Patents Assigned to STMicroelectronics
-
Patent number: 8520969Abstract: An image processing apparatus suitable for processing a digital image in YCrCb color space, the image having an initial luminance plane Y and two initial Cr, Cb chrominance planes, the processing apparatus including a first block that receives the initial luminance plane Y of the digital image and processes and modifies the initial luminance plane Y in order to provide a modified luminance plane Y in output; a color artifact correction block, operating in parallel with the first block, the correction block receiving the initial planes Y, Cr, Cb of the image and modifying the initial chrominance planes Cr and Cb through a pixel by pixel processing approach with a mobile working window, the correction block having a false colors correction sub-block and a purple fringing correction sub-block, or both, the sub-blocks structured to modify values of the initial Cr, Cb chrominance planes based on information contained in the initial Cr, Cb chrominance planes and also based on information contained in the initial luType: GrantFiled: August 25, 2009Date of Patent: August 27, 2013Assignee: STMicroelectronics S.r.l.Inventors: Valeria Tomaselli, Mirko Guarnera
-
Patent number: 8520493Abstract: A method for transmitting messages from first units of an integrated circuit to at least one second unit of the integrated circuit. The first units generate first digital messages and transform them into second digital messages obtained by application of an orthogonal or quasi-orthogonal transformation to the first messages. The second messages of the first units are added up and transmitted to the second unit.Type: GrantFiled: September 17, 2009Date of Patent: August 27, 2013Assignee: STMicroelectronics (Grenoble) SASInventor: Abdelaziz Goulahsen
-
Patent number: 8516889Abstract: A MEMS resonant accelerometer is disclosed, having: a proof mass coupled to a first anchoring region via a first elastic element so as to be free to move along a sensing axis in response to an external acceleration; and a first resonant element mechanically coupled to the proof mass through the first elastic element so as to be subject to a first axial stress when the proof mass moves along the sensing axis and thus to a first variation of a resonant frequency. The MEMS resonant accelerometer is further provided with a second resonant element mechanically coupled to the proof mass through a second elastic element so as to be subject to a second axial stress when the proof mass moves along the sensing axis, substantially opposite to the first axial stress, and thus to a second variation of a resonant frequency, opposite to the first variation.Type: GrantFiled: September 2, 2010Date of Patent: August 27, 2013Assignee: STMicroelectronics S.r.l.Inventors: Barbara Simoni, Claudia Comi, Alberto Corigliano
-
Patent number: 8519736Abstract: A method of protection from noise of a digital signal generated by a comparator, including the steps of generating an output signal that switches from a first logic state to a second logic state at a first switching of logic state of the digital signal; detecting a change from the first logic state to the second logic state of the output signal; and inhibiting further switchings of the output signal for a first time interval after the change from the first logic state to the second logic state.Type: GrantFiled: February 29, 2012Date of Patent: August 27, 2013Assignee: STMicroelectronics S.r.l.Inventors: Arber Cauli, Luciano Prandi, Carlo Caminada
-
Patent number: 8522067Abstract: A variable latency interface and method for managing variable latency. An apparatus includes a storage device controller and a read/write channel coupled to the storage device controller by a variable latency interface. The variable latency interface includes a media control component configured for read and write operations. The variable latency interface also includes a data transfer component configured for read and write operations. A read or write operation in the media control component is offset from a respective read or write operation in the data transfer component by a latency period.Type: GrantFiled: October 15, 2010Date of Patent: August 27, 2013Assignee: STMicroelectronics, Inc.Inventor: Cecilia Ozdemir
-
Patent number: 8521991Abstract: A technique for selecting instructions for execution from an issue queue at multiple function units while reducing the chances of instruction collisions. In an embodiment, each function unit in a processor may include a selection logic circuit that selects a specific instruction from the issue queue for execution. In order to avoid instruction collision, a function unit may have a selection logic circuit that may select two instructions from an instruction queue: one according to a first selection technique and one according to a second selection technique. Then, by comparing the instruction selected by the first selection technique to the instruction selected by the selection logic circuit of another function unit, the instruction selected by the second technique may be used instead if there will be an instruction collision because the instruction selected by the first selection technique is the same as the instruction selected at a different function unit.Type: GrantFiled: December 4, 2009Date of Patent: August 27, 2013Assignee: STMicroelectronics (Beijing) R&D Co., Ltd.Inventors: Kai-feng Wang, Hong-Xia Sun, Peng-fei Zhu, Yong-qiang Wu
-
Patent number: 8520958Abstract: Parallelization of decoding of a data stream encoded with a variable length code includes determining one or more markers, each of which indicates a position within the encoded data stream. The determined markers are included into the encoded data stream together with the encoded data. At the decoder side, the markers are parsed from the encoded data stream and based on the extracted markers. The encoded data is separated into partitions, which are decoded separately and in parallel.Type: GrantFiled: February 9, 2010Date of Patent: August 27, 2013Assignee: STMicroelectronics International N.V.Inventors: Surinder Pal Singh, Aneesh Bhasin, Kaushik Saha
-
Publication number: 20130214425Abstract: An electronic package includes a substrate wafer with an interconnect network. A first chip is fixed to a front of the substrate, connected to the interconnect network and encapsulated by a body. A second chip is placed on a back side of the substrate wafer and connected to the interconnect network by back-side connection elements interposed between the back side of the substrate and a front side of the second chip. Front-side connection elements are placed on the front side of the substrate and connected to the interconnect network. The connection elements extend beyond the frontal face of the body. The package may be mounted on a board with an interposed thermally conductive material.Type: ApplicationFiled: October 18, 2012Publication date: August 22, 2013Applicant: STMICROELECTRONICS (GRENOBLE 2) SASInventor: STMICROELECTRONICS (GRENOBLE 2) SAS
-
Publication number: 20130214368Abstract: A process for assembly of an integrated device, envisages: providing a first body of semiconductor material integrating at least one electronic circuit and having a top surface; providing a second body of semiconductor material integrating at least one microelectromechanical structure and having a bottom surface; and stacking the second body on the first body with the interposition, between the top surface of the first body and the bottom surface of the second body, of an elastic spacer material. Prior to the stacking step, the step is envisaged of providing, in an integrated manner, at the top surface of the first body a confinement and spacing structure that confines inside it the elastic spacer material and supports the second body at a distance from the first body during the stacking step.Type: ApplicationFiled: February 20, 2013Publication date: August 22, 2013Applicants: STMICROELECTRONICS S.R.L., STMICROELECTRONICS LTD (MALTA)Inventors: STMicroelectronics Ltd (Malta), STMicroelectronics S.r.l.
-
Publication number: 20130219210Abstract: Methods and systems are described for enabling display system data transmission during use. An integrated circuit package includes input interface circuitry configured to receive an audio-video data stream having a video signal and timing information and timing extraction circuitry that can identify blanking patterns for the video signal. The package includes input processing circuitry for receiving audio-video signal and converting the audio-video data stream input into a low voltage differential signal (LVDS). The package includes a timing controller having timing extraction circuitry, a set of symbol buffers, a scheduler, and timing control circuitry. All configured to implement LVDS data transfer and in some implementation enable point to point data transfer from data buffers to associated column drivers.Type: ApplicationFiled: March 26, 2013Publication date: August 22, 2013Applicant: STMicroelectronics, Inc.Inventor: STMicroelectronics, Inc.
-
Publication number: 20130214976Abstract: A method for localizing an object, including the acts of: transmission of a first signal by a first transmitter assigned to the object and of a second signal by at least one second transmitter; reception of the first and of the second signal by at least three receivers; in each receiver and for the first and the second signal: a) generation of a first and of a second reference signal; b) correlation between the first signal and the first reference signal and between the second signal and the second reference signal; c) interpolation of samples resulting from the correlation; d) deduction of the propagation time of the first and of the second signal; e) calculation of the difference between the propagation times of the first and of the second signal; and, by triangulation, deduction of the position of the object.Type: ApplicationFiled: February 15, 2013Publication date: August 22, 2013Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics SAInventors: STMicroelectronics SA, STMicroelectronics (Grenoble 2) SAS
-
Publication number: 20130214326Abstract: A device includes, within a layer of silicon on insulator, a central semiconductor zone including a central region having a first type of conductivity, two intermediate regions having a second type of conductivity opposite to that of the first one, respectively disposed on either side of and in contact with the central region in order to form two PN junctions, two semiconductor end zones respectively disposed on either side of the central zone, each end zone comprising two end regions of opposite types of conductivity, in contact with the adjacent intermediate region, the two end regions of each end zone being mutually connected electrically in order to form the two terminals of the device.Type: ApplicationFiled: February 15, 2013Publication date: August 22, 2013Applicant: STMICROELECTRONICS SAInventor: STMICROELECTRONICS SA
-
Publication number: 20130214756Abstract: A boost circuit is used for power factor correction (PFC). In a low power application, transition mode control is utilized. However, switching frequency varies with different input voltages, and over a wide input voltage range, the switching frequency can become too high to be practical. To address this issue, a boost circuit is provided whose effective inductance changes as a function of input voltage. By changing the inductance, control is exercised over switching frequency.Type: ApplicationFiled: April 5, 2013Publication date: August 22, 2013Applicant: STMICROELECTRONICS, INC.Inventor: STMicroelectronics, Inc.
-
Publication number: 20130216097Abstract: An embodiment is a method for detecting image features, the method including extracting a stripe from a digital image, the stripe including of a plurality of blocks; processing the plurality of blocks for localizing one or more keypoints; and detecting one or more image features based on the one or more localized keypoints.Type: ApplicationFiled: February 22, 2013Publication date: August 22, 2013Applicant: STMicroelectronics S.r.l.Inventor: STMicroelectronics S.r.l.
-
Publication number: 20130215873Abstract: The invention relates to systems and methods for spectrum sharing and communication among several wireless communication networks with overlapping service areas (or cells), especially to Wireless Regional Area Networks (WRANs). Particular embodiments of the invention disclose using a conference channel to communicate between base stations. Other embodiments use slotted coexistence windows within frames to transmit and receive information, including for reserving transmission times within subsequent frames.Type: ApplicationFiled: March 15, 2013Publication date: August 22, 2013Applicant: STMICROELECTRONICS, INC.Inventor: STMicroelectronics, Inc.
-
Publication number: 20130216904Abstract: A method for forming a microbattery including, on a surface of a first substrate, one active battery element and two contact pads, this method including the steps of: a) forming, on a surface of a second substrate, two contact pads with a spacing compatible with the spacing of the pads of the first substrate; and b) arranging the first substrate on the second substrate so that the surfaces face each other and that the pads of the first substrate at least partially superpose to those of the second substrate, where a portion of the pads of the second substrate is not covered by the first substrate.Type: ApplicationFiled: February 12, 2013Publication date: August 22, 2013Applicant: STMICROELECTRONICS (TOURS) SASInventor: STMICROELECTRONICS (TOURS) SAS
-
Publication number: 20130218316Abstract: A semiconductor processing apparatus includes a semiconductor processing station for a semiconductor wafer, and an endpoint detector associated with the semiconductor processing station. The endpoint detector includes a non-contact probe configured to probe the semiconductor wafer, an optical transmitter configured to transmit an optical signal to the non-contact probe, and an optical receiver configured to receive a reflected optical signal from the non-contact probe. The controller controls the semiconductor processing station based on the reflected optical signal.Type: ApplicationFiled: February 21, 2012Publication date: August 22, 2013Applicant: STMicroelectronics, Inc.Inventors: John H. ZHANG, Cindy GOLDBERG
-
Publication number: 20130214724Abstract: A method and an active battery balancing circuit for balancing an electric charge in a plurality of cells of a battery that are electrically connected in series is disclosed. A first subset of the cells of the battery is electrically connected to an inductance for providing a current flow from the first subset through the inductance. The first subset of the cells is disconnected from the inductance, and a current is allowed to flow from the inductance into a second subset of the cells of the battery. At least one of the first and the second subset of the cells of the battery comprises two or more cells.Type: ApplicationFiled: March 22, 2013Publication date: August 22, 2013Applicant: STMicroelectronics Application GmbHInventor: STMicroelectronics Application GmbH
-
Publication number: 20130216143Abstract: One embodiment is a method for selecting and grouping key points extracted by applying a feature detector on a scene being analyzed. The method includes grouping the extracted key points into clusters that enforce a geometric relation between members of a cluster, scoring and sorting the clusters, identifying and discarding clusters that are comprised of points which represent the background noise of the image, and sub-sampling the remaining clusters to provide a smaller number of key points for the scene.Type: ApplicationFiled: February 7, 2013Publication date: August 22, 2013Applicant: STMICROELECTRONICS S.R.LInventor: STMicroelectronics S.r.l
-
Publication number: 20130215931Abstract: A pressure sensor includes a body made of semiconductor material having a first type of conductivity and a pressure-sensitive structure having the first type of conductivity defining a suspended membrane. One or more piezoresistive elements having a second type of conductivity (P) are formed in the suspended membrane. The piezoresistive elements form, with the pressure-sensitive structure, respective junction diodes. A temperature sensing method includes: generating a first current between conduction terminals common to the junction diodes; detecting a first voltage value between the common conduction terminals when the first current is supplied; and correlating the detected first voltage value to a value of temperature of the diodes. The temperature value thus calculated can be used for correcting the voltage signal generated at output by the pressure sensor when the latter is operated for sensing an applied outside pressure which deforms the suspended membrane.Type: ApplicationFiled: February 1, 2013Publication date: August 22, 2013Applicant: STMICROELECTRONICS S.R.L.Inventor: STMicroelectronics S.r.l.