Abstract: A pipelined arbitration mechanism allows a routing control decision to be effected for a later packet while a current packet is being transferred. The later packet can be issued a fixed number of cycles after the current request. The mechanism has particular advantages when used with a plurality of functional modules connected to a packet router, whereby a single functional module can generate a current request relating to a current packet and a deferred arbitration request relating to a later packet to be issued a fixed number of cycles after the current request.

Abstract: A capacitive fingerprint sensor includes a polymeric protective coating defining a sensing surface and having conductive particles suspended therein. The conductive particles act as parallel strings of series capacitors to couple the capacitance the fingerprint-bearing skin of a user's finger applied to the sensing surface to capacitive sensing elements beneath the protective coating. The polymeric material of the coating is durable and scratch resistant. The conductive particles enable use of a protective coating of 10 to 20 microns in thickness while providing a high degree of sensitivity and image resolution.

Abstract: An address range checking circuit capable of determining if a target address, A[M:0], is within an address space having 2N address locations beginning at a base address location, B[M:0], is disclosed, wherein the address range checking circuit does not require a large comparator circuit.

Abstract: A cache flush controller, and an associated method, selectably flushes a memory cache of a data processor. The cache flush controller operates at a memory bus level of the data processor and operates to flush a selected line, or lines of the memory cache by writing arbitrary, selected values to the selected line or lines of the memory cache.

Abstract: A GaAs/Ge on Si CMOS integrated circuit is formed to improve transistor switching (propagation) delay by taking advantage of the high electron mobility for GaAs in the N-channel device and the high hole mobility for Ge in the P-channel device. A semi-insulating (undoped) layer of GaAs is formed over a silicon base to provide a buffer layer eliminating the possibility of latch-up. GaAs and Ge wells are then formed over the semi-insulating GaAs layer, electrically isolated by standard thermal oxide and/or flowable oxide (HSQ). N-channel MOS devices and P-channel MOS devices are formed in the GaAs and Ge wells, respectively, and interconnected to form the integrated circuit. Gate electrodes for devices in both wells may be polysilicon, while the gate oxide is preferably gallium oxide for the N-channel devices and silicon dioxide for the P-channel devices. Minimum device feature sizes may be 0.5 &mgr;m to avoid hot carrier degradation while still achieving performance increases over 0.

Abstract: A Central Processing Unit (CPU) hotpatch circuit compares the run-time instruction stream against an internal cache. The internal cache stores embedded memory addresses with associated control flags, executable instruction codes, and tag information. In the event that a comparison against the current program counter succeeds, then execution is altered as required per the control flags. If no comparison match is made, then execution of the instruction that was accessed by the program counter is executed.

Abstract: A system and method for reducing transfer latencies in fencepost buffering requires that a cache is provided between a host and a network controller having shared memory. The cache is divided into a dual cache having a top cache and a bottom cache. A first and second descriptor address location are fetched from shared memory. The two descriptors are discriminated from one another in that the first descriptor address location is a location of an active descriptor and the second descriptor address location is a location of a reserve/lookahead descriptor. The active descriptor is copied to the top cache. A command is issued to DMA for transfer of the active descriptor. The second descriptor address location is then copied into the first descriptor address. The next descriptor address location from external memory is then fetched and placed in the second descriptor address location.

Abstract: A structure and method is disclosed for dissipating electrostatic charges comprising an insulating layer between and over a plurality of conductive plates, wherein the insulating layer isolates the conductive plates and protects the conductive plates from damage, and wherein the insulating layer comprises a conductive discharge grid adjacent the conductive plates.

Abstract: A method for exposed die molding for integrated circuit packaging is provided that includes providing a mold comprising an upper mold with a flexible material, a lower mold, and a floating plunger. A substrate of an integrated circuit structure is clamped between the upper mold and the lower mold. An integrated circuit die of the integrated circuit structure is clamped between the floating plunger and the upper mold through the flexible material.

Abstract: A method for providing a leadframeless package structure is provided. The method includes providing a temporary carrier. The temporary carrier is coupled to a metal foil layer with a temporary adhesive layer. An integrated circuit chip is coupled to the metal foil layer. The temporary adhesive layer and the temporary carrier are removed to form the leadframeless package structure after molding.

Abstract: A method for removing heat from an active area of an integrated circuit device is provided. The method includes applying a separator to the active area of the integrated circuit device. A thermally conductive element is coupled to the active area of the integrated circuit device outwardly of the separator.

Abstract: An integrated circuit (IC) device comprising: 1) an integrated circuit (IC) die having a first surface, a second surface opposite the first surface, and sidewalls extending between the first surface and the second surface; and 2) an integrated circuit (IC) package for supporting the IC die, wherein the IC package is attached to at least one of the sidewalls of the IC die such that at least a portion of the IC die first surface and at least a portion of the IC die second surface are exposed.

Abstract: An integrated circuit (IC) device comprising: 1) an integrated circuit (IC) die having a first surface, a second surface opposite the first surface, and sidewalls extending between the first surface and the second surface; 2) an integrated circuit (IC) package for supporting the IC die, wherein the IC package is attached to at least one of the sidewalls of the IC die such that at least a portion of the IC die first surface and at least a portion of the IC die second surface are exposed; and 3) at least one auxiliary component attached to at least one of the exposed portion of the IC die first surface and the exposed portion of the IC die second surface.

Abstract: The present invention utilizes a “virtual” condition code (VCC) which can control the instruction sequence in a microprocessor. The virtual condition code is stored in an internal, non-architected register that is not visible to the programmer, but is used by various microprocessor instructions to determine when a branch is to be taken. For example, the virtual condition code can be used as a condition for branching out of a series of repetitive instructions. The virtual condition code (VCC) can eliminate a portion of the processing overhead used when determining whether a sequential number, such as a count value in a register associated with a repetitive instruction, e.g. a LOOP, is zero. In accordance with one aspect of the present invention, a LOOP instruction will decrement a count value in a register (to maintain compatibility with the ISA).

Abstract: A method of fabricating an integrated circuit sensor package. The method comprises the steps of: 1) mounting a substrate on a first mold block, the substrate comprising a substantially planar material having a first substrate surface and a second substrate surface that contacts a mounting surface of the first mold block; 2) placing an adhesive on the first substrate surface; 3) placing an integrated circuit sensor on the adhesive; and 4) pressing a second mold block against the first substrate surface. The second mold block comprising a cavity portion for receiving the integrated circuit sensor, a contact surface surrounding the cavity portion, and a compliant layer mounted with the cavity portion. Pressing the second mold block against the first substrate surface causes the contact surface to form with the first substrate surface a seal surrounding the integrated circuit sensor.

Abstract: A method and apparatus for disabling the scan output of flip-flops contained within an integrated circuit. Registers within the integrated circuit form a serial shift register chain when in the test mode of operation. The registers contain therein flip-flops, each of the flip-flops having at least one data input, a scan test input, a data output, and a scan output. The flip-flop is capable of storing either the signal appearing on the at least one data input or the signal appearing on the scan test input, based on the mode of operation of the flip-flop. The flip-flop includes a circuit coupled between the data output and the scan output for selectively disabling the scan output from following the value of the data output. Consequently, the scan output is enabled to output the logic value stored in the flip-flop when the flip-flop is in the test mode of operation and is disabled from outputting the logic value stored in the flip-flop when the flip-flop is in the normal mode of operation.

Abstract: There is disclosed a field programmable gate array for use in an integrated processing system capable of testing other embedded circuit components in the integrated processing system. The field programmable gate array detects a trigger signal (such as a power reset) in the integrated processing system. In response to the trigger signal, the field programmable gate array receives first test program instructions from a first external source and executes the first test program instructions in order to test the other embedded circuit components in the integrated processing system. When testing of the other embedded circuit components is complete, the field programmable gate array loads its normal operating code and performs its normal functions.

Abstract: An E2PR4 Viterbi detector includes a recovery circuit and receives a signal that represents a sequence of values, the sequence having a potential state. The recovery circuit recovers the sequence from the signal by identifying a surviving path to the potential state and, after identifying the surviving path, adding a modified branch metric to the path metric of the surviving path to generate an updated path metric for the potential state. Updating the path metric of the surviving path after the surviving path is selected allows the E2PR4 Viterbi detector to be smaller and/or faster than an E2PR4 Viterbi detector that updates the path metric before selecting the surviving path.

Abstract: An E2PR4 Viterbi detector receives a signal that represents a sequence of values, the sequence having a potential state. The detector includes a recovery circuit that recovers the sequence from the signal by identifying the surviving path to the potential state and simultaneously adding a modified branch metric to the path metric of the surviving path. By simultaneously identifying the surviving path and adding a modified branch metric to its path metric, such an E2PR4 Viterbi detector can operate faster than a conventional add-compare-select E2PR4 Viterbi detector.

Abstract: A ballast circuit and method for operating a lamp includes a lamp preheat/ignition circuit for preheating and igniting the lamp. A ballast controller integrated circuit is operatively connected to the preheat/ignition circuit wherein the lamp preheat/ignition circuit is operatively controlled in a a) preheating mode wherein the lamp is preheated at a preheating frequency for a predetermined period of time; b) a user programmable intermediate ignition mode wherein the lamp is heated at an intermediate ignition frequency that is lower than the preheating frequency; and c) an operating mode wherein the lamp is operated at a final operating frequency that is lower than the intermediate ignition frequency.