Abstract: A method for compiling and executing a nested loop includes initializing a nested loop controller with an outer loop count value and an inner loop count value. The nested loop controller includes a predicate FIFO. The method also includes coalescing the nested loop and, during execution of the coalesced nested loop, causing the nested loop controller to populate the predicate FIFO and executing a get predicate instruction having an offset value, where the get predicate returns a value from the predicate FIFO specified by the offset value. The method further includes predicating an outer loop instruction on the returned value from the predicate FIFO.

Abstract: A system includes an input voltage supply and advanced current mode (ACM) converter device coupled to the input voltage supply. The ACM converter device (102) includes a pulse-skipping mode (PSM) transitions controller configured to switch between PSM and discontinuous conduction mode (DCM). The system also includes an output inductor coupled to a switch node of the ACM converter device. The system also includes an output capacitor with a first terminal coupled to the output inductor and a second terminal coupled to a ground node. The system also includes a voltage divider in parallel with the output capacitor, where the voltage divider is configured to provide a feedback voltage to the ACM converter device.

Abstract: A method of de-mosaicing pixel data from an image processor includes generating a pixel block that includes a plurality of image pixels. The method also includes determining a first image gradient between a first set of pixels of the pixel block and a second image gradient between a second set of pixels of the pixel block. The method also includes determining a first adaptive threshold value based on intensity of a third set of pixels of the pixel block. The pixels of the third set of pixels are adjacent to one another. The method also includes filtering the pixel block in a vertical, horizontal, or neutral direction based on the first and second image gradients and the first adaptive threshold value utilizing a plurality of FIR filters to generate a plurality of component images.

Abstract: A photoplethysmogram system includes a plurality of sensors, each sensor capable of providing a sensor signal, and an adaptive filter capable of receiving a first input signal and computing an output. The photoplethysmogram system is capable of operating the filter in sequential stages, such that at each different stage the first input signal is a different sensor signal.

Abstract: Described examples include a process that includes forming a diffusion barrier layer on a backside of a semiconductor wafer. The process also includes forming a seed copper layer on the diffusion barrier layer. The process also includes forming a copper layer on the seed copper layer. The process also includes immersion plating a silver layer on the copper layer.

Abstract: Systems, methods and computer readable mediums are presented for encoding a stream of input video frames, in which the input video frames are down sampled and the down sampled frames are encoded in a first encoding pass to generate a set of first pass coded frames forming a single first pass I frame and a plurality of first pass P frames formed into first pass sub-groups of pictures (SUB-GOPs). First pass encoding statistics are generated for individual first pass SUB-GOPs, and the statistics are used to encode the input video frames in a second encoding pass to generate a set of second pass coded frames.

Abstract: The disclosure describes a novel method and apparatus for improving interposers that connected stacked die assemblies to system substrates. The improvement includes the addition of IEEE 1149.1 circuitry within interposers to allow simplifying interconnect testing of digital and analog signal connections between the interposer and system substrate it is attached too. The improvement also includes the additional 1149.1 controlled circuitry that allows real time monitoring of voltage supply and ground buses in the interposer. The improvement also includes the additional of 1149.1 controlled circuitry that allows real time monitoring of functional digital and analog input and output signals in the interposer. The improvement also provides the ability to selectively serially link the 1149.1 circuitry in the interposer with 1149.1 circuitry in the die of the stack.

Abstract: A method includes applying a die attach material to a die pad of an integrated circuit package. The die attach material is employed as a bonding material to the die pad. The method includes mounting an integrated circuit die to the die pad of the integrated circuit via the die attach material. The method includes printing an adhesion deposition material on the die attach material appearing at the interface of the integrated circuit die and the die pad of the integrated circuit package to mitigate delamination between the integrated circuit die and the die pad.

Abstract: Disclosed examples include isolated dual active bridge (DAB) DC to DC converters with first and second bridge circuits, a transformer with a sense coil, and a secondary side control circuit to provide secondary side switching control signals to regulate an output voltage or current signal by controlling a phase shift angle between switching transitions of the secondary side switching control signals and switching transitions of a secondary side clock signal, where the secondary side control circuit includes a clock recovery circuit to synchronize the secondary side clock signal to transitions in a sense coil voltage signal of the sense coil.

Abstract: Methods and apparatus to increase efficiency of a power converter using a bias voltage on a low side drive gate are disclosed. An example power converter includes an inductor; a transistor coupled to the inductor; and a driver coupled to a gate of the transistor, the driver to apply (A) a first voltage to the gate to enable the transistor, (B) a second voltage to the gate to disable the transistor, and (C) a third voltage to the gate during a transition between applying the first voltage and the second voltage, the third voltage being between the first voltage and the second voltage.

Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to measure a resonant sensor based on detection of group delay. An example apparatus includes a modulation manager configured to query the resonant sensor with a modulated signal including a frequency; and a resonance determiner configured to determine a resonance frequency of the resonant sensor based on a group delay associated with the resonant sensor and the frequency.

Abstract: Methods, systems, and apparatus to correct gate bias for a diode-connected transistor are disclosed. An example apparatus includes a first resistor including a first resistor terminal and a second resistor terminal; a second resistor including a first resistor terminal and a second resistor terminal; a first transistor including a current terminal and a gate terminal, the current terminal of the first transistor coupled to the first resistor terminal of the first resistor and the gate terminal of the first transistor is coupled to the second resistor terminal of the first resistor; and a second transistor including a first current terminal and a second current terminal, the first current terminal of the second transistor coupled to the gate terminal of the first transistor, and the second current terminal of the second transistor coupled the first current terminal of the second resistor.

Abstract: In described examples, an apparatus is arranged to generate a linear term, a quadratic term, and a constant term of a transcendental function with, respectively, a first circuit, a second circuit, and a third circuit in response to least significant bits of an input operand and in response to, respectively, a first, a second, and a third table value that is retrieved in response to, respectively, a first, a second, and a third index generated in response to most significant bits of the input operand. The third circuit is further arranged to generate a mantissa of an output operand in response to a sum of the linear term, the quadratic term, and the constant term.

Abstract: Described examples include microelectronic devices and integrated circuits with an active first circuit in a first segment of a first wafer, a second circuit in a second segment of the first wafer, and second and third wafers bonded to different surfaces of the first wafer to provide first and second cavities with surfaces spaced from the first segment. An opening extends through the first wafer between the first and second cavities to separate portions of the first and second segments and to form a sealed cavity that surrounds the first segment. A bridge segment of the first wafer supports the first segment in the sealed cavity and includes one or more conductive structures to electrically connect the first and second circuits.

Abstract: An integrated circuit includes a combined serial data output and interrupt output terminal, a serial communication control circuit; an interrupt generation circuit, and an output circuit. The output circuit includes a serial data input, an interrupt input, and a combined serial data and interrupt output. The serial data input is coupled to a serial data output of the serial communication circuit. The interrupt input is coupled to an interrupt output of the interrupt generation circuit. The combined serial data and interrupt output is coupled to the combined serial data output and interrupt output terminal.

Abstract: In described examples, a first clock generator generates an output clock signal in response to an input reference signal and in response to a feedback signal that is generated in response to the output clock signal. A code generator generates a code in response to the input reference signal. A loss detector generates an indication of a loss of the input reference signal in response to the feedback signal and at least two codes generated by the code generator.

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

Abstract: A comparator circuit includes a first transistor configured to receive a first input and a second transistor configured to receive a second input. The comparator circuit further includes a third transistor coupled to a terminal of each of the first and second transistors. The third transistor is configured to be controlled by a first control signal. A gate of a fifth transistor is coupled to a terminal of a fourth transistor at a first node and a gate of the fourth transistor is coupled to a terminal of the fifth transistor at a second node. A sixth transistor is coupled between the first and fourth transistors. A seventh transistor is coupled between the second and fifth transistors. A gate of the sixth transistor and a gate of the seventh transistor are coupled together at a fixed voltage level.

Abstract: A delta-sigma modulator includes a first integrator and a comparator. The comparator's positive input couples to the first integrator's positive output, and the comparator's negative input couples to the first integrator's negative output. A first current DAC comprises a current source device, and first and second transistors. The first transistor has a first transistor control input and first and second current terminals. The first current terminal couples to the current source device, and the second current terminal couples to the first integrator positive output. The second transistor has a second transistor control input and third and fourth current terminals. The third current terminal couples to the current source device, and the fourth current terminal couples to the first integrator negative output. A first capacitive device couples to the second transistor control input and to both the second current terminal and the first integrator positive output.

Abstract: Disclosed embodiments relate to a dNap architecture that accurately transitions cache lines to full power state before an access to them. This ensures that there are no additional delays due to waking up drowsy lines. Only cache lines that are determined by the DMC to be accessed in the immediate future are fully powered while others are put in drowsy mode. As a result, we are able to significantly reduce leakage power with no cache performance degradation and minimal hardware overhead, especially at higher associativities. Up to 92% static/Leakage power savings are accomplished with minimal hardware overhead and no performance tradeoff.