Abstract: A pixel includes a semiconductor layer with a charge accumulation layer extending in the semiconductor layer. A transistor has a read region penetrating into said semiconductor layer down to a first depth. An insulating wall penetrates into the semiconductor layer from an upper surface and containing an insulated conductor connected to a node of application of a potential. The insulating wall includes at least a portion provided with a deep insulating plug penetrating into the insulated conductor down to a second depth greater than the first depth. A continuous portion of the insulating wall laterally delimits, at least partially, a charge accumulation area and includes a wall portion with the deep insulating plug at least partially laterally delimiting the read region of the transistor.

Abstract: Electronic devices are manufactured using a collective (wafer-scale) fabrication process. Electronic chips are mounted onto one face of a collective substrate wafer. A collective flexible sheet made of a heat-conductive material comprising a layer containing pyrolytic graphite is fixed to extend over a collective region extending over the electronic chips and over the collective substrate wafer between the electronic chips. The collective flexible sheet is then compressed. A dicing operation is then carried out in order to obtain electronic devices each including an electronic chip, a portion of the collective plate and a portion of the collective flexible sheet.

Abstract: An integrated circuit package with improved reliability and methods for creating the same are disclosed. More specifically, integrated circuit packages are created using one or more sacrificial layers that provide support for ink printed wires prior to package processing, but are removed during package processing. Once each of the sacrificial layers is removed, molding compound is placed around each ink printed wire, which may have a substantially rectangular cross section that can vary in dimension along a length of a given wire. While substantially surrounding each wire in and of itself improves reliability, removing non-conductive paste, fillets, or other adhesive materials also minimizes adhesion issues between the molding compound and those materials, which increases the bond of the molding compound to the package and its components. The net result is a more reliable integrated circuit package that is less susceptible to internal cracking and wire damage.

Abstract: A system for noise removal is coupled to a signal unit that provides a digital signal. The noise removal system includes a transformation module to transform the digital signal into an f-digital signal, a threshold filter to generate a noiseless signal from the f-digital signal based on a threshold profile, and a signal synthesizer to provide a gain to the noiseless signal and to transform the noiseless signal into an output signal.

Abstract: A semiconductor device includes a plurality of gates formed upon a semiconductor substrate that includes a plurality of outer active areas (e.g. CMOS/PMOS areas, source/drain regions, etc.) and one or more inner active areas. An isolator is formed upon one or more inner gates associated with the one or more inner active areas. A contact bar electrically connects the outer active areas and/or outer gates and is formed upon the isolator. The isolator electrically insulates the contact bar from the one or more inner active areas and/or the one or more inner gates.

Abstract: A method for carrying out nucleic acid amplification, includes providing a reaction chamber (31), accommodating an array (36) of nucleic acid probes (37) at respective locations; for hybridizing to respective target nucleic acids; and introducing a solution (50) into the reaction chamber (31), wherein the solution (50) contains primers, capable of binding to target nucleic acids, nucleotides, nucleic acid extending enzymes and a sample including nucleic acids. The structure of the nucleic acid probes (37) and of the primers is selected so that a hybridization temperature (TH) of the probes (37) is higher than an annealing temperature (TA) of the primers, whereby hybridization and annealing take place in respective separate (non-overlapping) temperature ranges (RH, RA).

Abstract: A first capacitor has a capacitance adjustable to a set point value by application of a bias voltage. A second capacitor also has a capacitance adjustable to a set point value by application of a bias voltage. The first and second capacitors are arranged to receive the same bias voltage generated by a control circuit. The control circuit receiving the set point value as an input and generates that bias voltage in response to a quantity representative of a capacitance of the second capacitor.

Abstract: Current flowing through an inductor in response to a pulse width modulation (PWM) control signal is sensed to generate a sensed current. The sensed current is processed over one or more PWM cycles of the PWM control signal to generate an output signal indicative of average inductor current. This processing may include charging and discharging a capacitor at different rates dependent on the sense current, with the detection of capacitor discharge triggering a sampling of a voltage dependent on the sensed current that is indicative of average inductor current. The processing may include using the sensed to current to generate a first charge voltage associated with minimum inductor current and a second charge voltage associated with maximum inductor current, and then averaging the first and second charge voltages to generate an output signal indicative of average inductor current.

Abstract: A color image sensor including an array of pixels is formed in a semiconductor layer having a back side that receives an illumination. Insulated conductive walls penetrate into the semiconductor layer from the back side and separate the pixels from one another. For each pixel, a color pixel penetrates into from 5 to 30% of a thickness of the semiconductor layer from the back side and occupies at least 90% of the surface area delimited by the walls. An electrically-conductive layer extends from the lateral wall of the filter all the way to the walls.

Abstract: A hetero-channel FinFET device provides enhanced switching performance over a FinFET device having a silicon channel, and is easier to integrate into a fabrication process than is a FinFET device having a germanium channel. A FinFET device featuring the heterogeneous Si/SiGe channel includes a fin having a central region made of silicon and sidewall regions made of SiGe. A hetero-channel pFET device in particular has higher carrier mobility and less gate-induced drain leakage current than either a silicon device or a SiGe device. The hetero-channel FinFET permits the SiGe portion of the channel to have a Ge concentration in the range of about 25-40% and permits the fin height to exceed 40 nm while remaining stable.

Abstract: An electronic device may include leads, an IC having first and second bond pads, and an encapsulation material adjacent the leads and the IC so the leads extend to a bottom surface of the encapsulation material defining first contact pads. The electronic device may include bond wires between the first bond pads and corresponding ones of the leads, and conductors extending from corresponding ones of the second bond pads to the bottom surface of the encapsulation material defining second contact pads.

Abstract: A method and apparatus for multipath switching using per-hop virtual local area network (VLAN) remapping is disclosed. In the method and apparatus, a data packet is forwarded for transmission over one of a first port and a second port. The device identifies a VLAN ID of the data packet as a second VLAN ID and changes the second VLAN ID to a first VLAN ID. Then one or more criteria of a classification set entry for forwarding the data packet over the second port are evaluated. The data packet is forwarded over the second port if the criteria are met and the data packet is associated with the second VLAN ID. Alternatively, the data packet is forwarded over the first port and is associated with the first VLAN ID if a dynamic entry specifies the data packet is to be forwarded over the first port.

Abstract: A driving circuit for an electric motor including multiple windings includes a sensing circuit to sense motor winding currents. A motor rotation angle signal is generated from the sensed currents and motor control voltages are generated as a function of the motor rotation angle signal. The motor windings are driven with motor drive voltages obtained by injecting into the motor control voltages injection pulses. The sensed currents include both torque components and injection components. The motor rotation angle signal is generated as a function of the injection components of the sensed currents.

Abstract: An electronic device includes a flexible substrate. The flexible substrate includes a first portion having a plurality of first conductive lines formed thereon, a second portion having a plurality of second conductive lines formed thereon, and an intermediate portion mechanically coupling the first portion to the second portion. The intermediate portion is configured to permit folding so that the first and second portions can be arranged back-to-back or face-to-face such that plurality of the second conductive lines and plurality of first conductive lines are oriented so as to cross one another to thereby form a capacitive sensing panel. A single connector is mechanically coupled to the first portion or the second portion, and electrically coupled to the first portion and the second portion but not electrically coupling the first portion to the second portion.

Abstract: An embodiment of a non-volatile memory device is proposed. Said memory device comprises a matrix of memory cells; each memory cell is individually programmable to at least a first logic level and individually erasable to a second logic level. The memory device further comprises partition means for logically subdividing the matrix into a plurality of subspaces; each subspace comprises at least one respective memory cell. The memory device further comprises selection means for selecting a subspace, operative means for performing an operation on all the memory cells of the selected subspace, and means for dynamically modifying the number of subspaces and/or the number of memory cells included in each subspace.

Abstract: A multichannel splitter formed from 1 to 2 splitters. An input terminal of a first 1 to 2 splitter defines an input of the multichannel splitter. The 1 to 2 splitters are electrically series-connected. First respective outputs of the 1 to 2 splitters define output terminals of the multichannel splitter.

Abstract: Photoluminescence from a sample detector is detected using an array of photo-sensitive detectors. At least one first photo-sensitive detector of the array is provided with a first type of linear polarization filter and at least one second photo-sensitive detector is provided with a second type of linear polarization filter. The first type of linear polarization filter has a plane of polarization which is at angled with respect to a plane of polarization of said second type of polarization filter.

Abstract: A portable object includes an antenna and a processor coupled to the antenna. The processor is configured to communicate with an item of equipment according to a contactless communication protocol that contains an anticollision procedure. The processor is also configured to execute a plurality of software modules. The software modules include application modules and a triggering module, which is configured to cause a triggering of the anticollision procedure between the single portable object and the item of equipment. The processor is configured to cause a signal, which is generated by executing the triggering module, to be transmitted from the antenna to the time of equipment.

Abstract: A programmable-gain amplifier includes: two complementary cross-coupled transistor pairs mutually coupled with each transistor in one pair having a current flow path cascaded with a current flow path of a respective one of the transistors in the other pair. First and second coupling points are formed between the pairs; with first and second sampling capacitors coupled thereto. First and second input stages have input terminals to input signals for sampling by the first and second sampling capacitors. Switching means couple the first and second input stages to the sampling capacitors so the input signals are sampled as sampled signals on the sampling capacitors. The switching means energizes the complementary cross-coupled transistor pairs so the signals sampled on the sampling capacitors undergo negative resistance regeneration growing exponentially over time to thereby provide an exponential amplifier gain.

Abstract: Congruent power and timing signals in a single electronic device. In an embodiment, a circuit may include just one isolation transformer operable to generate a power signal and a timing signal. On the secondary side, two branches may extract both a power signal and a clock signal for use in the circuit on the isolated secondary side. The first branch may be coupled to the transformer and operable to manipulate the signal into a power signal, such as a 5V DC signal. Likewise, the second circuit branch is operable to manipulate the signal into a clock signal, such as a 5 V signal with a frequency of 1 MHz. By extracting both a power supply signal and a clock signal from the same isolation transformer on the secondary side, valuable space may be saved on an integrated circuit device with only having a single winding for a single isolation transformer.