Abstract: An optical driving device and an optical communication system are provided which can improve signal quality of laser light that uses a PAM method. A laser driver drives a semiconductor laser by using an N-level (N is an integer of 3 or more) PAM signal. A clock control circuit determines a driving timing of the laser driver. In a case where N=4, for example, the clock control circuit determines a driving timing in association with a transition of the PAM signal from a fourth level to a first level to be earlier than a driving timing in association with a transition in an opposite direction by a first time, assuming that levels are the first level, . . . , and the fourth level in an order from a level at which light intensity is minimum.

Abstract: A semiconductor device includes a MOS transistor which is coupled between two terminals and discharges current which flows caused by generation of static electricity and a diode which is coupled between a back gate of the MOS transistor and one of the terminal and has a polarity which is reversed to the polarity of a parasitic diode which is formed between the back gate and a source of the MOS transistor.

Abstract: According to an embodiment, a semiconductor device includes a pre-charge transistor configured to supply a pre-charge voltage to a bit line, a sense amplifier configured to change a logic level of an output signal according to a result of a comparison between a drawing current of a storage element and a reference current, a clamp transistor disposed between the bit line BL and the sense amplifier, and a clamp voltage output transistor, in which a gate of the clamp voltage output transistor is connected to a gate of the clamp transistor, a source of the clamp voltage output transistor is connected to a back gate thereof, the pre-charge voltage is supplied to the source of the clamp voltage output transistor, a drain of the clamp voltage output transistor is connected to the gate thereof, and a ground voltage is supplied to a back gate of the clamp transistor.

Abstract: Provided is a solid-state imaging device capable of increasing the speed of an A/D converter. The solid-state imaging device includes a successive approximation A/D converter that performs A/D conversion on an analog pixel signal. The successive approximation A/D converter includes a D/A converter, a comparator, and a successive approximation register. The D/A converter converts a digital reference signal to an analog reference signal. The successive approximation register operates based on the result of comparison by the comparator to generate the digital reference signal in such a manner that the analog reference signal approximates the analog pixel signal. The D/A converter includes a split capacitor, first capacitors, second capacitors, a switch array, a third capacitor, and a multiplexer. The first capacitors each have a first electrode coupled to the output node. The second capacitors are coupled to a second electrode of the split capacitor.

Abstract: To improve reliability of a semiconductor device, a control transistor and a memory transistor formed in a memory cell region are configured to have a double-gate structure, and a transistor formed in a peripheral circuit region is configured to have a triple-gate structure. For example, in the memory transistor, a gate insulating film formed by an ONO film is provided between a memory gate electrode and sidewalls of a fin, and an insulating film (a stacked film of a multilayer film of an insulating film/an oxide film and the ONO film) thicker than the ONO film is provided between the memory gate electrode and a top surface of the fin. This configuration can reduce concentration of an electric field onto a tip of the fin, so that deterioration of reliability of the ONO film can be prevented.

Abstract: An electronics device includes a power semiconductor device including a temperature detection diode, a first semiconductor integrated circuit device including a detection circuit for detecting VF from the temperature detection diode and a second semiconductor integrated circuit device. The second semiconductor integrated circuit device includes, an outside air temperature acquisition unit which acquires outside air temperature information, a storage which stores temperature characteristic data of the temperature detection diode and a first value based on a signal from the detection circuit at a first temperature and a temperature arithmetic processing unit which calculates a temperature of the power semiconductor device from a third value based on a signal from the detection circuit, the temperature characteristic data, the first temperature acquired by the outside air temperature acquisition unit and the first value.

Abstract: In a data processing device including two sets of circuit pairs which are respectively duplicated in two clock domains which are asynchronous to each other, an asynchronous transfer circuit that transfers a payload signal is provided between the two sets of circuit pairs. The asynchronous transfer circuit includes two sets of a pair of bridge circuits which are respectively connected to the two sets of circuit pairs, and asynchronously transfers the payload signal and a control signal indicating a timing at which the payload signal is stable on a reception side. The two sets of a pair of bridge circuits and the payload signals can be duplicated, but the control signal is not duplicated, and the received payload signal is used for timing control to supply an expected same time difference, to the pair of duplicated circuits. This enables asynchronous transfer between circuits duplicated in the asynchronous clock domains.

Abstract: The object is to suppress rupture of the soldering balls when an atmosphere varying from a high temperature to a low temperature is repeated. A semiconductor device includes a semiconductor integrated circuit and a substrate. The semiconductor integrated circuit is, for example, a semiconductor chip. The coefficient of thermal expansion is different between the semiconductor integrated circuit and the substrate. The substrate includes a plurality of soldering balls on the opposite surface to the surface where the semiconductor integrated circuit is mounted. The substrate does not have the soldering balls at a position corresponding to at least one side of the fringe of the semiconductor integrated circuit.

Abstract: A semiconductor chip is mounted on a first surface of an interconnect substrate, and has a multilayer interconnect layer. A first inductor is formed over the multilayer interconnect layer, and a wiring axis direction thereof is directed in a horizontal direction to the interconnect substrate. A second inductor is formed on the multilayer interconnect layer, and a wiring axis direction thereof is directed in the horizontal direction to the interconnect substrate. The second inductor is opposite to the first inductor. A sealing resin seals at least the first surface of the interconnect substrate and the semiconductor chip. A groove is formed over the whole area of a portion that is positioned between the at least first inductor and the second inductor of a boundary surface of the multilayer interconnect layer and the sealing resin.

Abstract: A semiconductor device including a gate structure on a channel region portion of a fin structure, and at least one of an epitaxial source region and an epitaxial drain region on a source region portion and a drain region portion of the fin structure. At least one of the epitaxial source region portion and the epitaxial drain region portion include a first concentration doped portion adjacent to the fin structure, and a second concentration doped portion on the first concentration doped portion. The second concentration portion has a greater dopant concentration than the first concentration doped portion. An extension dopant region extending into the channel portion of the fin structure having an abrupt dopant concentration gradient of n-type or p-type dopants of 7 nm per decade or greater.

Abstract: The semiconductor device includes: a semiconductor substrate; a conductor layer formed over the semiconductor substrate and having an upper surface and a lower surface; a conductive pillar formed on the upper surface of the conductor layer and having an upper surface, a lower surface, and a sidewall; a protection film covering the upper surface of the conductor layer and having an opening which exposes the upper surface and the sidewall of the conductive pillar; and a protection film covering the sidewall of the conductive pillar. Then, in plan view, the opening of the protection film is wider than the upper surface of the conductive pillar and exposes an entire region of an upper surface of the conductive pillar.

Abstract: A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for supporting the tab, leads having respective surfaces exposed to outer edge portions of a back surface of the sealing body, and wires connecting pads formed on the semiconductor chip and the leads. End portions of the suspension leads positioned in an outer periphery portion of the sealing body are unexposed to the back surface of the sealing body, but are covered with the sealing body. Stand-off portions of the suspending leads are not formed in resin molding. When cutting the suspending leads, corner portions of the back surface of the sealing body are supported by a flat portion of a holder portion in a cutting die having an area wider than a cutting allowance of the suspending leads, whereby chipping of the resin is prevented.

Abstract: To downsize a semiconductor device that includes a non-volatile memory and a capacitive element on a semiconductor substrate. In a capacitive element region of a main surface of a semiconductor substrate, fins protruding from the main surface are arranged along the Y direction while extending in the X direction. In the capacitive element region of the main surface of the semiconductor substrate, capacitor electrodes of the capacitive elements are alternately arranged along the X direction while intersecting the fins. The fins are formed in a formation step of other fins which are arranged in a memory cell array of the non-volatile memory of the semiconductor substrate. One capacitor electrode is formed in a formation step of a control gate electrode of the non-volatile memory. Another capacitor electrode is formed in a formation step of a memory gate electrode of the non-volatile memory.

Abstract: A semiconductor device and a circuit arrangement are provided so as to reduce an on resistance. A first power MOS transistor and a second power MOS transistor are formed on the same semiconductor substrate. A first power MOS transistor formed in a first element formation region has a columnless structure including no columns. The second power MOS transistor formed in a second element formation region has an SJ structure including columns.

Abstract: Properties of a semiconductor device are improved. A semiconductor device is configured so as to include a voltage clamp layer, a channel underlayer, a channel layer, and a barrier layer, which are formed in order above a substrate, a trench that extends up to the middle of the channel layer while penetrating through the barrier layer, a gate electrode disposed within the trench with a gate insulating film in between, a source electrode and a drain electrode formed above the barrier layer on both sides of the gate electrode, and a fourth electrode electrically coupled to the voltage clamp layer. The fourth electrode is electrically isolated from the source electrode, and a voltage applied to the fourth electrode is different from a voltage applied to the source electrode. Consequently, threshold control can be performed. For example, a threshold of a MISFET can be increased.

Abstract: In a semiconductor device, a p+ back gate region (PBG) is arranged in a main surface (S1) between first and second portions (P1, P2) of an n+ source region (SR), and arranged on a side closer to an n+ drain region (DR) with respect to the n+ source region (SR). Thereby, a semiconductor device having a high on-state breakdown voltage can be obtained.

Abstract: In order to improve the characteristics of a semiconductor device including: a channel layer and a barrier layer formed above a substrate; and a gate electrode arranged over the barrier layer via a gate insulating film, the semiconductor device is configured as follows. A silicon nitride film is provided over the barrier layer between a source electrode and the gate electrode, and is also provided over the barrier layer between a drain electrode and the gate electrode GE. The surface potential of the barrier layer is reduced by the silicon nitride film, thereby allowing two-dimensional electron gas to be formed. Thus, by selectively forming two-dimensional electron gas only in a region where the silicon nitride film is formed, a normally-off operation can be performed even if a trench gate structure is not adopted.

Abstract: To provide an authentication device capable of performing authentication accurately even when biological information changes with time. An authentication device (1) includes an acquisition unit (2) configured to acquire biological information about a user; an authentication processing unit (4); a storage unit (6) configured to store standard biological information and basic biological information; and a standard biological information updating unit (8). When a difference between the standard biological information and current biological information is less than a first threshold, the authentication processing unit (4) determines that authentication is established. When the authentication is established by the authentication processing unit (4), the standard biological information updating unit (8) updates the standard biological information according to the current biological information for which the authentication is established, based on the basic biological information and a second threshold.

Abstract: Cell power supply lines are arranged for memory cell columns, and adjust impedances or voltage levels of the cell power supply lines according to the voltage levels of bit lines in the corresponding columns, respectively. In the data write operation, the cell power supply line is forced into a floating state according to the bit line potential on a selected column and has the voltage level changed, and a latching capability of a selected memory cell is reduced to write data fast. Even with a low power supply voltage, a static semiconductor memory device that can stably perform write and read of data is implemented.

Abstract: There is a problem that memory protection against access to a shared memory by a sub-arithmetic unit used by a program executed in a main-arithmetic unit cannot be performed in a related-art semiconductor device. According to one embodiment, a semiconductor device includes a sub-arithmetic unit configured to execute a process of a part of a program executed by a main-arithmetic unit, and a shared memory shared by the main-arithmetic unit and the sub-arithmetic unit, in which the sub-arithmetic unit includes a memory protection unit configured to permit or prohibit access to the shared memory based on an access permission range address value provided from the main-arithmetic unit, the access to the shared memory being access that arises from a process executed by the sub-arithmetic unit.