Abstract: Disclosed herein is a control system for a projection system, including a first subtractor receiving an input drive signal and a feedback signal and generating a first difference signal therefrom, the feedback signal being indicative of position of a quasi static micromirror of the projection system. A type-2 compensator receives the first difference signal and generates therefrom a first output signal. A derivative based controller receives the feedback signal and generates therefrom a second output signal. A second subtractor receives the first and second output signals and generates a second difference signal therefrom. The second difference signal serves to control a mirror driver of the projection system. A higher order resonance equalization circuit receives a pre-output signal from an analog front end of the projection system that is indicative of position of the quasi static micromirror, and generates the feedback signal therefrom.

Abstract: A microelectromechanical gyroscope includes: the support structure; a sensing mass, coupled to the support structure with degrees of freedom along a driving direction and a sensing direction perpendicular to each other; and a calibration structure facing the sensing mass and separated from the sensing mass by a gap having an average width, the calibration structure being movable with respect to the sensing mass so that displacements of the calibration structure cause variations in the average width of the gap. A calibration actuator controls a relative position of the calibration structure with respect to the sensing mass and the average width of the gap.

Abstract: A semiconductor device includes a leadframe having a semiconductor chip arranged thereon and an electrically-insulating encapsulation molded onto the leadframe and the semiconductor chip. The leadframe is a pre-molded leadframe including a coupling surface having an alternation of electrically-conductive parts and insulating parts between electrically-conductive parts. The coupling surface includes a pattern of grooves and the electrically-insulating encapsulation includes anchoring protrusions extending into the grooves of the pattern of grooves in the coupling surface.

Abstract: A production process of a SiC wafer carried out in a same reaction chamber includes forming, on a support, a first SiC layer. The support is separated from the first SiC layer. A second SiC layer is grown on the first SiC layer, which includes introducing into the reaction chamber a precursor in the gaseous phase of a first dopant having a first electrical conductivity to generate a first stress in the second SiC layer, and introducing into the reaction chamber a precursor in the gaseous phase of a second dopant having a second electrical conductivity opposite to the first electrical conductivity, to generate a second stress in the second SiC layer that is opposite to, and balances, the first stress. The SiC wafer is thus without effects of warpage.

Abstract: A sensor circuit for a power FET monitors current flowing through the FET and includes a regulator circuit regulating a first current flowing through a sense resistance, so voltage drop at the sense resistance corresponds to voltage drop between terminals of the FET. A measurement circuit provides a second current corresponding (or being proportional) to the first current. A first switch selectively applies the second current to a resistor based on a first control signal, and a low pass filter generates a low-pass filtered signal by filtering voltage at the resistor. A voltage follower generates a replica of the low-pass filtered signal, and a second switch selectively applies the replica to the resistor. When the FET is closed, a control circuit closes the first switch and opens the second electronic switch. When the FET is opened, the control circuit opens the first electronic switch and closes the second electronic switch.

Abstract: A semiconductor device includes: a substrate; a transduction microstructure integrated in the substrate; a cap joined to the substrate and having a first face adjacent to the substrate and a second, outer, face; and a channel extending through the cap from the second face to the first face and communicating with the transduction microstructure. A protective membrane made of porous polycrystalline silicon permeable to aeriform substances is set across the channel.

Abstract: A thermographic sensor is proposed. The thermographic sensor includes one or more thermo-couples, each for providing a sensing voltage depending on a difference between a temperature of a hot joint and a temperature of a cold joint of the thermo-couple; the thermographic sensor further comprises one or more sensing transistors, each driven according to the sensing voltages of one or more corresponding thermo-couples for providing a sensing electrical signal depending on its temperature and on the corresponding sensing voltages. A thermographic device including the thermographic sensor and a corresponding signal processing circuit, and a system including one or more thermographic devices are also proposed.

Abstract: A piezoelectric microelectromechanical acoustic transducer, having a semiconductor substrate with a frame portion and a through cavity defined internally by the frame portion; an active membrane, suspended above the through cavity and anchored, at a peripheral portion thereof, to the frame portion of the substrate by an anchorage structure, a plurality of piezoelectric sensing elements carried by a front surface of the active membrane so as to detect mechanical stresses of the active membrane; a passive membrane, suspended above the through cavity, underneath the active membrane, interposed between the through cavity and a rear surface of the active membrane; and a pillar element, which fixedly couples, and is centrally interposed between, the active membrane and the passive membrane. A ventilation hole passes through the entire active membrane, the passive membrane and the pillar element to set the through cavity in fluidic communication with the front surface of the active membrane.

Abstract: Described herein is a MEMS acoustic transducer device provided with a micromechanical detection structure that detects acoustic-pressure waves and supplies a transduced electrical quantity, and with an integrated circuit operatively coupled to the micromechanical detection structure and having a reading module that generates at output an audio signal as a function of the transduced electrical quantity. The integrated circuit is further provided with a recognition module, which recognizes a of sound activity event associated to the transduced electrical quantity. The MEMS acoustic transducer has an output that supplies at output a data signal that carries information regarding recognition of the sound activity event.

Abstract: Radiation sensor including a detection assembly and a chopper assembly, which are mechanically coupled to delimit a main cavity; and wherein the chopper assembly includes: a suspended movable structure, which extends in the main cavity; and an actuation structure, which is electrically controllable to cause a change of position of the suspended movable structure. The detection unit includes a detection structure, which faces the main cavity and includes a number of detection devices. The suspended movable structure includes a first shield of conductive material, which shields the detection devices from the radiation, the shielding of the detection devices being a function of the position of the suspended movable structure.

Abstract: A read signal generator generates read signals to control read operations of a memory array. The read signal generator can be selectively controlled to generate an oscillating signal having a period that corresponds to a feature one of the read signals. The oscillating signal is passed to a frequency divider that divides the oscillating signal and provides the divided oscillating signal to an output pad. The frequency of the oscillating signal can be measured at the output pad. The frequency of the oscillating signal, and the duration of the read signal feature can be calculated from the frequency of the oscillating signal. The read signal feature can then be adjusted if needed.

Abstract: An amplification interface includes first and second differential input terminals, first and second differential output terminals providing first and second output voltages defining a differential output signal, and first and second analog integrators coupled between the first and second differential input terminals and the first and second differential output terminals, the first and second analog integrators being resettable by a reset signal. A control circuit generates the reset signal such that the first and second analog integrators are periodically reset during a reset interval and activated during a measurement interval, receives a control signal indicative of offsets in the measurement sensor current and the reference sensor current, and generates a drive signal as a function of the control signal. First and second current generators coupled first and second compensation circuits to the first and second differential input terminals as a function of a drive signal.

Abstract: Disclosed herein is an integrated component formed by a first wafer having first and second trenches defined in a top surface thereof, and a second wafer coupled to the first wafer and formed by a substrate with a structural layer thereon that integrated an electromagnetic radiation detector overlying the second trench. A first cap is coupled to the second wafer, overlies the electromagnetic radiation detector, and serves to define a first air-tight chamber in which the electromagnetic radiation detector is positioned. A stator, a rotor, and a mobile mass are integrated within the substrate and form a drive assembly for driving the mobile mass. The rotor overlies the first trench. A second cap is coupled to the second wafer, overlies the mobile mass, and serving to define a second air-tight chamber in which the mobile mass is positioned.

Abstract: Charge pump stages are coupled between flying capacitor pairs and arranged in a cascaded between a bottom voltage line and an output voltage line. Gain stages apply pump phase signals having a certain amplitude to the charge pump stages via the flying capacitors. A feedback signal path from the output voltage line to the bottom voltage line applies a feedback control signal to the bottom voltage line. Power supply for the gain stages is provided by a voltage of the feedback control signal in order to control the amplitude of the pump phase signals. An asynchronous logic circuit generates the switching drive signals for the gain stages with a certain switching frequency which is a function of a logic supply voltage derived from the voltage of the feedback control signal.

Abstract: A sample treatment and molecule analysis cartridge is configured to be mounted in a treatment machine vertically. The cartridge has a sample inlet opening, a fluidic inlet, and a fluidic outlet. The cartridge houses an extraction chamber extending vertically from the sample inlet opening and connected to the fluidic inlet; a waste chamber extending vertically, alongside the extraction chamber; and a collector extending along the extraction chamber and the waste chamber and having a smaller height than the extraction chamber and the waste chamber. A fluidic circuit connects together the extraction chamber, the waste chamber, the collector, the fluidic inlet, and the fluidic outlet, and is configured to connect the fluidic outlet to vent openings of the extraction chamber, the waste chamber, and the collector, and to connect the bottom end of the extraction chamber to the fluidic inlet, the waste chamber, and the collector.

Abstract: A DC-DC switching converter includes power switches selectively coupling an output terminal with a first voltage or with a second voltage. A driver stage is coupled with the power switches for driving the power switches. A driver control stage is coupled with the driver stage for controlling the operation of the driver stage. An output current sensing circuit is coupled with the output terminal and with the driver control stage, and is configured to sense a sign of an output current delivered by the DC-DC switching converter at the output terminal and to generate control signals for the driver control stage. The driver control stage controls the operation of the driver stage according to states of the control signals received from the output current sensing circuit, for selectively delaying the activation of the power switches depending on the sensed sign of the output current.

Abstract: In one example, a circuit includes a first node to receive an analog signal that is an amplitude modulated radio-frequency signal for a digital signal. An output node is configured to provide an output signal indicative of rising and falling edges of an envelope of the analog signal. The rising and falling edges are indicative of rising and falling edges of the digital signal. A first current path is disposed between a power supply node and the first node. The first current path includes a first transistor coupled between the first node and a first bias source. The first bias source is coupled between the first transistor and the power supply node. The output node is coupled to a first intermediate node in the first current path between the transistor and the first bias source. A control terminal of the first transistor is coupled to the output node via a feedback network.

Abstract: An integrated circuit includes a memory array and a read voltage regulator that generates read voltages from the memory array. The read voltage regulator includes a replica memory cell and the replica bitline current path. The replica memory cell is a replica of memory cells of the memory array. The replica bitline current path is a replica of current paths associated with deadlines of the memory array. The read voltage regulator generates a read voltage based on the current passed through the replica bitline current path. This read voltage is then supplied to the wordlines of the memory array during a read operation.

Abstract: An H-bridge circuit includes a supply voltage node, a first pair of transistors and a second pair of transistors. First transistors in each pair have the current paths therethrough included in current flow lines between the supply node and, respectively, a first output node and a second output node. Second transistors in each pair have the current paths therethrough coupled to a third output node and a fourth output node, respectively. The first and third output nodes are mutually isolated from each other and the second and fourth output nodes are mutually isolated from each other. The H-bridge circuit is operable in a selected one of a first, second and third mode.

Abstract: In an embodiment, PhotoPlethysmoGraphy (PPG) signals are processed by detecting peaks and valleys in the PPG signal, segmenting the PPG signal to provide a time series of PPG waveforms located between two subsequent valleys in the PPG signal, applying to the waveforms in the time series pattern recognition with respect to a reference PPG waveform pattern produced based on a mathematical model of the PPG signal by assigning to the waveforms in the time series a recognition score. A resulting PPG signal is produced by retaining the waveforms in the time series having an assigned recognition score reaching a recognition threshold, and discarding the waveforms in the time series having an assigned recognition score failing to reach the recognition threshold.