Abstract: Sensors for air flow, temperature, pressure, and humidity are integrated onto a single semiconductor die within a miniaturized Venturi chamber to provide a microelectronic semiconductor-based environmental multi-sensor module that includes an air flow meter. One or more such multi-sensor modules can be used as building blocks in dedicated application-specific integrated circuits (ASICs) for use in environmental control appliances that rely on measurements of air flow. Furthermore, the sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. By integrating the Venturi chamber with accompanying environmental sensors, correction factors can be obtained and applied to compensate for temporal humidity fluctuations and spatial temperature variation using the Venturi apparatus.

Abstract: A method of assembling a multi-chip electronic device into a thin electronic package entails inverting a flip-chip die arrangement over a hollow substrate, stacking additional dies on the hollow substrate to form a multi-chip electronic device, and encapsulating the multi-chip electronic device. Containment of the encapsulant can be achieved by joining split substrate portions, or by reinforcing a hollow unitary substrate, using a removable adhesive film. Use of the removable adhesive film facilitates surrounding the multi-chip electronic device with the encapsulant. The adhesive film can also prevent encapsulant from creeping around the substrate to an underside of the substrate that supports solder ball pads for subsequent attachment to a ball grid array (BGA) or a land grid array (LGA).

Abstract: A touch controller is coupled to a touch screen and detects a first gesture at a first point on the touch screen. The first gesture includes physical contact of the touch screen by a user device at the first point. The touch controller detects a second gesture that is associated with movement of the user device from the first point to a second point on the touch screen. The second gesture includes detecting movement of the user device within a sensing range from the first point to the second point. The sensing range corresponds to an orthogonal distance from a surface of the touch screen. The touch controller detects a third gesture at the second touch point. The third gesture includes physical contact of the touch screen at the second touch point. Upon detecting the first, second and third gestures the touch controller performs a corresponding action.

Abstract: An embodiment for manufacturing electronic devices is proposed. The embodiment includes the following phases: a) forming a plurality of chips in a semiconductor material wafer including a main surface; each chip includes respective integrated electronic components and respective contact pads facing the main surface; said contact pads are electrically coupled to the integrated electronic components; b) attaching at least one conductive ribbon to at least one contact pad of each chip; c) covering the main surface of the semiconductor material wafer and the at least one conductive ribbon with a layer of plastic material; d) lapping an exposed surface of the layer of plastic material to remove a portion of the plastic material layer at least to uncover portions of the at least one conductive ribbon, and e) sectioning the semiconductor material wafer to separate the chips.

Abstract: A dual-master controller includes a plurality of JTAG data registers including a controller-mode register that stores information indicating a standard JTAG or a processor-controlled mode of operation. A JTAG TAP controller receives control signals over a standard test access port and a processor controller receives processor control signals over an external processor bus. A selection multiplexer outputs either signals on the standard JTAG access port or the external processor bus responsive to a JTAG mode selection signal. A logic circuit activates the JTAG mode selection signal responsive to the force JTAG signal being active or information in the controller-mode register indicating the standard JTAG mode, and deactivates the JTAG mode selection signal responsive to the force JTAG signal being deactivated or the information in the controller-mode register indicating the processor-controller mode.

Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed.

Abstract: An overvoltage protection device capable of protecting a power supply line and including in parallel a break-over diode, a controlled switch, and a circuit for controlling the switch.

Abstract: A memory includes an array of active memory cells arranged in rows and columns, and at least one dummy memory cell column adjacent the array of active memory cells. A sensing circuit is coupled to the at least one dummy memory cell column to sense at least one variation associated with the at least one dummy memory cell column. An assist circuit is coupled to the array of active memory cells. An assist determination controller is coupled to the sensing circuit to store a look-up table of output assist values corresponding to different variations associated with the at least one dummy memory cell column, to determine an output assist value from the look-up table based upon the at least sensed variation, and to operate the assist circuit based upon the determined output assist value.

Abstract: A memory device may include a semiconductor substrate, and a memory transistor in the semiconductor substrate. The memory transistor may include source and drain regions in the semiconductor substrate and a channel region therebetween, and a gate stack having a first dielectric layer over the channel region, a second dielectric layer over the first dielectric layer, a first diffusion barrier layer over the second dielectric layer, a first electrically conductive layer over the first diffusion barrier layer, a second diffusion barrier layer over the first electrically conductive layer, and a second electrically conductive layer over the second diffusion barrier layer. The first and second dielectric layers may include different dielectric materials, and the first diffusion barrier layer may be thinner than the second diffusion barrier layer.

Abstract: A coupling circuit, including: a coupler including a first conductive line and a second conductive line coupled to the first one; at each end of the second line of the coupler, a two-output signal splitter; and at each output of each splitter, a filtering function.

Abstract: An oscillator circuit includes first and second oscillators arranged in a series configuration between a supply voltage node and a reference voltage node. The first and second oscillators are configured to receive a synchronizing signal for controlling synchronization in frequency and phase. An electromagnetic network provided to couple the first and the second oscillators includes a transformer with a primary circuit and a secondary circuit. The primary circuit includes a first portion coupled to the first oscillator and second portion coupled to the second oscillator. The first and second portions are connected by a circuit element for reuse of current between the first and second oscillators. The oscillator circuit is fabricated as an integrated circuit device wherein the electromagnetic network is formed in metallization layers of the device. The secondary circuit generates an output power combining power provided from the first and second portions of the primary circuit.

Abstract: A packaged MEMS transducer device comprising: a die, including: a semiconductor body having a front side and a back side, opposite to one another in a first direction, at least one cavity extending through the semiconductor body between the front side and the back side, and at least one membrane extending on the front side at least partially suspended over the cavity; and a package designed to house the die on an inner surface thereof. The transducer device moreover includes a sealing layer extending on the back side of the semiconductor body for sealing the cavity, and includes a paste layer extending between the sealing layer and the inner surface of the package for firmly coupling the die to the package.

Abstract: Described herein are various embodiments of contacts that include different portions angled with respect to one another and methods of manufacturing devices that include such contacts. In some embodiments, a module may include a first portion of a contact that is disposed within a housing and a second portion that is disposed outside of the housing, with the second portion angled with respect to the first portion. Manufacturing such devices may include depositing a conductive material to electrically connect the contact to a contact pad of a substrate. In some embodiments, a deposition process for depositing the conductive material may have a minimum dimension, which defines a minimum dimension of a conductive material once deposited. In some such embodiments, a distance between a terminal end of the contact pin and the contact pad may be greater than the minimum dimension of the deposition process.

Abstract: A micro-sensor device that includes a passivation-protected ASIC module and a micro-sensor module bonded to a patterned cap provides protection for signal conditioning circuitry while allowing one or more sensing elements in the micro-sensor module to be exposed to an ambient environment. According to a method of fabricating the micro-sensor device, the patterned cap can be bonded to the micro-sensor module using a planarizing adhesive that is chemically compatible with the sensing elements. In one embodiment, the adhesive material is the same material used for the dielectric active elements, for example, a photo-sensitive polyimide film.

Abstract: Methods and devices for packaging integrated circuits. A packaged device may include an integrated circuit, a first packaging component including a patterned surface, and a second packaging component. The patterned surface of the first packaging component may be adhesively coupled to a surface of the second packaging component or a surface of the integrated circuit. The integrated circuit may be at least partially enclosed between the first and second packaging components. A packaging method may include patterning a surface of a packaging component of an integrated circuit package. The surface of the packaging component may be for adhesively coupling to a second component to at least partially enclose an integrated circuit in the integrated circuit package.

Abstract: An integrated circuit includes an N number of functional logic blocks, with N being greater than or equal to two, and clock staggering test circuitry. When the clock staggering test circuitry is in a shift mode, N staggered shift clock signals are generated for respective ones of the N functional logic blocks. Each of the N staggered shift clock signals has a frequency equal to a frequency of an external test clock signal divided by M, where M is greater than or equal to N. The peak power of the integrated circuit is reduced during the shift mode as a result of the staggered shift clock signals.

Abstract: A microreactor includes: a substrate (2; 102; 202) made of semiconductor material; a plurality of wells (5; 105; 205) separated by walls (6; 106; 206) in the substrate (2; 102; 202); a dielectric structure (7; 107; 207a, 207b) coating at least the top of the walls (6; 106; 206); a cap (3; 103; 203), bonded to the substrate (2; 102; 202) and defining a chamber (10; 110; 210) above the wells (5; 105; 205); and a biasing structure (2, 8, 13; 102, 108, 113; 202, 208a, 208b, 213), configured for setting up a voltage (VB) between the substrate (2; 102; 202) and the chamber (10; 110; 210).

Abstract: A semiconductor package includes an RFID chip positioned between a first die and a second die attached to a support substrate. The RFID chip is free of electrical connections to the dice and the support substrate. The RFID chip is sized to correspond to an interposer board. Data pertaining to operating characteristics of the dice are stored to and read from the RFID chip during back-end processing to determine abnormalities and improve yield. Said data may be stored to a database corresponding to the RFID chip in the package. A method of making a semiconductor package having an RFID chip positioned between dice is provided. The package is traceable by customers via the data stored to the RFID chip and the database.

Abstract: Embodiments are directed to a package that includes an electric device having a recess. In one embodiment, the electric device is a sensor and the recess reduces signal drift of the sensor caused by thermal expansion of the package. In another embodiment, the recess is substantially filled with adhesive material, thus increasing adhesion between the electric device and a substrate of the package while at the same time allowing for lower adhesive fillets.

Abstract: A miniature oxygen sensor makes use of paramagnetic properties of oxygen gas to provide a fast response time, low power consumption, improved accuracy and sensitivity, and superior durability. The miniature oxygen sensor disclosed maintains a sample of ambient air within a micro-channel formed in a semiconductor substrate. O2 molecules segregate in response to an applied magnetic field, thereby establishing a measureable Hall voltage. Oxygen present in the sample of ambient air can be deduced from a change in Hall voltage with variation in the applied magnetic field. The magnetic field can be applied either by an external magnet or by a thin film magnet integrated into a gas sensing cavity within the micro-channel. A differential sensor further includes a reference element containing an unmagnetized control sample. The miniature oxygen sensor is suitable for use as a real-time air quality monitor in consumer products such as smart phones.