Abstract: A vacuum channel transistor having a vertical gate-all-around (GAA) architecture provides high performance for high-frequency applications, and features a small footprint compared with existing planar devices. The GAA vacuum channel transistor features stacked, tapered source and drain regions that are formed by notching a doped silicon pillar using a lateral oxidation process. A temporary support structure is provided for the pillar during formation of the vacuum channel. Performance of the GAA vacuum channel transistor can be tuned by replacing air in the channel with other gases such as helium, neon, or argon. A threshold voltage of the GAA vacuum channel transistor can be adjusted by altering dopant concentrations of the silicon pillar from which the source and drain regions are formed.

Abstract: A system includes an antenna, and a contactless component for receiving and/or transmitting information via the antenna according to a contactless communications protocol. An inductive-capacitive network is connected between the antenna and the contactless component and includes a configurable filter for filtering electromagnetic interference. A processor modifies an impedance of the configurable filter for filtering electromagnetic interference to control frequency tuning of the antenna.

Abstract: A bandgap voltage generator includes a plurality of calibration transistors. A test circuit measures the bandgap reference voltage generated by the bandgap voltage generator and enables a subset of the calibration transistors to correct to the bandgap reference voltage.

Abstract: A method for manufacturing a device for ejecting a fluid, including producing a nozzle plate including: forming a first nozzle cavity, having a first diameter, in a first semiconductor body; forming a hydrophilic layer at least in part in the first nozzle cavity; forming a structural layer on the hydrophilic layer; etching the structural layer to form a second nozzle cavity aligned to the first nozzle cavity in a fluid-ejection direction and having a second diameter larger than the first diameter; proceeding with etching of the structural layer for removing portions thereof in the first nozzle cavity, to reach the hydrophilic layer and arranged in fluid communication the first and second nozzle cavities; and coupling the nozzle plate with a chamber for containing the fluid.

Abstract: A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.

Abstract: Disclosed herein is a circuit for determining failure of a movable MEMS mirror. The circuit includes an integrator receiving an opening angle signal representing an opening angle of the movable MEMS mirror, and a differentiator receiving the opening angle signal. A summing circuit is configured to sum the integrator output and the differentiator output. A comparison circuit is configured to determine whether the sum of the integrator output and differentiator output is not within a threshold window. An indicator circuit is configured to generate an indicator signal indicating that the movable MEMS mirror has failed based on the comparison circuit indicating that the sum of the integrator output and differentiator output is not within the threshold window.

Abstract: A module incorporated within a system-on-a-chip operating in a steady-state power supply phase is powered by supplying to the module a regulated power supply voltage obtained from a feedback control loop. The receives a main power supply voltage and a negative feedback voltage. The negative feedback voltage is generated inside the system-on-a-chip starting from an effective supply voltage of the module and from a setpoint signal corresponding to a desired regulated power supply voltage.

Abstract: Method for generation of electrical power within a three-dimensional integrated structure comprising several elements electrically interconnected by a link device, the method comprising the production of a temperature gradient in at least one region of the link device resulting from the operation of at least one of the said elements, and the production of electrical power using at least one thermo-electric generator comprising at least one assembly of thermocouples electrically connected in series and thermally connected in parallel and contained within the said region subjected to the said temperature gradient.

Abstract: The invention relates to a method for serial data transmission, comprising the steps consisting in computing the running disparity (RD) of a bit stream that is being transmitted; when the running disparity reaches a threshold (T), computing a point disparity on a subsequent frame (S) of the stream; if the point disparity has the same sign as the threshold, inverting the states of the bits of the frame in the transmitted bit stream; and inserting into the transmitted bit stream a polarity bit having a state signalling the inversion.

Abstract: A device includes a matrix of active pixels, with each active pixel having an OLED diode having a cathode to receive a cathode voltage, and a control circuit coupled to an anode of the OLED diode. The device also includes at least one dummy pixel having a dummy OLED diode having a cathode to receive the cathode voltage, and an anode, and a dummy control circuit coupled to the anode of the OLED diode and having a power supply terminal. The dummy OLED diode and the dummy control circuit are substantially similar to the OLED diode and the control circuit. First regulation circuitry is configured to deliver a reference current to the power supply terminal to thereby generate a voltage, and second regulation circuitry is configured to regulate the cathode voltage so as to maintain the voltage at the power supply terminal at a given level.

Abstract: An active stylus is capacitively coupled to a capacitive touch panel for communication. The active stylus operates in a wait mode to receive initial communications from the panel. In response to such receipt, the active stylus synchronizes to a repeating communications frame implementing time division multiplexing. Communications from the active stylus to the panel include: information communications; synchronization communications and communications specific for columns and/or rows of the panel. Communications from the panel to the active stylus may be addressed uniquely to the stylus or commonly to a group of styluses.

Abstract: A master-slave circuit is disclosed that maintains synchronization between two integrated circuit chips, using minimal chip resources. In one embodiment, a single, bidirectional communication path is shared by the two chips. Meanwhile, only one I/O port on each chip is used to send and receive signals via the bidirectional communication path. The first chip to detect a signal event is designated the master and controls the bidirectional communication path. The master can communicate the status to the other chip by controlling the logic state of the I/O ports. When the second chip detects that the I/O port is controlled by the first chip, the second chip will logically deduce that it is now the slave. If both chips detect the signal event at substantially the same time, one of the two chips is pre-programmed to assume control of the I/O port as the master.

Abstract: A circuit includes a counter circuit, a logic circuit, and a clock divider. The counter circuit includes a clock divider counter to be loaded with most significant bits of a divider value, and decremented at a same edge of each pulse of a clock signal. The logic circuit compares a value contained in the divider counter to a reference value and generates an end count signal as a function of the value contained in the divider counter matching the reference value, and transitions a toggle signal at a same edge of each pulse of the end count signal. The clock divider counter is reloaded with the most significant bits of the divider value as a function of the end count signal. The clock divider generates a divided version of the clock signal as a function of the toggle signal.

Abstract: A wireless local area network system establishes a PASSPOINT™ connection between a mobile station and a hotspot using an enhanced single SSID method or an enhanced dual SSID method. In the dual SSID method, an access point associates and authenticates a mobile device to a secondary SSID of the access point during enrollment and provisioning. After enrollment, the access point authenticates the mobile station to a primary SSID of the access point using the credential that the mobile station received from an online sign-up (“OSU”) server in connection with the secondary SSID. In the single SSID method, an access point performs two levels of authentication. During authentication, communications are limited to an 802.1x controlled port running on the mobile station and access point. After a first authentication, communications between the OSU server and the mobile station are unblocked. After the second authentication, all traffic from the mobile station is unblocked.

Abstract: A circuit for controlling a capacitor having a capacitance adjustable by biasing, including an amplifier for delivering a D.C. bias voltage, having a feedback slowed down by a resistive and capacitive cell.

Abstract: Embodiments of the present disclosure are directed to leadframes having the cantilevered extension that includes an integral support on the end of the lead nearest the die pad. A support integral to the leadframe allows the support to be built to the proper height to support the cantilevered lead in each package and reduces or eliminates the upward, downward, and side to side deflections caused or allowed by supports built-in to the tooling of the manufacturing equipment. Also, by building the support into the leadframe, the leadframes may be pretaped prior to the die attach and wire bonding steps of the manufacturing process.

Abstract: A network services provider grants a subscription to a user for use of mobile network services to communicate voice, data, and text information with a specific mobile device. Mobile devices store one or more subscriptions, each of which may be activated. An activated subscription stored in the mobile device is now made portable. The user wants to pass the portable subscription from a first mobile device to a second mobile device. The user forms a first communicative relationship between the first mobile device and a second mobile device and receives from the second mobile device identification information associated with the second mobile device. The first mobile device passes the identification information to the network services provider and receives a confirmation. The user forms a second communicative relationship between the first mobile device and the second mobile device, and the second mobile device confirms activation of the portable subscription.

Abstract: An integrated electronic device is supported by a substrate of a silicon on insulator type. At least one transistor is formed in and on a semiconductor film of the substrate. The transistor includes a drain region and a source region of a first conductivity type and a substrate (body) region of a second conductivity type lying under a gate region. An extension region laterally continues the substrate (body) region beyond the source and drain regions and borders, in contact with, the source region through a border region having the first conductivity type. This supports formation of an electrical connection of the source region and the substrate (body) region.

Abstract: A method for co-integrating finFETs of two semiconductor material types, e.g., Si and SiGe, on a bulk substrate is described. Fins for finFETs may be formed in an epitaxial layer of a first semiconductor type, and covered with an insulator. A portion of the fins may be removed to form voids in the insulator, and the voids may be filled by epitaxially growing a semiconductor material of a second type in the voids. The co-integrated finFETs may be formed at a same device level.

Abstract: A device for detecting obstacles that is wearable by a subject, for example integrated in an item of footwear. The device includes an ultrasound source for emitting an ultrasound transmission signal and an ultrasound receiver for receiving a corresponding ultrasound signal reflected by an obstacle, a control module for measuring a time of flight between emission of the ultrasound transmission signal and reception of the corresponding ultrasound signal reflected by the obstacle and calculating, on the basis of the aforesaid time of flight, the distance at which the obstacle is located. The device comprises an inertial sensor, in particular an acceleration sensor, designed to measure acceleration of the foot along three axes, and a control module configured for enabling operation of the ultrasound source if the aforesaid acceleration values measured by the inertial sensor respect a given condition for enabling measurement of the time of flight.