a drain electrode, a gate insulating film formed on the mesa-type 2DEG dissolving layer, and an overlying gate electrode. The gate insulating film of the semiconductor device includes a sputtered film formed on the mesa-type 2DEG dissolving layer and a CVD film formed on the sputtered film. The sputtered film is formed in a non-oxidizing atmosphere by a sputtering process using a target including an insulator. This makes it possible to reduce positive charge amount at a MOS interface and in gate insulating film and increase a threshold voltage, and thus improve normally-off characteristics.

Abstract: A semiconductor apparatus includes an operation oscillator, a reference oscillator, a first operation switch connected in series with the operation oscillator between a power supply potential VDD and a ground potential GND, a first reference switch connected in series with the reference oscillator between the power supply potential VDD and the ground potential GND, a second reference switch connected in parallel with the reference oscillator between the power supply potential VDD and the ground potential GND, an operation counter configured to count the number of output pulses from the operation oscillator in a measurement period, and a reference counter configured to count the number of output pulses from the reference oscillator in the measurement period.

Abstract: To provide an electronic device capable of improving a signal quality, the electronic device includes a semiconductor memory device, a semiconductor device configured to access data stored in the semiconductor memory device, and a wiring substrate on which the semiconductor memory device and the semiconductor device are mounted. The wiring substrate includes first and second data wirings electrically connecting the semiconductor device with each first and second data terminal of the semiconductor memory device through first and second wiring layers. The first wiring layer is a wiring layer arranged closer to the semiconductor device than the second wiring layer, and the first data terminal is located farther from the semiconductor device than the second data terminal.

Abstract: Disclosed is a semiconductor device capable of performing compression and decompression with increased appropriateness. The semiconductor device includes a computing module and a memory control module. The computing module includes a computing unit and a compression circuit. The computing unit performs arithmetic processing. The compression circuit compresses data indicative of the result of arithmetic processing. The memory control module includes an access circuit and a decompression circuit. The access circuit writes compressed data into a memory and reads written data from the memory. The decompression circuit decompresses data read from the memory and outputs the decompressed data to the computing module.

Abstract: A semiconductor device includes a latch circuit receiving a first signal, generated in synchronization with a clock signal, from a pulse generation circuit, and generating a second signal; a first delay circuit receiving the second signal from the latch circuit, and generating a third signal by delaying the second signal; a second delay circuit receiving the third signal from the first delay circuit, and generating a fourth signal by delaying the third signal; and a logic circuit receiving the second and fourth signals from the latch and second delay circuits, respectively, and generating a word line control signal based on one of the second signal and the fourth signal. The latch circuit generates the second signal of a first level based on the first signal, and generates the second signal of a second level, which is different from the first level, based on the third signal.

Abstract: A QFP has a die pad on which a semiconductor chip is mounted, a plurality of inner parts disposed around the die pad, a plurality of outer parts respectively connected with the plurality of inner parts, a plurality of wires electrically connect the bonding pads of the semiconductor chip and the plurality of inner parts, and a sealing body that seals the semiconductor chip. Moreover, the thickness of the semiconductor chip is larger than a thickness from a lower surface of the die pad to a lower surface of the sealing body, and a distance from the lower surface of the sealing body to a tip portion of each of the plurality of outer parts is larger than a thickness of the sealing body from a main surface of the semiconductor chip to an upper surface of the sealing body.

Abstract: Occurrence of short-channel characteristics and parasitic capacitance of a MOSFET on a SOI substrate is prevented. A sidewall having a stacked structure obtained by sequentially stacking a silicon oxide film and a nitride film is formed on a side wall of a gate electrode on the SOI substrate. Subsequently, after an epitaxial layer is formed beside the gate electrode, and then, the nitride film is removed. Then, an impurity is implanted into an upper surface of the semiconductor substrate with using the gate electrode and the epitaxial layer as a mask, so that a halo region is formed in only a region of the upper surface of the semiconductor substrate which is right below a vicinity of both ends of the gate electrode.

Abstract: To provide a technique capable of reducing the chip size of a semiconductor chip and particularly, a technique capable of reducing the chip size of a semiconductor chip in the form of a rectangle that constitutes an LCD driver by devising a layout arrangement in a short-side direction. In a semiconductor chip that constitutes an LCD driver, input protection circuits are arranged in a lower layer of part of a plurality of input bump electrodes and on the other hand, in a lower layer of the other part of the input bump electrodes, the input protection circuits are not arranged but SRAMs (internal circuits) are arranged.

Abstract: To provide a semiconductor device including a low-loss optical waveguide. The optical waveguide included in the semiconductor device has a core layer covered with first and second clad layers having respectively different refractive indices. A portion of the core layer is covered at a first ratio, that is, a ratio of the first clad layer to the second clad layer and at the same time, a second ratio, that is, a ratio of the second clad layer to the first clad layer. At this time, the first ratio and the second ratio are each a finite value more than 0.

Abstract: A semiconductor memory having a memory cell structure capable of reducing soft error without complicating a circuit configuration. Specifically, an inverter (I1) consists of a NMOS transistor (N1) and a PMOS transistor (P1), and an inverter (I2) consists of a NMOS transistor (N2) and a PMOS transistor (P2). The inverters (I1, I2) are subjected to cross section. The NMOS transistor (N1) is formed within a P well region (PW0), and the NMOS transistor (N2) is formed within a P well region (PW1). The P well regions (PW0, PW1) are oppositely disposed with an N well region (NW) interposed therebetween.