Abstract: The present application discloses a diffusion furnace, including: a furnace tube structure including a furnace tube body and a furnace bottom, a bottom of the furnace tube body being connected to the furnace bottom to form a reaction chamber; and a carrying structure including a pedestal and a plurality of cassettes disposed on the pedestal, the pedestal being disposed on the furnace bottom. By disposing the plurality of the cassettes, a height of the furnace tube body can be decreased and a width of the furnace tube body can be increased, thus enlarging a space of equipment repair and maintenance, which is favorable for the repair and maintenance of the equipment.

Abstract: Video output is generated based on first video data that depicts the user performing an activity. Poses of the user during performance of the activity are compared with second video data that depicts an instructor performing the activity. Corresponding poses of the user's body and the instructor's body may be determined through comparison of the first and second video data. The video data is used to determine the rate of motion of the user and to generate video output in which a visual representation of the instructor moves at a rate similar to the that of the user. For example, video output generated based on an instructional fitness video may be synchronized so that movement of the presented instructor matches the rate of movement of the user performing an exercise, improving user comprehension and performance.

Abstract: A package structure includes: a substrate, where a plurality of welding pads are disposed on a surface of the substrate, each of the plurality of welding pads includes a bottom layer welding pad and a top layer welding pad which are stacked onto one another, and at least two of peripheral surfaces of the top layer welding pad are protruded relative to peripheral surfaces of the bottom layer welding pad; a chip located on the substrate and spaced apart from the substrate; and a plurality of solder balls, where the plurality of solder balls are welded to the substrate and the chip, and the plurality of solder balls wrap the top layer welding pads.

Abstract: An electrostatic discharge protection structure and a chip are provided. The electrostatic discharge protection structure includes: a semiconductor substrate, an N-type well, a P-type well, a first N-type doped portion, a first P-type doped portion, a second P-type doped portion and a second N-type doped portion. The N-type well and the P-type well are located in the semiconductor substrate. The first N-type doped portion and the second P-type doped portion are located in the P-type well, and the first P-type doped portion and the second N-type doped portion are located in the N-well. The first N-type doped portion has a “T” shape structure, the first P-type doped portion has a “U” shape structure, and a part of the first N-type doped portion is located in a “U” shape opening of the first P-type doped portion.

Abstract: Memory cells are programmed to threshold voltage distributions that correspond to data states by applying a series of voltage pulses to a selected word line connected to a set of non-volatile memory cells selected for programming. Tighter threshold voltage distributions will result in fewer errors when reading the data at a later time. To create tighter threshold voltage distributions during programming, the system slows down the programming of memory cells as the memory cells approach their target threshold voltage by reducing the effective pulse width of the voltage pulses. The voltage pulses are divided into portions, with each portion corresponding to a subset of the pulse width or a subset of the time period that the voltage pulse is applied. Memory cells that are approaching their target threshold voltage will be slowed down by inhibiting those memory cells from programming during later-in-time portions of the voltage pulses.

Abstract: Provided is a semiconductor structure and a method for manufacturing the same, a memory and a method for operating the same. The semiconductor includes a substrate having a plurality of active areas close to a surface of the substrate; a gate structure located in a first structure layer on the substrate, in which the gate structure and the active areas constitute a selective transistor; and an anti-fuse bit structure located in a second structure layer on the first structure layer, and connected with an active area of one selective transistor through a first connecting structure, in which a breakdown state and a non-breakdown state of the anti-fuse bit structure represent different stored data.

Abstract: Provided is an anti-fuse structure, an anti-fuse array and a method for forming the same. The anti-fuse structure includes: a substrate; a switching device including a first gate structure, a second gate structure, a first doped region, a second doped region and a third doped region, the first and the second gate structures being arranged on the substrate, the first and the second doped regions being respectively located in the substrate at two sides of the first gate structure, and the second and the third doped regions being respectively located in the substrate at two sides of the second gate structure; and an anti-fuse device including a third gate structure and the third doped region, the second and the third gate structures being respectively located on the substrate at two sides of the third doped region, and the doped regions being configured to form a source or a drain, respectively.

Abstract: A memory device includes: two calibration resistor interfaces connected to the same ZQ calibration resistor; and a first master chip, first slave chips, a second master chip, and second slave chips, which are commonly connected to the ZQ calibration resistor; in a command mode, a first signal receiver is used to receive a ZQ calibration command, a second signal receiver is used to receive and delay the ZQ calibration command, the first slave chips and the second slave chips start to calibrate based on the ZQ flag signal, and after the calibration is completed, the first slave chips and the second slave chips send a ZQ flag signal through second transmission terminals.

Abstract: In some examples, a load adapter may include a body including an elongated shaft that includes an inlet passage that is in fluid communication with at least one outlet hole. The at least one outlet hole may be dimensioned to provide an opening area that is between approximately 5% to approximately 90% of a face of the body.

Abstract: A refresh control circuit includes the following: an address output circuit configured to output a to-be-refreshed address signal including a block address signal and a row address signal; a block decoding circuit configured to: receive the block address signal; decode the block address signal and output a first block selection signal for selecting multiple data blocks from the memory array, in response to that the memory array is subjected to no row hammer attack, or decode the block address signal and output a second block selection signal for selecting one data block from the memory array, in response to that the memory array is subjected to a row hammer attack; and a row decoding circuit, configured to receive the row address signal, decode the row address signal and output a row selection signal.

Abstract: An in-memory computing circuit includes an initial computing circuit and a target computing circuit. Herein, the initial computing circuit is configured to perform first operation processing on first data and second data to output a first operation result, and perform second operation processing on the first data and the second data to output a second operation result. The target computing circuit is configured to perform the first operation processing on the second operation result and the first operation result to output a first target result, and perform the second operation processing on the first data and the second operation result to output a second target result.

Abstract: A method for forming a semiconductor structure includes the following operations. A substrate is provided. The substrate includes double heterostructures arrayed along a first direction and a second direction. Each of the double heterostructures includes a first semiconductor layer, a second semiconductor layer and another first semiconductor layer sequentially arranged along the first direction. A forbidden band gap of the first semiconductor layer is different from a forbidden band gap of the second semiconductor layer. The first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to a direction of a plane where the substrate is located. A double gate structure is formed on sidewalls of each of the double heterostructures along the first direction.

Abstract: A signal masking circuit includes a receiving circuit, a delay control circuit, and a logical operation circuit. The receiving circuit is configured to: receive a signal to be processed and a chip select (CS) signal, and output an initial processing signal and an initial CS signal. The delay control circuit is configured to perform delay and logical control operations on the initial CS signal to obtain a CS masking signal, where a pulse width of the CS masking signal is greater than or equal to two preset clock periods. The logical operation circuit is configured to perform invalid masking on the initial processing signal according to the CS masking signal to obtain a target signal.

Abstract: A method for manufacturing a memory includes: providing a substrate and multiple discrete pseudo bit line contact layers, a plurality of active areas being provided in the substrate, and each bit line contact layer being electrically connected to the active areas; forming pseudo bit line structures at tops of the pseudo bit line contact layers; forming sacrificial layers that fill regions between the adjacent pseudo bit line structures and are located on side walls of the pseudo bit line structures and the pseudo bit line contact layers; after forming the sacrificial layers, removing the pseudo bit line structures to form through holes exposing the pseudo bit line contact layers; removing the pseudo bit line contact layers to form through holes in the substrate; and forming bit line contact layers that fill the through holes in the substrate and are electrically connected to the active areas.

Abstract: The present disclosure relates to a semiconductor structure and a manufacturing method thereof. The method of manufacturing a semiconductor structure includes: providing a base; forming a plurality of first trenches arranged in parallel at intervals and extending along a first direction, and an initial active region between two adjacent ones of the first trenches, wherein the initial active region includes a first initial source-drain region close to a bottom of the first trench, a second initial source-drain region away from the bottom of the first trench, and an initial channel region located between the first initial source-drain region and the second initial source-drain region; forming a protective dielectric layer, wherein the protective dielectric layer covers a sidewall of the second initial source-drain region and a sidewall of the initial channel region; thinning the first initial source-drain region.

Abstract: Embodiments of the present application provide a memory and a method for forming the memory. The method includes: providing a substrate, and forming a bit line structure on the substrate and a first protective layer; forming a dielectric layer with which a gap between the adjacent bit line structures is filled; forming a second protective layer to cover a top surface of the first protective layer and a top surface of the dielectric layer; removing part of the dielectric layer and part of the second protective layer to form a capacitor contact hole, and exposing the first protective layer between two adjacent ones of the capacitor contact holes; forming a conductive layer with which the capacitor contact hole is filled and the top surface of the exposed first protective layer is covered, and etching part of the conductive layer to form a separate capacitor contact structure.

Abstract: A base die is configured to: receive a first data and a first encoded data in a writing phase, where the first encoded data is obtained by performing a first error correction code (ECC) encoding processing on the first data, perform a second ECC encoding processing on a first sub-data to generate a second encoded data, and transmit a second data to a memory die in the writing phase; where the second data includes the first sub-data, a second sub-data, the first encoded data, and the second encoded data; the base die is further configured to: receive the second data from the memory die in a reading phase, perform first error checking and correction processing on the first sub-data and the second encoded data, and transmit a third data in the reading phase.

Abstract: An ambient light sensor is provided that includes a sensor input having a delta-sigma analogue to digital converter. The delta-sigma analogue to digital converter includes a switched capacitor, a common mode voltage source, a reference voltage source, and a switch network. In a first clock phase, the switch network connects the switched capacitor to charge it to either a sum or difference voltage. In a second clock phase, the switch network connects the switched capacitor to transfer charge into a summing junction. A controller controls the switch network in response to a comparator output to connect the switched capacitor to either the common mode voltage or the reference voltage while in the first clock phase.

Abstract: A refresh circuit and a memory. The refresh circuit includes: a row hammer address generation module, configured to receive a row activate command, a precharge command, and a single row address corresponding to the row activate command, and output a row hammer address corresponding to the single row address, where each of the single row addresses corresponds to a word line, the row activate command is configured to activate a word line pointed to by the single row address, and the precharge command is configured to inactivate the word line; and output the row hammer address if a single activation time of the word line is greater than a preset time; and a signal selector, configured to receive the row hammer address and a regular refresh address, and at least output the row hammer address.

Abstract: Devices and techniques are generally described for determining a recalibration frequency of a state space model. In various examples, a first hyperparameter for a first dataset may be determined. A residual value between a first data point of the first dataset and a machine learning model fitted to the first dataset may be determined. A plurality of second datasets may be generated based on the residual value. Second hyperparameters may be determined for the plurality of second datasets. A variability of the second hyperparameters may be determined. A third hyperparameter may be determined for a subset of the first dataset. A recalibration frequency may be determined for the machine learning model by comparing the third hyperparameter to the variability of the second hyperparameters.