Patents Assigned to STMicroelectronics
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Patent number: 12260910Abstract: The present disclosure is directed to a sense amplifier architecture for a memory device having a plurality of memory cells. Groups of non-volatile memory cells store respective codewords formed by stored logic states, logic high or logic low, of the memory cells of the group. The sense amplifier architecture has a plurality of sense amplifier reading branches, each sense amplifier reading branch coupled to a respective memory cell and configured to provide an output signal, which is indicative of a cell current flowing through the same memory cell; a comparison stage, to perform a comparison between the cell currents of memory cells of a group; and a logic stage, to determine, based on comparison results provided by the comparison stage, a read codeword corresponding to the group of memory cells.Type: GrantFiled: December 29, 2022Date of Patent: March 25, 2025Assignee: STMICROELECTRONICS S.r.l.Inventors: Fabio Enrico Carlo Disegni, Marcella Carissimi, Alessandro Tomasoni, Daniele Lo Iacono
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Publication number: 20250096057Abstract: An electronic component includes an integrated circuit chip and a package surrounding the integrated circuit chip. The electronic component includes at least a first conductive region at least partially coating one side of the integrated circuit chip. The first conductive region includes an alloy predominantly comprising bismuth.Type: ApplicationFiled: September 6, 2024Publication date: March 20, 2025Applicant: STMicroelectronics International N.V.Inventors: Michael DE CRUZ, Laurent BARREAU
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Publication number: 20250095998Abstract: A method for manufacturing a HEMT device includes forming, on a heterostructure, a dielectric layer, forming a through opening through the dielectric layer, and forming a gate electrode in the through opening. Forming the gate electrode includes forming a sacrificial structure, depositing by evaporation a first gate metal layer, carrying out a lift-off of the sacrificial structure, depositing a second gate metal layer by sputtering, and depositing a third gate metal layer. The second gate metal layer layer forms a barrier against the diffusion of metal atoms towards the heterostructure.Type: ApplicationFiled: December 3, 2024Publication date: March 20, 2025Applicant: STMicroelectronics S.r.l.Inventors: Ferdinando IUCOLANO, Cristina TRINGALI
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Publication number: 20250096847Abstract: A device of contactless communication by active load modulation includes a clock signal extraction circuit configured to receive as an input a reception signal and to output a clock signal having a first value when the reception signal is greater than a threshold of the clock signal extraction circuit and having a second value when the reception signal is smaller than the threshold. The device includes a circuit for modifying the value of the threshold, configured to decrease the value of the threshold when the value of the clock signal is equal to the first value, or to increase the value of the threshold when the value of the clock signal is equal to the second value.Type: ApplicationFiled: September 11, 2024Publication date: March 20, 2025Applicant: STMicroelectronics International N.V.Inventors: Florent BARTHELEMY, Marc HOUDEBINE, Laurent Jean GARCIA
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Patent number: 12253894Abstract: The present disclosure relates to a method for powering an electronic device. The electronic device includes at least one universal integrated circuit card or at least one secure element; at least one power supply circuit for said card or secure element; and at least one near field communication module. When the near field communication module changes from a standby or inactive state to an active state, the following successive operations are performed: —the components and circuits of said electronic device are started; —programs of the electronic device and said secure card or element are started at the same time.Type: GrantFiled: August 9, 2022Date of Patent: March 18, 2025Assignees: STMICROELECTRONICS (ROUSSET) SAS, STMICROELECTRONICS (ALPS) SASInventors: Alexandre Tramoni, Patrick Arnould
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Patent number: 12255595Abstract: In accordance with an embodiment, a method of operating a piezoelectric transducer configured to transduce mechanical vibrations into transduced electrical signals at a pair of sensor electrodes includes stimulating a resonant oscillation of the piezoelectric transducer by applying at least one pulse electrical stimulation signal to the pair of sensor electrodes; detecting, at the pair of sensor electrodes, at least one electrical signal resulting from the stimulated resonant oscillation, wherein the at least one electrical signal resulting from the stimulated resonant oscillation oscillates at a resonance frequency of the piezoelectric transducer; measuring a frequency of oscillation of the at least one electrical signal resulting from the stimulated resonant oscillation to obtain a measured resonance frequency of the piezoelectric transducer; and tuning a stopband frequency of a notch filter coupled to the piezoelectric transducer to match the measured resonance frequency of the piezoelectric transducer.Type: GrantFiled: July 9, 2021Date of Patent: March 18, 2025Assignees: STMicroelectronics Asia Pacific Pte Ltd., STMicroelectronics S.r.l.Inventors: Marco Sautto, Giona Fucili, Valerio Lo Muzzo, Kaufik Linggajaya
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Patent number: 12253562Abstract: In an embodiment a processing system includes a reset circuit configured to receive a reset-request signal and one or more further reset-request signals, wherein the one or more further reset-request signals are provided by a processing core, one or more further circuits and/or a terminal of the processing system and to generate a combined reset-request signal by combining the reset-request signal and the one or more further reset-request signals, and a hardware test circuit including for each of the one or more further reset-request signals, a respective first combinational circuit configured to selectively assert the respective further reset-request signal, a second combinational logic circuit configured to selectively mask the combined reset-request signal, and a control circuit configured to repeat operations during a diagnostic phase.Type: GrantFiled: March 20, 2023Date of Patent: March 18, 2025Assignees: STMicroelectronics Application GmbH, STMicroelectronics International N.V.Inventors: Roberto Colombo, Vivek Mohan Sharma
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Patent number: 12253968Abstract: In accordance with an embodiment, a system includes: a primary device configured to be connected to at least one secondary device via serial bus having a data wire and a clock wire. The primary device is configured to: provide a clock signal on the clock wire; and transmit a frame comprising control bits on the serial bus, wherein a number of control bits transmitted on the serial bus at at least one location of the frame indicates a format of the frame.Type: GrantFiled: December 8, 2022Date of Patent: March 18, 2025Assignee: STMicroelectronics (Research & Development) LimitedInventors: Sergio Miguez Aparicio, Benjamin Thomas Sarachi
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Patent number: 12251508Abstract: A microfluidic dispenser device of inhalable substances includes a casing, housed in which are a driving circuit and a microfluidic cartridge having a tank that contains a liquid to be delivered. The microfluidic cartridge is provided with at least one nebulizer controlled by the driving device. The nebulizer includes: a substrate; a plurality of chambers formed on the substrate and fluidically coupled to the tank for receiving the liquid to be delivered; and a plurality of heaters, which are formed on the substrate in positions corresponding to respective chambers, are thermally coupled to the respective chambers and are separated from the respective chambers by an insulating layer, and are controlled by the driving device. Each chamber is fluidically connected with the outside by at least one respective nozzle.Type: GrantFiled: October 3, 2022Date of Patent: March 18, 2025Assignee: STMICROELECTRONICS S.r.l.Inventors: Oriana Rita Antonia Di Marco, Domenico Giusti
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Patent number: 12254156Abstract: A method of operating a touch screen panel includes initiating a communication between the panel and an active pen and determining a touch zone of the panel. The touch zone includes communication channels that are operating by touch while bi-directional communication is occurring between the panel and active pen. Communications channels within the touch zone are disabled and communication between the panel and the active pen can occur while the communications channels within the touch zone are disabled. When it is determined that the communication between the panel and the active pen has stopped, communications channels continue to be disabled within the touch zone for a set time delay while no communication occurs between the panel and the active pen. After the set delay time, the communication channels within the touch zone are enabled.Type: GrantFiled: August 4, 2023Date of Patent: March 18, 2025Assignee: STMicroelectronics International N.V.Inventors: Bin Fan, Pengcheng Wen
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Patent number: 12251729Abstract: A PMUT device includes a membrane element extending perpendicularly to a first direction and configured to generate and receive ultrasonic waves by oscillating about an equilibrium position. At least two piezoelectric elements are included, with each one located over the membrane element along the first direction and configured to cause the membrane element to oscillate when electric signals are applied to the piezoelectric element, and generate electric signals in response to oscillations of the membrane element. The membrane element has a lobed shape along a plane perpendicular to the first direction, with the lobed shape including at least two lobes. The membrane element includes for each piezoelectric member a corresponding membrane portion including a corresponding lobe, with each piezoelectric member being located over its corresponding membrane portion.Type: GrantFiled: October 8, 2021Date of Patent: March 18, 2025Assignee: STMICROELECTRONICS S.r.l.Inventors: Domenico Giusti, Fabio Quaglia, Marco Ferrera
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Patent number: 12256590Abstract: A pixel includes a first electrode layer on an exposed surface of an interconnection structure and in contact with a conductive element of the interconnection structure. An insulating layer extends over the first electrode layer and includes opening crossing through the insulating layer to the first electrode layer. A second electrode layer is on top of and in contact with the first electrode layer and the insulating layer in the opening. A film configured to convert photons into electron-hole pairs is on the insulating layer, the second electrode layer and filling the opening. A third electrode layer covers the film.Type: GrantFiled: December 6, 2021Date of Patent: March 18, 2025Assignee: STMicroelectronics (Crolles 2) SASInventors: Thierry Berger, Stephane Allegret-Maret
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Patent number: 12255233Abstract: A vertical conduction MOSFET device includes a body of silicon carbide having a first conductivity type and a face. A metallization region extends on the face of the body. A body region of a second conductivity type extends in the body, from the face of the body, along a first direction parallel to the face and along a second direction transverse to the face. A source region of the first conductivity type extends towards the inside of the body region, from the face of the body. The source region has a first portion and a second portion. The first portion has a first doping level and extends in direct electrical contact with the metallization region. The second portion has a second doping level and extends in direct electrical contact with the first portion of the source region. The second doping level is lower than the first doping level.Type: GrantFiled: January 19, 2022Date of Patent: March 18, 2025Assignee: STMicroelectronics S.r.l.Inventors: Mario Giuseppe Saggio, Alessia Maria Frazzetto, Edoardo Zanetti, Alfio Guarnera
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Patent number: 12255076Abstract: The present disclosure is directed to leadless semiconductor packages with improved wettable flanks that encourage the formation of solder fillets when the leadless semiconductor package is mounted to a substrate. The solder fillets are consistently formed and are easily detectable by inspection systems, such as automated optical inspection (AOI) systems.Type: GrantFiled: February 7, 2024Date of Patent: March 18, 2025Assignee: STMICROELECTRONICS, INC.Inventors: Ian Harvey Arellano, Aaron Cadag, Ela Mia Cadag
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Patent number: 12256156Abstract: The method for processing a matrix of pixels each containing an original red, green, blue, or infrared component, comprises at least one interpolation of an interpolated component different from the original component of a pixel of interest from the components of a group of pixels neighboring the pixel of interest. The interpolation comprises: a calculation of the sum of the components of reference pixels weighted by a respectively assigned weight, the reference pixels being pixels of the group having the same original component as the interpolated component, an evaluation of the spatial uniformity of an environment, within the group of each reference pixel, a calculation of the weights assigned to the reference pixels at values which are normalized and proportional to the respective spatial uniformity.Type: GrantFiled: September 8, 2022Date of Patent: March 18, 2025Assignee: STMicroelectronics FranceInventor: Pol Perrin
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Publication number: 20250085737Abstract: Provided is a circuit for managing a first clock signal clocking a timer adapted to being controlled by a processor clocked by a second clock signal. When the processor is off, the first clock signal is equal to a third clock signal having a frequency lower than the frequency of the second clock signal. When the processor is on, the first clock signal is equal to a fourth signal having a rising edge at each rising edge of the second clock signal directly following a rising edge of the third clock signal.Type: ApplicationFiled: August 23, 2024Publication date: March 13, 2025Applicant: STMicroelectronics International N.V.Inventor: Patrick ARNOULD
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Publication number: 20250087623Abstract: Packaged device having a carrying base; an accommodation cavity in the carrying base; a semiconductor die in the accommodation cavity, the semiconductor die having die pads; a protective layer, covering the semiconductor die and the carrying base; first vias in the protective layer, at the die pads; and connection terminals of conductive material. The connection terminals have first connection portions in the first vias, in electrical contact with the die pads, and second connection portions, extending on the protective layer, along a side surface of the packaged device.Type: ApplicationFiled: November 22, 2024Publication date: March 13, 2025Applicant: STMICROELECTRONICS S.r.l.Inventor: Agatino MINOTTI
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Publication number: 20250088109Abstract: A control circuit provides a drive signal to an electronic switch of an electronic converter. A first driving circuit has a first enable node receiving a first enable signal and a PWM signal generator circuit configured to provide a PWM drive signal in response to the first enable signal. A second driving circuit has a second enable node configured to receive a second enable signal and a PFM signal generator circuit configured to provide a PFM drive signal in response to the second enable signal. Logic circuitry coupled to the first and second driving circuits is configured to assert at least one of the first and second enable signals in response to a mode selection signal.Type: ApplicationFiled: September 9, 2024Publication date: March 13, 2025Applicant: STMicroelectronics International N.V.Inventors: Simone SCADUTO, Federico IOB, Stefano SAGGINI, Liliana ARCIDIACONO, Carmelo Alberto SANTAGATI, Agatino Antonino ALESSANDRO, Francesco GIORGIO
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Publication number: 20250083951Abstract: A process for manufacturing a microelectromechanical device includes: on a body containing semiconductor material, forming a sacrificial layer of dielectric material having a first surface, opposite to the body; conferring a sacrificial surface roughness to the first surface of the sacrificial layer; on the first surface of the sacrificial layer, forming a structural layer of semiconductor material having a second surface in contact with the first surface of the sacrificial layer. Conferring sacrificial surface roughness to the first surface of the sacrificial layer includes: on the sacrificial layer, forming a transfer layer of semiconductor material with intrinsic porosity; and partially removing the sacrificial layer through the transfer layer.Type: ApplicationFiled: August 16, 2024Publication date: March 13, 2025Applicant: STMicroelectronics International N.V.Inventors: Andrea NOMELLINI, Ilaria GELMI, Federica CAPRA, Michele VIMERCATI, Luca LAMAGNA
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Publication number: 20250088090Abstract: A time-based DC-DC converter is controlled in response to a first oscillator signal based on a first control signal, a second oscillator signal based on a second control signal and a controlled current based on a feedback control signal. The first control signal and the second control signal are a function of the controlled current. The feedback control signal is generated as a function of the first and second oscillator signals by: generating at least two binary signals including a first binary signal based on a difference between the first oscillator signal and the reference signal and a second binary signal based on a difference between the second oscillator signal and the reference signal; and generating via a charge pump the feedback control signal based on the first binary signal and the second binary signal.Type: ApplicationFiled: September 10, 2024Publication date: March 13, 2025Applicant: STMicroelectronics International N.V.Inventors: Alessandro BERTOLINI, Germano NICOLLINI, Alessandro GASPARINI, Alberto BRUNERO, Alberto CATTANI