Abstract: A semiconductor structure for inspection includes a semiconductor plate having a first main surface on one side and a second main surface on the other side, an inspection region provided in the first main surface, a main surface electrode having a first hardness and covering the first main surface in the inspection region, and a protective electrode having a second hardness which exceeds the first hardness, covering the main surface electrode in the inspection region, and forming a current path between the second main surface and the protective electrode via the semiconductor plate.

Abstract: This semiconductor device comprises a peripheral region surrounding a cell region, a gate electrode disposed in the peripheral region, and an emitter electrode. The emitter electrode includes a cell electrode portion, a peripheral electrode portion formed at a distance from the cell electrode portion in the peripheral region, and a connecting portion connecting the cell electrode portion and the peripheral electrode portion. The peripheral region includes a well region formed to surround the cell region, an insulating film and an intermediate insulating film that cover the well region, and a gate finger embedded in the insulating films. The connecting portion is formed across the gate finger on the intermediate insulating film. The peripheral electrode portion is electrically connected to the well region.

Abstract: A semiconductor device comprises: a cell region and a peripheral region. The cell region includes an insulation film covering cells, and an electrode portion including a stacked part stacked on the insulation film. The peripheral region includes a first semiconductor layer of a first conductive type, a second semiconductor region of a second conductivity type, a peripheral insulation film, a peripheral electrode portion, a barrier layer, and a passivation film. The barrier layer covers both the peripheral insulation film and the peripheral electrode portion and has a smaller diffusion coefficient than the peripheral insulation film. The passivation film stacks on the barrier layer and has a larger diffusion coefficient than the barrier layer. The peripheral electrode portion includes a projection. A thickness of the projection is less than a thickness of the stacked part.

Abstract: The semiconductor device includes a chip which has a main surface, a first region of a first conductivity type which is formed in a surface layer portion of the main surface, a second region of a second conductivity type which is formed in a surface layer portion of the first region, a trench separation structure which penetrates through the second region, surrounds an interior of the second region, and demarcates an inner region at an inner side of the second region and an outer region at an outer side of the second region in the main surface, a trench gate structure which is formed in the inner region, an inner diode which includes the first region and the second region that are positioned in the inner region, and an outer diode which includes the first region and the second region that are positioned in the outer region.

Abstract: A semiconductor device includes a semiconductor layer made of SiC. A transistor element having an impurity region is formed in a front surface portion of the semiconductor layer. A first contact wiring is formed on a back surface portion of the semiconductor layer, and defines one electrode electrically connected to the transistor element. The first contact wiring has a first wiring layer forming an ohmic contact with the semiconductor layer without a silicide contact and a second wiring layer formed on the first wiring layer and having a resistivity lower than that of the first wiring layer.

Abstract: A semiconductor device includes a semiconductor layer made of a wide bandgap semiconductor and including a gate trench; a gate insulating film formed on the gate trench; and a gate electrode embedded in the gate trench to be opposed to the semiconductor layer through the gate insulating film. The semiconductor layer includes a first conductivity type source region; a second conductivity type body region; a first conductivity type drift region; a second conductivity type first breakdown voltage holding region; a source trench passing through the first conductivity type source region and the second conductivity type body region from the front surface and reaching a drain region; and a second conductivity type second breakdown voltage region selectively formed on an edge portion of the source trench where the sidewall and the bottom wall thereof intersect with each other in a parallel region of the source trench.

Abstract: This semiconductor device comprises an active region and an outer peripheral region. The active region has a first-electroconductivity-type drift layer and a second-electroconductivity-type body layer. The active region has a main cell region having a main cell, a first insulating film covering the main cell, a first electrode part stacked on the first insulating film, a sense cell region having a sense cell, a second insulating film covering the sense cell, and a second electrode part stacked on the second insulating film. Between the main cell region and the sense cell region, there is formed a second-electroconductivity-type well region. The first electrode part and the second electrode part are electrically connected by the well region.

Abstract: A semiconductor device includes a chip having a main surface, a groove structure including a groove formed at the main surface, a source electrode that is embedded in the groove at a bottom side of the groove and that has a projection portion on one side and a projection portion on the other side both of which protrude toward an opening side of the groove, and a gate electrode embedded between a pair of the projection portions at the opening side of the groove, and a source via electrode on one side and a source via electrode on the other side that are connected to the projection portion on the one side and the projection portion on the other side, respectively, on the groove structure.

Abstract: An insulating transformer comprising: an insulation layer; a transformer including a first coil embedded in the insulation layer and a second coil; and a capacitor including a first capacitor electrode and a second capacitor electrode, the first capacitor electrode being arranged between the first coil and the second coil and connected to a first ground terminal, and the second capacitor electrode being arranged between the first capacitor electrode and the second coil and connected to a second ground terminal.

Abstract: A semiconductor device includes an insulating layer, a barrier electrode layer formed on the insulating layer, a Cu electrode layer that includes a metal composed mainly of copper and that is formed on a principal surface of the barrier electrode layer, and an outer-surface insulating film that includes copper oxide, that coats an outer surface of the Cu electrode layer, and that is in contact with the principal surface of the barrier electrode layer.

Abstract: This semiconductor device includes a plurality of sets of gate trenches, a plurality of gate electrodes, a plurality of field plate electrodes, a gate wiring, and a source wiring. The plurality of field plate electrodes each include two terminals connected to the source wiring. An outer peripheral gate wiring part of the gate wiring includes a gate finger that extends along a first direction in a plan view, and an inner gate wiring part includes a gate finger that extends along a second direction in a plan view. A first set of gate trenches extend along the first direction in a plan view and cross the gate finger, and a second set of gate trenches extend in the second direction in a plan view and cross the gate finger.

Abstract: A nitride semiconductor device is a nitride semiconductor device including a substrate that has a first main surface and a second main surface at an opposite side thereto and a nitride epitaxial layer that is formed on the first main surface. The nitride semiconductor device has, in plan view, an active region inside the nitride epitaxial layer in which a two-dimensional electron gas can form and an inactive region inside the nitride epitaxial layer in which the two-dimensional electron gas is not formed and includes trenches that, in at least the inactive region among the active region and the inactive region, are formed in the substrate and are dug in from the second main surface toward the first main surface and embedded metals that are formed inside the trenches.

Abstract: A semiconductor device includes a main transistor which includes a first system transistor generating a first system current and a second system transistor generating a second system current independently of the first system transistor and which generates an output current including the first system current and the second system current, a first system monitor transistor which generates a first system monitor current that corresponds to the first system current, and a second system monitor transistor which generates a second system monitor current that corresponds to the second system current.

Abstract: A power control device includes: an output voltage controller configured to control an output voltage based on a feedback voltage corresponding to the output voltage; and an overvoltage protector configured to continue or stop the operation of the output voltage controller based on a first detection result of whether the output voltage has exceeded an output voltage threshold value and a second detection result of whether the feedback voltage has fallen to or below a feedback voltage threshold value.

Abstract: A lighting control device switches an input voltage to generate an output voltage and supplies a driving current based on the output voltage to a lighting unit. A raw control signal is generated to specify a lighting period and an extinction period alternately, and a corrected control signal is generated by correcting the raw control signal based on the current through the lighting unit. A switching controller performs the switching of the input voltage during the lighting period specified by the corrected control signal and suspends the switching of the input voltage during the extinction period specified by the corrected control signal.

Abstract: An abnormality detection circuit includes: a plurality of voltage dividing circuits; a first selector configured to select and output one of a plurality of outputs of the plurality of voltage dividing circuits; a first comparator configured to compare an output of the first selector with a reference voltage; and a first detector configured to detect an abnormality based on an output of the first comparator, wherein the selection of the first selector is switched in synchronization with a vertical synchronization signal or a horizontal synchronization signal of a liquid crystal display device.

Abstract: A light emitting element drive device includes a driving circuit that supplies a variable drive current to a light emitting unit having one or more light emitting elements so that the light emitting unit can emit light, a drive reference voltage generation circuit that generates a drive reference voltage defining the upper limit value of the drive current and supplies the same to the driving circuit, and a specific external terminal capable of connecting to an external resistor. The drive reference voltage generation circuit operates selectively in a first mode to generate the drive reference voltage regardless of the state of the specific external terminal, or a second mode to generate the drive reference voltage in accordance with a second mode current through the specific external terminal.

Abstract: Disclosed herein is a limiting-current type gas sensor including a solid electrolyte, a first electrode disposed on the solid electrolyte, a second electrode disposed on the solid electrolyte, and a gas feed passage extending between a gas inlet and a first portion of the first electrode, the first portion facing the solid electrolyte. The first electrode is a first porous metal electrode. The gas feed passage is formed of a first porous transition metal oxide having a second melting point higher than a first melting point of the first electrode. The first porous transition metal oxide is Ta2O5, TiO2, or Cr2O3.

Abstract: A semiconductor light-emitting device includes a substrate, a semiconductor light-emitting element, and a resin member. The substrate includes a base member and a conductive part. The semiconductor light-emitting element is supported on the substrate. The resin member covers at least a portion of the substrate. The base member has a front surface and a back surface that face opposite to each other in a thickness direction. The conductive part includes a front portion formed on the front surface. The semiconductor light-emitting element is mounted on the front portion. The resin member includes a frame-shaped portion surrounding the semiconductor light-emitting element as viewed in the thickness direction, and a front-surface covering portion connected to the frame-shaped portion and covering a portion of the front surface of the base member that is exposed from the front portion.

Abstract: An overcurrent protection circuit includes a current control part configured to control conductance of a transistor so as to limit an output current flowing when the transistor is turned on to a predetermined upper limit or less, and a duty control part configured to forcibly turning on/off the transistor at a predetermined duty ratio when a temperature protection circuit detects a temperature abnormality in a state where the current control part limits the output current.