Abstract: A method of operating a MEMS device includes generating a MEMS drive signal, and generating and modifying the MEMS drive signal based upon a control signal to produce a modified drive signal. The method further includes generating the control signal by determining when a feedback signal from the MEMS device is at its peak value, comparing the peak value to a desired value when the feedback signal is as its peak, and generating the control signal depending upon whether the peak value is at least equal to a desired value. The modification of the MEMS drive signal based upon the control signal to produce the modified drive signal includes skipping generation of a next pulse of the modified drive signal when the control signal indicates the peak value is at least equal to the desired value.

Abstract: A device includes serial cyclic redundancy check (CRC) processing circuitry and parallel CRC processing circuitry. The serial CRS processing circuitry, in operation, generates a set of intermediate CRC bits based on a first set of seed bits and input data. The parallel CRC processing circuitry is coupled to the serial CRC processing circuitry, and, in operation, generates, using the set of intermediate CRC bits as a set of parallel seed bits and using null input bits, a set of output CRC bits corresponding to the input data.

Abstract: A gesture-recognition system for a digital-pen-like device, envisages: at least one motion sensor to provide at least one motion signal indicative of movements of the digital-pen-like device; a gesture-recognition signal processor, coupled to the at least one motion sensor to process the motion signal and to implement a plurality of gesture recognition algorithms based on the motion signal, each of the gesture recognition algorithms being configured to recognize a corresponding gesture performed by a user of the digital-pen-like device; and a controller coupled to the gesture-recognition signal processor and transmitting gesture-recognition data indicative of a recognized gesture towards a host apparatus, with which the digital-pen-like device is associated.

Abstract: A micro-electro-mechanical device, comprising a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region facing the first buried cavity; a second cavity facing the first buried cavity; a decoupling trench extending from the monolithic body and separating the sensitive region from a peripheral portion of the monolithic body; a cap die, forming an ASIC, bonded to and facing the first face of the monolithic body; and a first gap between the cap die and the monolithic body. The device also comprises at least one spacer element between the monolithic body and the cap die; at least one stopper element between the monolithic body and the cap die; and a second gap between the stopper element and one between the monolithic body and the cap die. The second gap is smaller than the first gap.

Abstract: A memory array arranged as a plurality of memory cells. The memory cells are configured to operate at a determined voltage. A memory management circuitry coupled to the plurality of memory cells tags a first set of the plurality of memory cells as low-voltage cells and tags a second set of the plurality of memory cells as high-voltage cells. A power source provides a low voltage to the first set of memory cells and provides a high voltage to the second set of memory cells based on the tags.

Abstract: A testing tool includes a clock generation circuit generating a test clock and outputting the test clock via a test clock output pad, data processing circuitry clocked by the test clock, and data output circuitry receiving data output from the data processing circuitry and outputting the data via an input/output (IO) pad, the data output circuitry being clocked by the test clock. The testing tool also includes a programmable delay circuit generating a delayed version of the test clock, and data input circuitry receiving data input via the IO pad, the data input circuitry clocked by the delayed version of the test clock. The delayed version of the test clock is delayed to compensate for delay between transmission of a pulse of the test clock via the test clock output pad to an external computer and receipt of the data input from the external computer via the IO pad.

Abstract: A phase-change memory cell includes, in at least a first portion, a stack of at least one germanium layer covered by at least one layer made of a first alloy of germanium, antimony, and tellurium In a programmed state, resulting from heating a portion of the stack to a sufficient temperature, portions of layers of germanium and of the first alloy form a second alloy made up of germanium, antimony, and tellurium, where the second alloy has a higher germanium concentration than the first alloy.

Abstract: An embodiment circuit comprises a set of input terminals configured to receive input digital signals which carry input data, a set of output terminals configured to provide output digital signals which carry output data, and computing circuitry configured to produce the output data as a function of the input data. The computing circuitry comprises a set of multiplier circuits, a set of adder-subtractor circuits, a set of accumulator circuits, and a configurable interconnect network. The configurable interconnect network is configured to selectively couple the multiplier circuits, the adder-subtractor circuits, the accumulator circuits, the input terminals and the output terminals in at least two processing configurations. In a first configuration, the computing circuitry is configured to compute the output data according to a first set of functions, and, in a second configuration, the computing circuitry is configured to compute the output data according to a different set of functions.

Abstract: A communication network comprises a plurality of electronic devices coupled via a plurality of communication links. The communication links comprise links over a first physical medium and links over a second physical medium. A method of operating the network comprises issuing, at an originator device, a path request message directed towards a destination device, transmitting the path request message from the originator device to the destination device through a first set of intermediate devices via a forward sequence of links, issuing, at the destination device, a path reply message directed towards the originator device, and transmitting the path reply message from the destination device to the originator device through a second set of intermediate devices via a reverse sequence of links.

Abstract: Embodiments are directed to electrically confined ballistic devices, circuits, and networks. One such device includes a heterostructure that has a first semiconductor layer, a second semiconductor layer, and a two-dimensional electrode gas (2DEG) layer between the first and second semiconductor layers. The device further includes an input electrode electrically coupled to the 2DEG layer and an output electrode electrically coupled to the 2DEG layer. A first confinement electrode is positioned on the heterostructure. The first confinement electrode, in use, generates first space charge regions which at least partially define a boundary of the ballistic device within the 2DEG layer between the input electrode and the output electrode in response to a first voltage.

Abstract: A method for transmitting an IP data packet to an IP address associated with a host name is described. A first service message of a Short Message Service is transmitted to a Short Message Service gateway server. The first service message includes a host name resolution request for a host name. A second service message of the Short Message Service is received from the Short Message Service gateway server. The second service message includes an IP address associated with the host name. An IP data packet is transmitted to the IP address associated with the host name.

Abstract: A microelectromechanical mirror device has a fixed structure defining a cavity. A tiltable structure carrying a reflecting surface is elastically suspended above the cavity with a main extension in a horizontal plane. Elastic elements are coupled to the tiltable structure and at least one first pair of driving arms, which carry respective regions of piezoelectric material, are biasable to cause rotation of the tiltable structure about at least one first axis of rotation parallel to a first horizontal axis of the horizontal plane. The driving arms are elastically coupled to the tiltable structure on opposite sides of the first axis of rotation and are interposed between the tiltable structure and the fixed structure. The driving arms have a thickness, along an orthogonal axis transverse to the horizontal plane, smaller than a thickness of at least some of the elastic elements coupled to the tiltable structure.

Abstract: A method for testing the hermetic seal of a packaged device, which includes: a package that delimits a device chamber; and a transducer device, which is arranged within the device chamber and generates an electrical signal indicating at least one physical quantity external to the package. The testing method includes the steps of: imposing a reference pressure in the device chamber; arranging the packaged device in a testing chamber in which a testing pressure is present, different from the reference pressure; and subsequently detecting possible pressure variations within the device chamber.

Abstract: An embodiment method for programming a differential type phase-change memory device comprises, in a first time interval, programming a direct memory cell or the respective complementary one pertaining to a first programming driver by means of a current between SET and RESET; and, in the same first time interval, simultaneously programming a direct memory cell or the respective complementary one pertaining to a second programming driver by means of the same current between SET and RESET. The method further comprises, in a second time interval, programming the other direct memory cell or the respective complementary one pertaining to the first programming driver by means of the other current between SET and RESET; and, in the same second time interval, simultaneously programming the other direct memory cell or the respective complementary one pertaining to the second programming driver by means of the same other current between SET and RESET.

Abstract: A device includes a charge variation sensor having at one or more electrodes. The charge variation sensor, in operation, generates a charge variation signal indicative of changes in an electric or electrostatic charge induced on the one or more electrodes by an alternating current power source. Processing circuitry, coupled to the charge variation sensor, generates a frequency spectrum signal based on the charge variation signal and identifies a frequency of operation associated with the alternating current power source based on the generated frequency spectrum signal. A control signal is generated based on the identified frequency of operation. An image acquisition device sets an image acquisition frequency based on the control signal.

Abstract: One or more embodiments are directed to semiconductor packages and methods in which one or more electrical components are positioned between a semiconductor die and a surface of a substrate. In one embodiment, a semiconductor package includes a substrate having a first surface. One or more electrical components are electrically coupled to electrical contacts on the first surface of the substrate. A semiconductor die is positioned on the one or more electrical components, and the semiconductor die has an active surface that faces away from the substrate. An adhesive layer is on the first surface of the substrate and on the one or more electrical components, and the semiconductor die is spaced apart from the one or more electrical components by the adhesive layer. Wire bonds are provided that electrically couples the active surface of the semiconductor die to the substrate.

Abstract: A thermographic sensor is proposed. The thermographic sensor includes a plurality of sensing elements each comprising at least one thermo-couple. The thermographic sensor is integrated on a semiconductor on insulator body that is patterned to define a grid suspended from a substrate; for each sensing element, the grid has a frame with the cold joint of the thermo-couple, a plate with the hot joint of the thermo-couple and one or more arms sustaining the plate from the frame. The frames include one or more conductive layers of thermally conductive material for thermally equalizing the cold joints with the substrate. Moreover, each sensing element may also include a processing circuit for the thermo-couple that is integrated on the corresponding frame. A thermographic device including the thermographic sensor and a corresponding signal processing circuit, and a system including one or more thermographic devices are also proposed.

Abstract: A micromechanical device for transducing acoustic waves in a propagation medium, comprising: a body; a first electrode structure superimposed to the body and electrically insulated from the body, the first electrode structure and the body defining between them a first buried cavity; and a first piezoelectric element superimposed to the first electrode structure, wherein the body, the first electrode structure, and the buried cavity form a first capacitive ultrasonic transducer, and the first electrode structure and the first piezoelectric element form a first piezoelectric ultrasonic transducer.

Abstract: A semiconductor die is mounted at a die area of a ball grid array package that includes an array of electrically-conductive ball. A power channel conveys a power supply current to the semiconductor die. The power channel is formed by an electrically-conductive connection plane layers extending in a longitudinal direction between a distal end at a periphery of the package and a proximal end at the die area. A distribution of said electrically-conductive balls is made along the longitudinal direction. The electrically-conductive connection plane layer includes subsequent portions in the longitudinal direction between adjacent electrically-conductive balls of the distribution. Respective electrical resistance values of the subsequent portions monotonously decrease from the distal end to the proximal end. A uniform distribution of power supply current over the length of the power channel is thus facilitated.

Abstract: A delta-sigma modulation circuit has a sampling period and, in operation, generates a delta-sigma modulated signal based on the analog input signal. The delta-sigma modulation circuit includes: a first integrator; an analog-to-digital converter; a feedback-loop coupled between an input of the first integrator and the output interface; a second integrator coupled between the first integrator and the analog-to-digital converter. The delta-sigma modulation circuit has loop-delay compensation circuitry having a plurality of switches. The loop delay compensation circuitry, in operation, controls the plurality of switches based on a time interval of a duration of half the sampling period and generates a loop-delay compensation signal.