Abstract: A semiconductor device includes: a first power source line for supplying a first voltage; a second power source line for supplying a second voltage; a memory circuit coupled with the first and second power source lines; a first switch which electrically coupling the first power source line with the second power source line and electrically decoupling the first power source line from the second power source line, in response to a control signal; a second switch which electrically coupling the first power source line with the second power source line and electrically decoupling the first power source line from the second power source line, in response to the control signal, wherein a memory circuit includes a memory cell array and a peripheral circuit, wherein a memory cell array includes a plurality of memory cells, the memory cells coupled with the second power source line.

Abstract: A stack memory includes a base chip, a memory chip stacked over the base chip, and a via 42 provided between the base chip and the memory chip. The base chip has an external interface circuit and a late write control circuit. The external interface circuit externally receives/transmits write data and read data. The late write control circuit has at least a register storing write data externally supplied through the external interface circuit. The memory chip has a memory cell array and a late write control circuit having at least a register storing write data supplied from the register through the via.

Abstract: A semiconductor device according to one embodiment includes a unique ID generation circuit configured to generate a unique ID using a memory array including a plurality of complementary cells, each of the complementary cells includes first and second memory cells MC1 and MC2. The unique ID generation circuit uses, when data in the complementary cell read out in a first state in which an initial threshold voltage of the first memory cell MC1 has been virtually offset and data in the complementary cell read out in a second state in which an initial threshold voltage of the second memory cell MC2 has been virtually offset coincide with each other, the data in the complementary cell as the unique ID.

Abstract: There is provided a semiconductor device that can follow a fast voltage change such as a large voltage drop occurring at the time of rapid load fluctuation. The semiconductor device includes a voltage sensor which monitors a power supply voltage at a sampling speed higher than the assumed frequency of power supply voltage fluctuation and outputs a voltage code value, a voltage drop determination circuit which determines, from the voltage code value, that a voltage drop causing a malfunction of a system occurs, and outputs a clock stop signal, and a clock control circuit which controls clock stop, restart, and frequency change.

Abstract: A driver IC includes a ring-shaped termination area, and a first area and a second area that are respectively arranged outside and inside the termination area on a layout. A sense MOS that is arranged between a floating terminal and a first sense node and is driven at a power supply voltage is formed in the termination area. A fault detection circuit that detects presence of a fault when a voltage of the first sense node is higher than a decision voltage that has been determined in advance in a period of time that a low side driver is driving a low side transistor into an ON state is formed in the first area.

Abstract: In an element isolation region defining an element formation region, there is formed an element isolation unit including an element isolation unit and the other element isolation unit. The other element isolation unit is arranged in a direction intersecting a direction in which the element isolation unit extends from the element isolation unit. The element isolation unit includes a sidewall oxide film formed in a trench, a titanium film, a titanium nitride film, and a tungsten film. The tungsten film is formed to cover the bottom surface of a trench in the element isolation unit and to close an opening end of a trench in the other element isolation unit. A plug is formed in contact with the tungsten film of the element isolation unit.

Abstract: A semiconductor apparatus, includes a common mode detector circuit that receives alternating current (AC) signals in a common mode.

Abstract: A control method of a semiconductor device includes inspecting an electrical property of a current detection circuit in the first semiconductor chip, writing information on a correction equation obtained on the basis of an inspection result in a memory circuit of the second semiconductor chip, and correcting, with the second semiconductor chip, a detection result obtained by the current detection circuit on the basis of the information on the correction equation.

Abstract: In order to provide a semiconductor device with high reliability while manufacturing cost is being suppressed, dry etching for an insulating film is performed by using mixed gas containing at least CF4 gas and C3H2F4 gas as its components.

Abstract: A microcomputer includes a central processing unit (CPU) and a data transfer controller (DTC). The data transfer controller (DTC) reads out data transfer information including transfer mode information from a storage device (RAM) or the like. The data transfer controller (DTC) analyzes the transfer mode information to change at least one of a transfer source address, a transfer destination address, the number of transfer operations, and data transfer information that is used next.

Abstract: The present invention provides a semiconductor device that can reduce effects of noise without complicating processes or increasing chip area. The semiconductor device according to an aspect of the present invention includes a semiconductor substrate, a drain region, a drift region, a base region, a source region, a gate electrode, an interlayer insulating film, a conductive layer electrically coupled to the drain region, a wiring line, and a contact plug electrically coupled to the source region and the wiring line. The interlayer insulating film has an intermediate interlayer insulating film. The intermediate interlayer insulating film is arranged between the conductive layer and the contact plug. The intermediate interlayer insulating film is a thermal oxide film of a material that forms the conductive layer.

Abstract: The transmitter circuit according to one embodiment includes a pulse generating circuit generating a pulse signal based on edges of input data, a first output driver outputting, based on the pulse signal, a first output pulse signal according to one of the edges to a first end of an external insulating coupling element, a second output driver outputting, based on the pulse signal, a second output pulse signal according to other one of the edges to a second end of the insulating coupling element, and an output stop circuit stopping the first and second output pulse signals from being output for a prescribed period from when a power supply voltage is turned on.

Abstract: A semiconductor device includes a semiconductor chip, a lead frame and one bonding wire and the other bonding wire which couple together the semiconductor chip and the lead frame. The semiconductor chip includes one pad which is coupled to one bonding wire and to which an output signal which has been generated in the semiconductor chip is supplied, the other pad which is coupled to the other bonding wire and to which a feedback signal is supplied from the lead frame and a fault detection circuit which compares the output signal which is supplied to one pad with the feedback signal which is supplied to the other pad.

Abstract: A semiconductor device enabling expansion of a noise margin. For example, in a memory area in which each memory cell MC is coupled to a word line WLA for a first port and a word line WLB for a second port, and a plurality of memory cells MC are disposed in a matrix shape, each word line is disposed in the order of WLA0, WLB0, WLB1, WLA1, WLA2. Further, a pitch d2 between WLA-WLA and between WLB-WLB is made smaller than a pitch d1 between WLA-WLB. As such, the word lines of an identical port are disposed at the pitch d2 on one of both sides of a certain word line and the word lines of different ports are disposed at the pitch d1 on the other.

Abstract: In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

Abstract: Making effective use of an image encoder and an image decoder for processing a color image of a general-purpose standard bit depth, an image transmission device capable of transmitting/receiving a monochrome image of a higher bit depth is configured. An image transmission device includes an image encoder to encode a high bit-depth monochrome image and output encoded data and an image decoder to generate, by decoding the encoded data received via a transmission path, a high bit-depth monochrome image. The image encoder decomposes the input high bit-depth image data into plural bit planes corresponding to color image data of a standard bit depth and encodes the standard bit-depth color image data. The image decoder decodes the color image data of the standard bit depth and synthesizes, from the decoded standard bit-depth color image data, a high bit-depth monochrome image.

Abstract: A semiconductor integrated circuit is described. A transmitter-receiver transmits and receives data to and from outside by a first external terminal and transmits a first control signal by a second external terminal. When another data is transmitted after the data is transmitted and when a data transmission interval from a time when the data is transmitted to a time when the another data is transmitted is equal to or smaller than a first threshold, the transmitter-receiver continuously outputs, from the first external terminal, a potential level of about 1/2 of a potential level obtained by adding a first potential level and a second potential level, during the data transmission interval, and changes the second potential level of the first control signal to the first potential level when the data transmission interval exceeds the first threshold.

Abstract: The semiconductor device including: two fins having rectangular parallelepiped shapes arranged in parallel in X-direction; and a gate electrode arranged thereon via a gate insulating film and extending in Y-direction is configured as follows. First, a drain plug is provided over a drain region located on one side of the gate electrode and extending in Y-direction. Then, two source plugs are provided over a source region located on the other side of the gate electrode and extending in Y-direction. Also, the drain plug is arranged in a displaced manner so that its position in Y-direction may not overlap with the two source plugs. According to such a configuration, the gate-drain capacitance can be made smaller than the gate-source capacitance and a Miller effect-based circuit delay can be suppressed. Further, as compared with capacitance on the drain side, capacitance on the source side increases, thereby improving stability of circuit operation.

Abstract: The speed of pen position detection is improved without increasing the circuit area and the current consumption. A sampling circuit samples a signal and outputs sampling data. A arithmetic circuit calculates a real part and an imaginary part of the sampling data. The arithmetic circuit classifies the real part of the sampling data into one of a plurality of groups and classifies the imaginary part of the sampling data into one of the groups according to an order of output of the sampling data from the sampling circuit. Then, the arithmetic circuit adds together real parts of sampling data belonging to a group and adds together imaginary parts of sampling data belonging to a group for each of the groups, and calculates amplitude and phase of the signal by using an addition result of the real parts and an addition result of the imaginary parts of each of the groups.

Abstract: The present invention provides an optical semiconductor device in which damage of a lens when being mounted and mounting displacement due to suction failures of a chip can be suppressed. An optical semiconductor device according to an embodiment includes: a semiconductor substrate having a first surface and a second surface facing the first surface; an electrode formed over the first surface of the semiconductor substrate; an optical element that is electrically coupled to the electrode and is formed in the semiconductor substrate; and a lens arranged on the second surface side of the optical element. A concave part is formed in the second surface of the semiconductor substrate, and the lens is arranged at the bottom of the concave part. A top part on the second surface side of the lens is located on the first surface side relative to the second surface located around the concave part.