Patents Assigned to STMicroelectronics
  • Publication number: 20240128871
    Abstract: A boost DC-DC converter includes a switching network, coupled to an inductor, controlled by a PWM driving signal. A control loop receives a voltage output and provides the PWM driving signal. The control loop generates an error signal as a function of a difference between voltage output voltage and a reference, with the PWM driving signal generated based on the error signal. A low pass filter circuit within the control loop receives the PWM driving signal and provides at least one filtered signal. An adder node of the control loop receives the at least one filtered signal from the low pass filter circuit for addition to the at least one filtered signal. The PWM driving signal is generated as a function of a sum of the filtered signal and the error signal.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 18, 2024
    Applicant: STMicroelectronics S.r.l.
    Inventors: Alessandro BERTOLINI, Alessandro GASPARINI, Paolo MELILLO, Salvatore LEVANTINO, Massimo GHIONI
  • Publication number: 20240125992
    Abstract: The present description concerns an optical filter intended to be arranged in front of an image sensor comprising a plurality of pixels, the filter comprising, for each pixel, a resonant cavity comprising a first transparent layer, interposed between second and third mirror layers, and a diffraction grating formed in the first layer, wherein at least one of the cavities has a different thickness than another cavity.
    Type: Application
    Filed: March 28, 2023
    Publication date: April 18, 2024
    Applicants: STMicroelectronics (Crolles 2) SAS, COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Quentin ABADIE, Sandrine VILLENAVE
  • Publication number: 20240124300
    Abstract: A semiconductor package that contains an application-specific integrated circuit (ASIC) die and a micro-electromechanical system (MEMS) die. The MEMS die and the ASIC die are coupled to a substrate that includes an opening that extends through the substrate and is in fluid communication with an air cavity positioned between and separating the MEMS die from the substrate. The opening exposes the air cavity to an external environment and, following this, the air cavity exposes a MEMS element of the MEMS die to the external environment. The air cavity separating the MEMS die from the substrate is formed with a method of manufacturing that utilizes a thermally decomposable die attach material.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 18, 2024
    Applicant: STMicroelectronics, Inc.
    Inventor: Jefferson Sismundo TALLEDO
  • Publication number: 20240125930
    Abstract: A method is for detecting one or more objects in a detection zone using a time-of-flight sensor. The method includes emitting optical radiation via the emission circuitry of the sensor and subsequently capturing the reflected optical radiation using the reception circuitry. This captured radiation is quantified in terms of photons, and measurement circuitry determines both the amount of these photons and the distance from the sensor to the object(s). An analysis of the photon count, combined with the calculated distance, is used to determine the presence or absence of objects within the detection zone.
    Type: Application
    Filed: October 9, 2023
    Publication date: April 18, 2024
    Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics Design and Application S.R.O., STMicroelectronics (Alps) SAS
    Inventors: Robin VASSAL, Jiri ANDRLE, Peter CABAJ, Cyrille TROUILLEAU
  • Publication number: 20240128311
    Abstract: The present disclosure relates to a capacitor including a first conductive layer over which is formed a stack, comprising from the upper face of the first layer, a first electrode, a first dielectric layer, a second electrode, and a second conductive layer, the stack comprising a stair step within the second conductive layer, the second electrode, and a part of the thickness of the first dielectric layer, the stair step being filled with a second dielectric layer so that the sidewalls of the first electrode are aligned with respect to the sidewalls of the second dielectric layer.
    Type: Application
    Filed: July 24, 2023
    Publication date: April 18, 2024
    Applicant: STMICROELECTRONICS (TOURS) SAS
    Inventor: Mohamed BOUFNICHEL
  • Publication number: 20240128289
    Abstract: The present disclosure concerns an image sensor including a plurality of pixels, each including: a doped photosensitive region of a first conductivity type extending vertically in a semiconductor substrate; a charge collection region more heavily doped with the first conductivity type than the photosensitive region, extending vertically in the substrate from an upper surface of the substrate and being arranged above the photosensitive region; and a vertical stack including a vertical transfer gate and a vertical electric insulation wall, the stack crossing the substrate and being in contact with the charge collection region, the gate being arranged on the upper surface side of the substrate and penetrating into the substrate deeper than the charge collection region.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 18, 2024
    Applicant: STMicroelectronics (Crolles 2) SAS
    Inventors: Francois ROY, Andrej SULER
  • Publication number: 20240128971
    Abstract: An integrated circuit includes a current mode transmitter having a first driver and a second driver. The first driver receives a single bit data stream. The second driver receives a delayed data stream corresponding to the single bit data stream delayed by a clock cycle. The current mode transmitter has a transition detector that generates a bulk modulation signal having a first value when the single bit data stream is the same as the delayed data stream and having a second value when the single bit data stream is different from the delayed data stream. The transition detector supplies the bulk modulation signal to the bulk terminals of driver switches of the first and second drivers.
    Type: Application
    Filed: October 5, 2023
    Publication date: April 18, 2024
    Applicant: STMicroelectronics International N.V.
    Inventors: Sameer VASHISHTHA, Saiyid Mohammad Irshad RIZVI, Paras GARG
  • Patent number: 11962900
    Abstract: In some embodiments, a ToF sensor includes an illumination source module, a transmitter lens module, a receiver lens module, and an integrated circuit that includes a ToF imaging array. The ToF imaging array includes a plurality of SPADs and a plurality of ToF channels coupled to the plurality of SPADs. In a first mode, the ToF imaging array is configured to select a first group of SPADs corresponding to a first FoV. In a second mode, the ToF imaging array is configured to select a second group of SPADs corresponding to a second FoV different than the first FoV.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: April 16, 2024
    Assignee: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED
    Inventors: Neale Dutton, Stuart McLeod, Bruce Rae
  • Patent number: 11959995
    Abstract: A PLL has a tunable resonator including an inductance and variable capacitance coupled between first and second nodes, and capacitances coupleable between the nodes. A control node is coupled to the variable capacitance and receives a control signal for tuning the resonator. A biasing circuit biases the resonator to generate an output. A PFD circuit senses timing offset of the output with respect to a reference and asserts first or second digital signals dependent on the sign of the timing offset. A charge pump generates the control signal based on the first and second digital signals. A timer asserts a timing signal in response to a pulse sensed in a reset signal and de-asserts the timing signal after a time interval. A calibrator couples selected capacitances between the first and second nodes as a function of the second digital signal, in response to assertion of the timing signal.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: April 16, 2024
    Assignee: STMicroelectronics S.r.l.
    Inventors: Alessandro Finocchiaro, Alessandro Parisi, Andrea Cavarra, Giuseppe Papotto, Giuseppe Palmisano
  • Patent number: 11962462
    Abstract: System on a chip, comprising several master pieces of equipment, several slave resources, an interconnection circuit capable of routing transactions between master pieces of equipment and slave resources, and a processing unit at least configured to allow a user of the system on a chip to implement within the system on a chip at least one configuration diagram of this system defined by a set of configuration pieces of information including at least one piece of identification information assigned to each master piece of equipment, The identification pieces of information are intended to be attached to all the transactions emitted by the corresponding master pieces of equipment, the set of configuration pieces of information not being used for addressing the slave resources receiving the transactions and being used to define an assignment of at least one piece of master equipment to at least some of the slave resources.
    Type: Grant
    Filed: May 22, 2023
    Date of Patent: April 16, 2024
    Assignees: STMicroelectronics (Alps) SAS, STMicroelectronics (Grand Ouest) SAS
    Inventors: Nicolas Anquet, Loic Pallardy
  • Patent number: 11960988
    Abstract: A classification device receives sensor data from a set of sensors and generates, using a context classifier having a set of classifier model parameters, a set of raw predictions based on the received sensor data. Temporal filtering and heuristic filtering are applied to the raw predictions, producing filtered predictions. A prediction error is generated from the filtered predictions, and model parameters of the set of classifier model parameters are updated based on said prediction error. The classification device may be a wearable device.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: April 16, 2024
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Emanuele Plebani, Danilo Pietro Pau
  • Patent number: 11962677
    Abstract: A method of processing a data stream includes taking a first number of samples of the data stream using a sampling clock over a first observation window and storing a stored data stream including the first number of samples in a data buffer. A length of the first observation window is determined by a reference clock. A measured number of cycles of the sampling clock are determined from the first number of samples. An error between an expected number of cycles of the sampling clock and the measured number of cycles of the sampling clock in the observation window is measured. The stored data stream corresponding to the first observation window is updated to contain a second number of samples by correcting the first number of samples with the error.
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: April 16, 2024
    Assignee: STMicroelectronics S.r.l.
    Inventors: Francesco Pappalardo, Elena Salurso
  • Patent number: 11960033
    Abstract: Described herein is a time-of-flight ranging system and methods for its operation. The system includes an array of single photon avalanche diode (SPAD) pixels and control circuitry. The control circuitry simultaneously accumulates integrated SPAD event data from one cluster of SPAD pixels while integrating SPAD event data from another cluster during different target illuminations. The system also includes first and second VCSEL clusters, each responsible for a different target illumination. By processing and managing the data in this manner, the system can effectively reduce the time used to gather and analyze the event data, leading to faster and more accurate distance measurements.
    Type: Grant
    Filed: March 24, 2023
    Date of Patent: April 16, 2024
    Assignee: STMicroelectronics (Grenoble 2) SAS
    Inventor: Pascal Mellot
  • Patent number: 11960718
    Abstract: In response to a request to store new data at a memory location of a bitwise programmable non-volatile memory, data stored at the memory location of the bitwise programmable memory is sensed. The bits of the sensed data are compared with bits of the new data. An indication of a cost difference is determined between a first burst of bitwise programming operations associated with programming bits of the new data which are different from bits of the sensed data, and a second burst of bitwise programming operations associated with programming bits of a complementary inversion of the new data which are different from bits of the sensed data. One of the first burst of bitwise programming operations or the second burst of bitwise programming operations is executed based on the generated indication of the cost difference.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: April 16, 2024
    Assignees: STMICROELECTRONICS (GRENOBLE 2) SAS, STMICROELECTRONICS S.r.l.
    Inventors: Leonardo Valencia Rissetto, Francesco Tomaiuolo, Diego De Costantini
  • Patent number: 11962616
    Abstract: A method and associated circuits protect data stored in a secure data circuit of a telecommunication device equipped with a near-field communication (NFC) router, a microcontroller, and the secure data circuit. In the method, each message received with the NFC router is parsed to retrieve a communication pipe identifier and an instruction code. The communication pipe identifier and the instruction code are compared to corresponding information in a filter table. Instruction codes of particular messages that attempt to modify a communication pipe by reassigning one end of the communication pipe from the port of the NFC router to a different circuit are acted upon. These messages are blocked from reaching the secure data circuit when the instruction code is not authorized in the filter table, and these messages are permitted when the instruction code is authorized in the filter table.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: April 16, 2024
    Assignees: PROTON WORLD INTERNATIONAL N.V., STMICROELECTRONICS (ROUSSET) SAS
    Inventors: Olivier Van Nieuwenhuyze, Thierry Huque, Alexandre Charles
  • Patent number: 11961933
    Abstract: In at least one embodiment, a Geiger-mode avalanche photodiode, including a semiconductor body, is provided. The semiconductor body includes a semiconductive structure and a front epitaxial layer on the semiconductive structure. The front epitaxial layer has a first conductivity type. An anode region having a second conductivity type that is different from the first conductivity type extends into the front epitaxial layer. The photodiode further includes a plurality of gettering regions in the semiconductive structure.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: April 16, 2024
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Massimo Cataldo Mazzillo, Valeria Cinnera Martino
  • Patent number: 11961868
    Abstract: A back side illuminated image sensor includes a pixel formed by three doped photosensitive regions that are superposed vertically in a semiconductor substrate. Each photosensitive region is laterally framed by a respective vertical annular gate. The vertical annular gates are biased by a control circuit during an integration phase so as to generate an electrostatic potential comprising potential wells in the central portion of the volume of each doped photosensitive region and a potential barrier at each interface between two neighboring doped photosensitive regions.
    Type: Grant
    Filed: May 17, 2023
    Date of Patent: April 16, 2024
    Assignee: STMicroelectronics (Crolles 2) SAS
    Inventor: Francois Roy
  • Publication number: 20240120301
    Abstract: A back end of line (BEOL) structure for an integrated circuit chip includes a last metal structure providing a bonding pad. A passivation structure over the bonding pad includes a first opening extending exposing an upper surface of the bonding pad. A conformal nitride layer extends over the passivation structure and is placed in contact with the upper surface of the bonding pad. An insulator material layer covers the conformal nitride layer and includes a second opening that extends through both the insulator material layer and the conformal nitride layer. A foot portion of the conformal nitride layer on the upper surface of the bonding pad is self-aligned with the second opening.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Applicant: STMicroelectronics S.r.l.
    Inventors: Simone Dario MARIANI, Elisabetta PIZZI, Daria DORIA
  • Publication number: 20240118871
    Abstract: System, method, and circuitry for generating a linker model for use by a toolchain associated with a programmable computing device. One or more regions in the memory resources available to the programmable computing devices is defined for used by an application executing on the programmable computing device. One or more sections is defined for those regions for use by the application. Resource boundaries are generated for the application based on the defined regions and the defined sections. A user is enabled to modify the defined regions or the defined sections or the generated resource boundaries. A linker model is then generated based on the available memory resources, the defined regions, the defined sections, and the generated resource boundaries. This linker model is then utilized to generate a linker script for the programmable computing device based the linker syntax compatible with a toolchain linker for the programmable computing device.
    Type: Application
    Filed: October 7, 2022
    Publication date: April 11, 2024
    Applicant: STMICROELECTRONICS SA
    Inventor: Tarek BOCHKATI
  • Publication number: 20240120267
    Abstract: A warped semiconductor die is attached onto a substrate such as a leadframe by dispensing a first mass of die attach material onto an area of the substrate followed by dispensing a second mass of die attach material so that the second mass of die attach material provides a raised formation of die attach material. For instance, the second mass may be deposited centrally of the first mass. The semiconductor die is placed onto the first and second mass of die attach material with its concave/convex shape matching the distribution of the die attach material thus effectively countering undesired entrapment of air.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 11, 2024
    Applicants: STMicroelectronics S.r.l., STMicroelectronics SDN BHD
    Inventors: Andrea ALBERTINETTI, Marifi Corregidor CAGUD