Abstract: The bandwidth of SOC interfaces is exploited while minimizing the number of physical ports via a networking accelerator for use on board a vehicle, for instance, that comprises: media access control (MAC) controller circuitry configured to provide a MAC port layer to control exchange of information, wherein the exchange of information comprises data flow transmission to virtual machine ports (VMPs) over a data link; virtual machine transmission (VM Tx) bridge circuitry configured to handle transmission data flow to the VMPs; transmission router/switch circuitry configured to route/switch data flow from the MAC controller circuitry to the VM Tx bridge circuitry; and queue handler circuitry configured to provide queue management for data flow between the MAC controller circuitry and the VM Tx bridge circuitry.

Abstract: An amplification circuit includes an amplifier circuit (provided by an operational amplifier) that amplifies a signal to be demodulated. A feedback loop of the amplification circuit has a resistance value that is controlled to discretely vary according to a level of an output node of the amplifier circuit. A comparison of the output level with respect to one or a plurality of thresholds, which define out-of-saturation operating ranges of the amplifier circuit, drives selection of the resistance value.

Abstract: An embodiment system for protecting a memory comprises security software configured to determine, from an exception generated during an unauthorized action attempt in the memory, whether the security software can perform the action.

Abstract: A probe device includes an optical device including at least one of a photodetector or a first light source. A cover structure is included and is arranged in front of the optical device. The cover structure includes an electrode which contacts, in use, a body tissue.

Abstract: A first switch couples an input node receiving a main control signal for a main switching stage of a multi-phase converter to an output node delivering a secondary control signal for a secondary switching stage following actuation of the secondary switching stage. A second switch couples the output node to a capacitor during a time period of actuation/deactuation of the secondary switching stage. Current is sourced to the capacitor during the actuation time period or sunk from the capacitor during the deactuation time period. The sourced or sunk current may be generated proportional to the main control signal.

Abstract: A microelectromechanical mirror device has, in a die of semiconductor material: a fixed structure defining a cavity; a tiltable structure carrying a reflecting region elastically suspended above the cavity; at least a first pair of driving arms coupled to the tiltable structure and carrying respective piezoelectric material regions which may be biased to cause a rotation thereof around at least one rotation axis; elastic suspension elements coupling the tiltable structure elastically to the fixed structure and which are stiff with respect to movements out of the horizontal plane and yielding with respect to torsion; and a piezoresistive sensor configured to provide a detection signal indicative of the rotation of the tiltable structure. At least one test structure is integrated in the die to provide a calibration signal indicative of a sensitivity variation of the piezoresistive sensor in order to calibrate the detection signal.

Abstract: A MOS transistor, in particular a vertical channel transistor, includes a semiconductor body housing a body region, a source region, a drain electrode and gate electrodes. The gate electrodes extend in corresponding recesses which are symmetrical with respect to an axis of symmetry of the semiconductor body. The transistor also has spacers which are also symmetrical with respect to the axis of symmetry. A source electrode extends in electrical contact with the source region at a surface portion of the semiconductor body surrounded by the spacers and is in particular adjacent to the spacers. During manufacture the spacers are used to form in an auto-aligning way the source electrode which is symmetrical with respect to the axis of symmetry and equidistant from the gate electrodes.

Abstract: An in-memory compute (IMC) device includes an array of memory cells and control logic coupled to the array of memory cells. The array of memory cells is arranged as a plurality of rows of cells intersecting a plurality of columns of cells. The array of memory cells includes a first subset of memory cells forming a plurality of computational engines at intersections of rows and columns of the first subset of the array of memory cells. The array also includes a second subset of memory cells forming a plurality of bias engines. The control logic, in operation, generates control signals to control the array of memory cells to perform a plurality of IMC operations using the computational engines, store results of the plurality of IMC operations in memory cells of the array, and computationally combine results of the plurality of IMC operations with respective bias values using the bias engines.

Abstract: A system and method for measuring a capacitance value of a capacitor are provided. In embodiments, a resistor is coupled to a terminal of the capacitor. A difference in voltage at the terminal between a first time and a second time during a discharge routine of the capacitor is measured. The discharge routine includes sinking a current through a discharge circuit coupled to the resistor from first to second. Integration of a difference in voltage at terminals of the resistor during the discharge routine between the first and second times is also measured. The capacitance value is computed based on the measured difference in voltage, the measured integration, and the resistance value of the resistor. The health of the capacitor is determined based on a difference between the computed capacitance value and a threshold value.

Abstract: The disclosure concerns a device which comprises a stack of two high electron mobility transistors, referred to as first and second transistor, separated by an insulating layer and each provided with a stack of semiconductor layers respectively referred to as first stack and second stack, the first and the second stack each comprising, from the insulating layer to, respectively, a first and a second surface, a barrier layer and a channel layer, the first and the second transistor respectively comprising a first set of electrodes and a second set of electrodes, the first and the second set of electrodes each comprising a source electrode, a drain electrode, and a gate electrode which are arranged so that the first and the second transistor are electrically connected head-to-tail.

Abstract: A device includes a first AND logic gate comprising a first input, a second input, and an output, a second AND logic gate comprising a first input, a second input, and an output, and a first OR logic gate comprising a first input coupled to the output of the first AND logic gate and a second input coupled to the output of the second AND logic gate. A first selection circuit has first and second data inputs, a first control input coupled to the first input of the first AND logic gate and a second control input coupled to the first input of the second AND logic gate. A first D latch includes a data input coupled to an output of the first selection circuit and an activation input coupled to an output of the first OR logic gate and a second D latch includes a data input coupled to the output of the first selection circuit and an activation input coupled to the output of the first OR logic gate.

Abstract: An electronic device includes a sensor unit. The sensor unit includes a sensor and low power, low area sensor processing unit. The sensor processing unit performs an unsupervised machine learning processes to learn to recognize an activity or motion of the user or device. The user can request to learn the new activity. The sensor processing unit can request that the user remain stationary for a selected period of time before performing the activity. The sensor processing unit records sensor data while the user performs the activity and generates an activity template from the sensor data. The sensor processing can then infer when the user is performing the activity by comparing sensor signals to the activity template.

Abstract: In an embodiment a device includes a supply node configured to receive a supply voltage, an output node configured to provide an output voltage, a plurality of switching stages coupled to the supply node and to the output node, a sensing circuit coupled to the supply node and configured to provide at least one sensing signal based on the supply voltage and a driver circuit coupled to the sensing circuit and to the plurality of switching stages, wherein the driver circuit is configured to provide the drive signal based on at least one sensing signal exceeding or failing to exceed at least one reference voltage level and to selectively bypass a selected number of the plurality of switching stages based on the drive signal thereby varying an output voltage level at the output node.

Abstract: A device includes a memory, a first firmware copy of the device stored in a first position of the memory and a second firmware copy of the device stored in a second position of the memory, where each of the first firmware copy and the second firmware copy includes instructions, when executed by the device, perform an operation of the device; and a first delta copy associated with the first firmware copy. The first delta copy includes instructions that differ from the first firmware copy when executed at the first position and are the same when executed at the second position. The device is configured to receive the first delta copy from an external system and store the first delta copy in the memory.

Abstract: The present disclosure relates to a method for manufacturing a pixel by: depositing an insulating layer on an exposed face of an interconnect structure of an integrated circuit, the interconnect structure having a conductive element flush with said exposed face; etching an opening passing through the insulating layer to the conductive element; depositing an electrode layer on and in contact with the conductive element and the insulating layer; defining an electrode by removing, by etching, part of the electrode layer resting on the insulating layer; and depositing a film configured to convert photons into electron-hole pairs when a ray at an operating wavelength of the pixel reaches the pixel.

Abstract: The memory array of a memory includes sub-arrays with memory cells arranged in a row-column matrix where each row includes a word line and each sub-array column includes a local bit line. A row decoder circuit supports two modes of memory circuit operation: a first mode where only one word line in the memory array is actuated during a memory read and a second mode where one word line per sub-array are simultaneously actuated during the memory read. An input/output circuit for each column includes inputs to the local bit lines of the sub-arrays, a column data output coupled to the bit line inputs, and a sub-array data output coupled to each bit line input. Both BIST and ATPG testing of the input/output circuit are supported. For BIST testing, multiple data paths between the bit line inputs and the column data output are selectively controlled to provide complete circuit testing.

Abstract: An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.

Abstract: A test-circuit includes a PLL-divider outputting first and third clock-signals as PLL clock-signals during functional mode and a capture-phase of transition and stuck-at-modes, and outputting a second clock-signal based upon an external clock-signal as an ATE clock-signal during a shift-phase of the transition and stuck-at-mode. An OCC passes the clock-signals in functional mode, transition capture mode, and stuck-at capture mode through sub-paths within first paths within first and second clock selection circuits so the first and third clock-signals are passed through less than the entire first paths, the sub-paths being first and second functional clock paths.

Abstract: Disclosed herein is a method of operating a static random access memory (SRAM) device in retention mode. The method includes powering an array of SRAM cells between first and second voltages in retention mode, detecting process variation information about the array of SRAM cells, and generating a control word based thereupon. The method continues with generating a reference voltage that is proportional to absolute temperature and having a magnitude curve that is set by the control word, and then maintaining the second voltage as being equal to the reference voltage.

Abstract: A lead frame for an integrated electronic device includes a die pad made of a first metallic material. A top coating layer formed by a second metallic material is arranged on a top surface of the die pad. The second metallic material has an oxidation rate lower than the first metallic material. The top coating layer leaves exposed a number of corner portions of the top surface of the die pad. A subsequent heating operation, for example occurring in connection with wirebonding, causes an oxidized layer to form on the corner portions of the top surface of the die pad at a position in contact with the top coating layer.