Abstract: An acoustic device includes a micro-machined acoustic transducer element, an acoustically attenuating region, and an acoustic matching region arranged between the acoustic transducer element and the acoustically attenuating region. The acoustic transducer element is formed in a first substrate housing a cavity delimiting a membrane. A second substrate of semiconductor material integrating an electronic circuit is arranged between the acoustic transducer element and the acoustically attenuating region. The acoustic matching region has a first interface with the second substrate and a second interface with the acoustically attenuating region. The acoustic matching region has an impedance matched to the impedance of the second substrate in proximity of the first interface, and an impedance matched to the acoustically attenuating region in proximity of the second interface.

Abstract: An electronic device disclosed herein includes a first conductor layer, a first nonconducting layer, and a second conductor layer in a stacked arrangement. A signal carrying conductive via is formed in the first nonconducting layer and extends between the first conductor layer and the second conductor layer. A shielding conductive via is formed in the first nonconducting layer, is not electrically coupled to the signal carrying conductive via, and substantially completely surrounds the signal carrying conductive via in spaced apart relation thereto.

Abstract: An electronic device includes a first support platelet and a second support platelet that is disposed opposite and at a distance from the first support platelet. At least one first electronic chip is mounted on the first support platelet on a side facing the second support platelet. A second electronic chip is mounted on the second support platelet on a side facing the first support platelet. A heat sink that includes at least one interposition plate is interposed between the first and second electronic chips.

Abstract: A circuit includes a first PMOS transistor that includes a first PMOS source coupled to a first input node, a first PMOS gate, and a first PMOS drain. A second PMOS transistor includes a second PMOS source coupled to a second input node, a second PMOS gate, and a second PMOS drain coupled to the second PMOS gate. A first resistor coupled between the first PMOS source and a ground node. A first diode element coupled between the first resistor and the ground node and a second diode element coupled between the second PMOS source and the ground node. A third PMOS transistor includes a third PMOS gate, a third PMOS source coupled to a supply node, and a third PMOS drain coupled to the first input node. A fourth PMOS transistor includes a fourth PMOS gate coupled to the third PMOS gate, a fourth PMOS source coupled to the supply node, and a fourth PMOS drain coupled to the second input node.

Abstract: A track regulator circuit includes an input terminal for receiving an input signal, an output stage with an output terminal for applying an output signal to a load, an error amplifier coupled to the input terminal, and a feedback resistor between the output terminal and the error amplifier for transferring to the error amplifier a feedback signal indicative of the output signal. The error amplifier is configured for driving the output stage as a function of the difference between the input signal and the output signal so that the output signal tracks the input signal. The circuit includes a current generator coupled to the feedback resistor for injecting into the feedback resistor a soft-start current to unbalance the error amplifier, with the intensity of the soft-start current gradually ramping down to zero.

Abstract: A method for making a semiconductor device may include forming a first dielectric layer above a semiconductor substrate, forming a first trench in the first dielectric layer, filling the first trench with electrically conductive material, removing upper portions of the electrically conductive material to define a lower conductive member with a recess thereabove, forming a filler dielectric material in the recess to define a second trench. The method may further include filling the second trench with electrically conductive material to define an upper conductive member, forming a second dielectric layer over the first dielectric layer and upper conductive member, forming a first via through the second dielectric layer and underlying filler dielectric material to the lower conductive member, and forming a second via through the second dielectric layer to the upper conductive member.

Abstract: A switched-mode power supply device includes a power switch configured to transfer power from a supply line to a load in switched-mode; a first oscillator configured to operate at a frequency proportional to a voltage of the supply line; a second oscillator configured to operate at a frequency proportional to a voltage of the load; and a regulator configured to operate the power switch according to a duty cycle based on a ratio between the first and second oscillator frequencies.

Abstract: A pressure sensor with double measuring scale includes: a flexible body designed to undergo deflection as a function of a the pressure; piezoresistive transducers for detecting the deflection; a first focusing region designed to concentrate, during a first operating condition, a first value of the pressure in a first portion of the flexible body so as to generate a deflection of the first portion of the flexible body; and a second focusing region designed to concentrate, during a second operating condition, a second value of said pressure in a second portion of the flexible body so as to generate a deflection of the second portion of the flexible body. The piezoresistive transducers correlate the deflection of the first portion of the flexible body to the first pressure value and the deflection of the second portion of the flexible body to the second pressure value.

Abstract: A test circuit measures both the rising edge delay and the falling edge delay associated with a logic cell. The test circuit includes a flip-flop type ring oscillator with two groups of logic cells connected in series in the oscillation path. A first multiplexor switches the ring oscillator between a rising edge and a falling edge mode. A second multiplexer causes the second group of logic cells to be included or excluded from the oscillation path. By measuring the oscillation period in the various modes, the rising edge and falling edge delays can be individually calculated.

Abstract: A MEMS device having a wafer-level package, is provided with: a stack of a first die and a second die, defining at least a first internal surface internal to the package and carrying at least an electrical contact pad, and at least a first external surface external to the package and defining a first outer face of the package; and a mold compound, at least in part coating the stack of the first and second dies and having a front surface defining at least part of a second outer face of the package, opposite to the first outer face. The MEMS device is further provided with: at least a vertical connection structure extending from the contact pad at the first internal surface towards the front surface of the mold compound; and at least an external connection element, electrically coupled to the vertical connection structure and exposed to the outside of the package, at the second outer face thereof.

Abstract: Color images designed to be displayed, for example, with a projector such as a laser pico projector, are subjected to gamut extension in respective iso-hue paths in the CIE1931xyY color space, operating for example, as follows: a plurality of iso-hue curves in the CIE1931xyY color space is determined; for the points subjected to gamut extension, the closest iso-hue curves are identified; and extension paths to be used for the operation of gamut extension are interpolated from said closest iso-hue curves.

Abstract: A semiconductor device for a system for measuring temperature, which includes a first UV detector and a second UV detector. The first and second UV detectors generate a first current and a second current, respectively, as a function of the irradiance in the ultraviolet band. Moreover, the first and second UV detectors have coefficients of variation of the current with temperature, at constant irradiance, that are different from one another.

Abstract: A rigid mask protects selective portions of a chip including a plurality of wells for biochemical reactions. The rigid mask includes a supporting portion and a plurality of legs, where each leg is provided with a rigid stem and a plate. The plurality of legs are arranged and fixed with respect to the supporting portion in a way aligned to the spatial arrangement of the wells, and are configured in such a way that, when each leg is inserted into the corresponding well, the respective plate covers at least in part the bottom of the well, protecting it during a chemical/physical treatment of side walls of the wells.

Abstract: A interface circuit for an acoustic transducer provided with a first detection structure and a second detection structure has: a first input and a second input; a first processing path and a second processing path coupled, respectively, to the first input and second input and supply a first processed signal and a second processed signal; and a recombination stage, which supplies a mixed signal by combining the first processed signal and the second processed signal with a respective weight that is a function of a first level value of the first processed signal. The first and second inputs receive a respective detection signal associated, respectively, to the first detection structure and to the second detection structure of the acoustic transducer; and an output stage the first processed signal, the second processed signal or the mixed signal, on the basis of a second level value of the first processed signal.

Abstract: A semiconductor device may include a substrate, a fin above the substrate and having a channel region therein, and source and drain regions adjacent the channel region to generate shear and normal strain on the channel region. A semiconductor device may include a substrate, a fin above the substrate and having a channel region therein, source and drain regions adjacent the channel region, and a gate over the channel region. The fin may be canted with respect to the source and drain regions to generate shear and normal strain on the channel region.

Abstract: A memory device includes a memory array with memory cells arranged in rows and columns and with word lines and bit lines. A dummy structure includes a dummy row of dummy cells and a dummy word line. A first pre-charging stage biases a word line of the memory array. An output stage includes a plurality of sense amplifiers. Each sense amplifier generates a corresponding output signal representing a datum stored in a corresponding memory cell pre-charged by the first pre-charging stage. A second pre-charging stage biases the dummy word line simultaneously with the word line biased by the first pre-charging stage. The output stage includes an enable stage, which detects a state of complete pre-charging of an intermediate dummy cell.

Abstract: An embodiment of a method for processing finger-detection data produced by a touch screen includes: computing the area of the finger-data map and extracting the main axes from the finger-data map, computing the lengths and orientations of the main axes, determining from the main axes a major axis having a major-axis orientation, computing a geometrical center and a center of mass of the finger-data map, computing an eccentricity of the finger-data map as a function of the lengths of the main axes outputting the major-axis orientation as indicative of the finger-orientation direction in the plane of the screen, outputting the mutual position of the geometrical center and the center of mass of the finger-data map as indicative of finger-pointing direction along the finger-orientation direction in the plane of the screen, and outputting a combination of the eccentricity and the area of the finger data map as indicative of finger orientation with respect to the plane of the screen.

Abstract: An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.

Abstract: A semiconductor device includes a leadframe that includes contact pins and a semiconductor die that has protruding connection formations. A flexible support member is disposed between the leadframe and the semiconductor die and supports the semiconductor die. The flexible support member has electrically conductive lines that extend between the leadframe and the semiconductor die. The electrically conductive lines of the flexible support member are electrically coupled with the contact pins of the leadframe and with the connection formations of the semiconductor die.

Abstract: An electronic device described herein includes a touch screen for a touch sensitive display carried by a portable housing. The electronic device is configured to operate in a high. detection threshold mode to determine whether an object is in contact with the touch sensitive display, and operate in a low detection threshold mode to determine whether the object is adjacent to the touch sensitive display, based on lack of detection of the object being in contact with the touch sensitive display. The electronic device is further configured to determine whether the object is in contact with a peripheral edge of the portable housing by determining whether the object is adjacent opposite sides of the touch sensitive display, based on detection of the object being adjacent to the touch sensitive display.