Abstract: An electronic component includes a semiconductor layer having a first surface coated with a first insulating layer and a second surface coated with an interconnection structure. A laterally insulated conductive pin extends through the semiconductor layer from a portion of conductive layer of the interconnection structure all the way to a contact pad arranged at the level of the first insulating layer.

Abstract: The present disclosure is directed to systems and methods to perform absolute rotation estimation including outlier detection via low-rank and sparse matrix decomposition. One example method includes obtaining a relative rotation estimates matrix that includes a plurality of relative rotation estimates. The method includes determining values for a low-rank matrix that result in a desirable value of a cost function that is based on a low-rank and sparse matrix decomposition of the relative rotation estimates matrix. The cost function includes the low-rank matrix and a sparse matrix that is nonzero in correspondence of one or more outliers of the plurality of relative rotation estimates. The method includes determining an absolute rotations matrix that includes a plurality of absolute rotations based at least in part on the values of the low-rank matrix that result in the desirable value of the cost function.

Abstract: A galvanic isolation is provided between a first circuit and a second circuit. A first galvanically isolated link is configured to transfer power from a first circuit to a second circuit across the galvanic isolation. A second galvanically isolated link is configured to feed back an error signal from the second circuit to the first circuit across the galvanic isolation for use in regulating the power transfer and further configured to support bidirectional data communication between the first and second circuits across the galvanic isolation.

Abstract: A reference clock signal of at least one module clock signal associated with each module is delivered. A measurement period is generated and a module whose consumption is to be determined is selected. The frequency of the at least one module clock signal associated with the selected module reduced during the measurement period. A measurement of a first consumption of the device is made in the measurement period. A measurement of a second consumption of the device is made outside the measurement period. The consumption of the selected module is determined from the first and measured first and second consumptions.

Abstract: A method for producing at least one pattern in a layer resting on a substrate, including: a) making amorphous at least one first block of an upper layer of crystalline material resting on a first amorphous supporting layer, while the crystalline structure of a second block of the upper layer that adjoins and is juxtaposed with the first block is preserved; b) partially recrystallizing the first block by using at least one side surface of the second block that is in contact with the first block as an area for the start of a recrystallization front, the partial recrystallization being carried out to preserve a region of amorphous material in the first block; c) selectively etching the amorphous material of the upper layer with respect to the crystalline material of the upper layer to form at least one first pattern in the upper layer.

Abstract: A method for multi-touch integrity sensing for a multi-touch capacitive touch screen is disclosed. By determining the integrity of touches, a distinction is identified between wanted touches, such as via a finger or stylus, and unwanted touches such as via foreign matter, errors, and the like.

Abstract: A MEMS pressure sensor includes a resistive sensing bridge with a first sensing resistor and a second sensing resistor, each having variable resistance values in response to change in a sensed physical variable. An oscillator generates an oscillation signal with a frequency or period that is a function of an oscillator control signal. A sensor reference module generates the oscillator control signal as a function of the resistance value of a resistor coupled therewith. This sensor reference module is couplable with the first sensing resistor or second sensing resistor. A processing circuit coupled to the oscillator provides a sensor signal indicative of the frequency or period of the oscillation signal. The sensor signal has first and second values with the sensor reference module coupled with the first sensing resistor and with the second sensing resistor, respectively, the first and second values being thus jointly indicative of the physical variable sensed.

Abstract: A method and apparatus for determining a heart rate of a biological body are disclosed. In the method and apparatus, light having a first wavelength and light having a second wavelength are emitted at the biological body. The first wavelength is associated with a first absorption coefficient for blood components and the second wavelength is associated with a second absorption coefficient for the blood components that is less than the first absorption coefficient. A first reflected signal is captured as a result of the light having the first wavelength being reflected from the biological body and a second reflected signal is captured as a result of the light having the second wavelength being reflected from the biological body. A heart rate signal is obtained based on the first and second reflected signals. A heart rate of the biological body is determined based on the heart rate signal.

Abstract: One or more embodiments are directed to stacked packages, such as Package-on-Package (PoP) packages, that are stacked on a flexible folded substrate. The stacked packages have compliant corners. In particular, the stacked packages include an adhesive material at the corners between layers of the folded substrate. The adhesive material has a low modulus of elasticity, such as, for example, a modulus of elasticity of silicone adhesive. The low modulus of elasticity of the adhesive material produces compliant corners of the stacked package. The adhesive material fills openings between the folded substrate that are formed around a bottom semiconductor package of the stack package. In that regard, the bottom semiconductor package may have pulled back or recessed corners and the adhesive material fills the openings formed by the recessed corners. The recessed corners may be any size or shape.

Abstract: One or more embodiments are directed to semiconductor packages having an integrated heatsink and methods of forming same. In one embodiment, a package includes a plurality of leads that support and enclose periphery portions of the semiconductor die. The leads have first and second, opposing surfaces that form outer surfaces of the package. The first surface of the leads may form a heatsink and the second surface of the leads form lands of the package for coupling to another device, substrate, or board. The package includes encapsulation material that surrounds the semiconductor die and located between upper portions of the leads. The package further includes a back filling material (or insulating material) that is below the semiconductor die and between lower portions of the leads.

Abstract: A surface mounting device has one body of semiconductor material such as an ASIC, and a package surrounding the body. The package has a base region carrying the body, a cap and contact terminals. The base region has a Young's modulus lower than 5 MPa. For forming the device, the body is attached to a supporting frame including contact terminals and a die pad, separated by cavities; bonding wires are soldered to the body and to the contact terminals; an elastic material is molded so as to surround at least in part lateral sides of the body, fill the cavities of the supporting frame and cover the ends of the bonding wires on the contact terminals; and a cap is fixed to the base region. The die pad is then etched away.

Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.

Abstract: The present disclosure relates to an image display system, including a television having a screen, a sound projector, a control unit in signal communication with said screen and said sound projector, said control unit being configured for said sound projector to project one or more audible beams in a room towards one or more target paths. The system includes an optical instrument having a frame and a pair of lenses, detection means and transmission means, said detection means being designed to receive at their input an audio signal having a frequency falling in a 20-20 kHz frequency band and to output a processed signal, said transmission means being designed to receive at their input said processed signal, and to output a calibration signal. The control unit calibrates said sound projector according to said calibration signal generated by said optical instrument.

Abstract: The state of charge of a rechargeable battery is determined by calculating the DC impedance of the battery. The impedance is calculated by: performing a two different constant current discharges of the battery at a first and second C-rates, respectively; measuring the voltage and current during the interval of each constant current discharge and calculating the amount of charge extracted from the battery up to a point where the battery voltage drops to a threshold value; calculating the state of charge of the battery; and calculating the DC impedance of the battery as a function of the difference between the battery voltages and discharge currents for the two different discharges.

Abstract: A MEMS device includes a fixed structure and a mobile structure with a reflecting element coupled to the fixed structure through at least a first deformable structure and a second deformable structure. Each of the first and second deformable structures includes a respective number of main piezoelectric elements, with the main piezoelectric elements of the first and second deformable structures configured to be electrically controlled for causing oscillations of the mobile structure about a first axis and a second axis, respectively. The first deformable structure further includes a respective number of secondary piezoelectric elements configured to be controlled so as to vary a first resonance frequency of the mobile structure about the first axis.

Abstract: An optical electronic device may include a plurality of different optical sources, and a global shutter sensor including an array of global shutter pixels, with each global shutter pixel including a plurality of storage elements. A controller may be coupled to the plurality of optical sources and the global shutter sensor and configured to cause a first optical source to illuminate and a first storage element in each global shutter pixel to store optical data during a first integration period, cause a second optical source to illuminate and a second storage element in each global shutter pixel to store optical data during a second integration period, and output the stored optical data from the first and second storage elements of the global shutter pixels after the first and second integration periods.

Abstract: A processor module including a processor configured to share data with at least one further processor module processor; and a memory mapped peripheral configured to communicate with at least one further processor memory mapped peripheral to control the sharing of the data, wherein the memory mapped peripheral includes a sender part including a data request generator configured to output a data request indicator to the further processor module dependent on a data request register write signal from the processor; and an acknowledgement waiting signal generator configured to output an acknowledgement waiting signal to the processor dependent on a data acknowledgement signal from the further processor module, wherein the data request generator data request indicator is further dependent on the data acknowledgement signal and the acknowledgement waiting signal generator acknowledgement waiting signal is further dependent on the acknowledgement waiting register write signal.

Abstract: An input device may include an image sensor having an imaging surface that includes an array of pixels, and an optical waveguide layer carried by the imaging surface and having an exposed user surface and a first refractive index associated therewith. The input device may also include a substrate between the optical waveguide layer and the image sensor and having a second refractive index associated therewith that is lower than first refractive index. A collimation layer may be between the image sensor and the substrate. A light source may be configured to transmit light into the optical waveguide so that the light therein undergoes a total internal reflection. The optical waveguide may be adjacent the imaging surface so that an object brought into contact with the exposed user surface disturbs the total internal reflection resulting in an image pattern on the imaging surface.

Abstract: A sensor of volatile substances including: a sensitive layer, of a sensitive material that is permeable to a volatile substance and has an electrical permittivity depending upon a concentration of the volatile substance absorbed; a first electrode structure and a second electrode structure capacitively coupled together and arranged so that a capacitance between the first electrode structure and the second electrode structure is affected by the electrical permittivity of the sensitive material; and a supply device, configured to supply a heating current through one between the first electrode structure and the second electrode structure in a first operating condition, so as to heat the sensitive layer.

Abstract: A drive circuit includes an input, a driver, a first buffer, a second buffer, a first capacitance element, and a second capacitance element. The driver includes a first PMOS transistor and a first NMOS transistor coupled in series between a supply terminal and a reference terminal. The first buffer is coupled between the input and a control terminal of the first PMOS transistor. The second buffer is coupled between the input and a control terminal of the first NMOS transistor. The first capacitance element is coupled to the control terminal of the first PMOS transistor through a first semiconductor switch. The second capacitance element is coupled to the control terminal of the first NMOS transistor through a second semiconductor switch.