Abstract: An architecture for testing a plurality of circuits on an integrated circuit is described. The architecture includes a TAP Linking Module located between test pins on the integrated circuit and 1149.1 Test Access Ports (TAP) of the plurality of circuits to be tested. The TAP Linking Module operates in response to 1149.1 scan operations from a tester connected to the test pins to selectively switch between 1149.1 TAPs to enable test access between the tester and plurality of circuits. The TAP Linking Module's 1149.1 TAP switching operation is based upon augmenting 1149.1 instruction patterns to affix an additional bit or bits of information which is used by the TAP Linking Module for performing the TAP switching operation.

Abstract: A peak-to-average ratio (PAR) of a signal is reduced by clipping the signal at a threshold level and replacing desired frequency tones of the clipped signal with set of frequency tones of the signal. In one embodiment, the PAR of a signal is reduced by adding a peak cancellation signal to the received signal. The peak cancellation signal is generated by clipping the received signal at a threshold level and generating a difference signal by subtracting the received signal from the clipped signal. The peak cancellation signal thus generated is scaled by a scaling factor and added to the received signal to reduce the PAR of the received signal. The scaling factor is adjusted to maintain the desired quality of the received signal. In one embodiment, the PAR of an orthogonal frequency division multiplexed (OFDM) signal may be reduced.

Abstract: High voltage bipolar transistors built with a BiCMOS process sequence exhibit reduced gain at high current densities due to the Kirk effect. Threshold current density for the onset of the Kirk effect is reduced by the lower doping density required for high voltage operation. The widened base region at high collector current densities due to the Kirk effect extends laterally into a region with a high density of recombination sites, resulting in an increase in base current and drop in the gain. The instant invention provides a bipolar transistor in an IC with an extended unsilicided base extrinsic region in a configuration that does not significantly increase a base-emitter capacitance. Lateral extension of the base extrinsic region may be accomplished using a silicide block layer, or an extended region of the emitter-base dielectric layer. A method of fabricating an IC with the inventive bipolar transistor is also disclosed.

Abstract: In one aspect of the present invention, an integrated circuit package with an exposed die and a protective housing will be described. The housing extends beyond the exposed back surface of the die to help protect it from damage. The integrated circuit package includes a lead frame and an integrated circuit die. The integrated circuit die is electrically and physically attached to the lead frame. The housing encapsulates the lead frame and the die. The housing also includes a recessed region at the bottom of the package where the back surface of the die is exposed. There is a protruding protective structure at the bottom of the package that helps to protect the die and prevent its exposed back surface from coming in contact with an external object.

Abstract: Navigation system receiver, and test circuits and methods for determining drift profile of a receiver clock in the navigation system receiver are disclosed. In an embodiment, the navigation system receiver includes a clock source configured to generate a receiver clock for the navigation system receiver and a test circuit. The test circuit is configured to facilitate determination of a drift profile associated with the receiver clock based on detection and tracking of a test signal received by the test circuit, where the test signal comprises at least one continuous wave (CW) signal.

Abstract: A device and method of reducing residual STI corner defects in a hybrid orientation transistor comprising, forming a direct silicon bonded substrate wherein a second silicon layer with a second crystal orientation is bonded to a handle substrate with a first crystal orientation, forming a pad oxide layer on the second silicon layer, forming a nitride layer on the pad oxide layer, forming an isolation trench within the direct silicon bonded substrate through the second silicon layer and into the handle substrate, patterning a PMOS region of the direct silicon bonded substrate utilizing photoresist including a portion of the isolation trench, implanting and amorphizing an NMOS region of the direct silicon bonded substrate, removing the photoresist, performing solid phase epitaxy, performing a recrystallization anneal, forming an STI liner, completing front end processing, and performing back end processing.

Abstract: Embodiments of the invention provide a pulseoximetry system with ambient offset cancellation that subtracts an estimated ambient offset to thereby allow a large front end gain while operating the front end on a low supply voltage. This large gain reduces input referred noise of an analog to digital converter in the front end while providing high dynamic range for signals with a large ambient offset.

Abstract: A hot swap controller includes a shunt resistor (32-1,2) and a power transistor (37-1,2) having a source coupled to a load maintains the first power transistor in a fully-turned-on condition to cause it to deliver a load current contribution (IL1,2) which flows through the shunt resistor and the power transistor to the load (25). Current sensing circuitry (35-1,2) produces a first control signal (V45-1,2-V47-1,2) equal to the difference between a DC component (V47-1) proportional to a first load current contribution (IL1) flowing in the first shunt resistor and a feedback-based component (V45-1). A control amplifier (49-1,2) produces a second control signal (V51-1,2) in response to the first control signal to modify a drive signal (53-1) to the power transistor so as to reduce a channel resistance of the power transistor if the first control signal exceeds a predetermined level.

Abstract: A high-speed unity-gain input buffer steers the current that flows down a first path to an output node, and down a second path in response to an analog input signal. The current that flows down the second path is mirrored to sink a current out of the output node.

Abstract: An address and command port interface selectively enables JTAG TAP domain operations and Trace domain operations within an IC. The port carries TMS and TDI input and TDO output on a single pin and receives a clock signal on a separate pin. The addressable two pin interface loads and updates instructions and data to the TAP domain within the IC. The instruction or data update operations in multiple ICs occur simultaneously. A process transmits data from an addressed target device to a controller using data frames, each data frame comprising a header bit and data bits. The logic level of the header bit is used to start, continue, and stop the data transmission to the controller. A data and clock signal interface between a controller and multiple target devices provides for each target device to be individually addressed and commanded to perform a JTAG or Trace operation.

Abstract: A dielectric waveguide may be manufactured by forming a set of parallel channels in a planar sheet that has a lower dielectric constant value. The set of channels is then filled with a material having a higher dielectric constant value. The planar sheet is sliced into a plurality of strips that each contain one or more of the channels.

Abstract: An electronic package that has an array of pins may be tested for shorts and continuity in a parallel manner. The array of pins are allocated to four or more groups of pins such that each pin in each group is not adjacent to a pin from its own group of pins. One of the groups of pins is tested for continuity while placing a reference voltage level on all of the pins in the other groups of pins. A separate current source is coupled to each pin and a resultant voltage is measured. A short between one of the pins in the first group and a pin in one of the other groups can be detected when the resultant voltage on one of the pins in the first group is approximately equal to the reference voltage. Group-wise testing is repeated until all groups have been tested.

Abstract: A method of assembling semiconductor devices includes connecting a bond wire between a bond pad on a top side surface of a semiconductor die having its bottom side surface attached to a package substrate and a bonded area within a metal terminal of the package substrate, where a bond is formed along a bonding interface between the bond wire and bonded area. After the connecting, a metal paste is applied including a plurality of metal particles and a binder over the bonded area. The metal paste is sintered to densify the plurality of metal particles to form reinforcement material including within a portion of the bonding interface for providing improved wirebond performance, such as increased pull strength.

Abstract: Elongated metal contacts with longitudinal axes that lie in a first direction are formed to make electrical connections to elongated source and drain regions with longitudinal axes that lie in the first direction, and elongated metal contacts with longitudinal axes that lie a second direction are formed to make electrical connections to elongated source and drain regions with longitudinal axes that lie the second direction, where the second direction lies orthogonal to the first direction.

Abstract: A driver circuit includes a first current source configured to sink part of the current from a power supply through a load and a second current source configured to sink part of the current from the power supply to a return path, bypassing the load, so that the current through the load is the difference between the current from the power supply and the current through the second current source.

Abstract: An apparatus and method for reducing interference signals using multiphase clocks. An integrated circuit includes a digital circuit and an analog circuit. The digital circuit includes a derived clock circuit configured to receive a root clock having a frequency D*f, D being a divide factor, to divide the root clock by D, and generate multiphase clocks having N phases. N circuits of the digital circuit are configured to receive a corresponding one of the N phases, with edges of the multiphase clocks being spread over the N phases. The multiphase clocks cause a frequency shift in interference signals generated by reduced periodic peak currents drawn by the N circuits from f to N*f and harmonics thereof. The analog circuit receives an in-band range of signals. A value of N is configured to shift the interference signals outside the in-band range of signals.

Abstract: A loop antenna is provided. The apparatus comprises a substrate, a first metallization layer, and a second metallization layer. The substrate has first and second feed terminals and a ground terminal. The first metallization layer is disposed over the substrate and includes a first window conductive region, a first conductive region, a second conductive region, and a third conductive region. The first conductive region is disposed over and is in electrical contact with the first feed terminal; it is also is substantially circular and located within the first window region. The second conductive region is disposed over and is in electrical contact with the second feed terminal; it is also substantially circular and is located within the first window region. The a third conductive region is disposed over and is in electrical contact with the ground terminal, and the third conductive region substantially surrounds the first window region.

Abstract: Various apparatuses, methods and systems for damping a current driver are disclosed herein. For example, some embodiments provide an apparatus for supplying current, including an output transistor connected between a voltage supply and a current output, and an active clamp connected between the current output and a current sink. The active clamp is adapted to connect the current output to the current sink when a voltage at the current output reaches a predetermined state relative to a voltage at a control input of the output transistor.

Abstract: An average current mode buck-boost DC to DC converter has a buck stage coupled between an input voltage source terminal and an output terminal. A boost stage is coupled between the input voltage source terminal and the output terminal. A current ramp control circuit generates a ramp signal for driving the buck and boost stages, the ramp signals being coupled to the buck and boost stages. A constant voltage related to the desired output voltage by a constant is applied directly to both a voltage control feedback loop for adjusting the output voltage and directly to an input to the current ramp control circuit, whereby the output voltage can be shifted from one voltage to another by feedforward control.

Abstract: A secure environment is established within a system on a chip (SoC) without the use of a memory management unit. A set of security parameters is produced by a configuration program executed by a processor within the SoC that is read from a first non-volatile memory within the SoC. A set of stored parameters is created in a committable non-volatile memory within the SoC by writing the set of security parameters into the committable non-volatile memory. The committable non-volatile memory is sealed so that that it cannot be read or written by the processor after being sealed. The stored parameters can then be accessed only by control circuitry. Security circuitry within the SoC is configured using the stored parameters each time the SoC is initialized and thereby enforces the secure environment within the SoC.