Abstract: A method, which forms an air-bubble-free thin film with a high-viscosity fluid resin, initially dispenses the fluid resin on an outer region of a semiconductor wafer while the semiconductor wafer is spinning, and then dispenses the fluid resin onto the center of the semiconductor wafer after the semiconductor wafer has stopped spinning.

Abstract: Disclosed examples include pipeline ADC, balancing circuits and methods to balance a load of a reference circuit to reduce non-linearity and settling effects for a reference voltage signal, in which balancing capacitors are connected to a voltage source in a pipeline stage ADC sample time period to precharge the balancing capacitors using a voltage above the reference voltage, and a selected set of the precharged balancing capacitors is connected to provide charge to the output of the reference circuit during the second time period.

Abstract: A static random access memory (SRAM) features reduced write cycle power consumption. The SRAM includes an array of static storage cells and a write controller. The array of static storage cells is accessible via a plurality of word lines and a plurality of bit lines, and is arranged to access multiple bits via each of the word lines. The write controller controls writing to the static storage cells. The write controller is configured to perform consecutive writes to a plurality of addresses associated with a same one of the word lines, and to, in conjunction with the consecutive writes, perform fewer precharges of the bit lines than consecutive writes.

Abstract: A method of forming bond pads includes providing a substrate including an integrated circuit (IC) device formed thereon having an oxidizable uppermost metal interconnect layer which provides a plurality of bond pads that are coupled to circuit nodes on the IC device. The plurality of bond pads include a metal bond pad area. At least one passivation layer provides a trench including dielectric sidewalls above the metal bond pad area. A ruthenium (Ru) layer is deposited directly on the dielectric sidewalls and directly on the metal bond pad area, which removes the need for a barrier layer lining the dielectric sidewalls of the trench. The Ru layer is patterned to provide a bond pad surface for the plurality of bond pads.

Abstract: Channel state information (CSI) feedback in a wireless communication system is disclosed. A precoding matrix is generated for multi-antenna transmission based on precoding matrix indicator (PMI) feedback, wherein the PMI indicates a choice of precoding matrix derived from a matrix multiplication of two matrices from a first codebook and a second codebook. In one embodiment, the first codebook comprises at least a first precoding matrix constructed with a first group of adjacent Discrete-Fourier-Transform (DFT) vectors. In another embodiment, the first codebook comprises at least a second precoding matrix constructed with a second group of uniformly distributed non-adjacent DFT vectors.

Abstract: A processor includes a plurality of execution units. At least one of the execution units is configured to repeatedly execute a first instruction based on a first field of the first instruction indicating that the first instruction is to be iteratively executed.

Abstract: An integrated circuit is formed by providing a heavily doped substrate of a first conductivity type, forming a lightly doped lower epitaxial layer of the first conductivity type over the substrate, implanting dopants of the first conductivity type into the lower epitaxial layer in an area for a shallow component and blocking the dopants from an area for a deep component, forming a lightly doped upper epitaxial layer over the lower epitaxial layer and activating the implanted dopants to form a heavily doped region. The shallow component is formed over the heavily doped region, and the deep component is formed outside the heavily doped region, extending through the upper epitaxial layer into the lower epitaxial layer.

Abstract: Systems and methods for routing protocols for power line communications (PLC) are described. In some embodiments, a method performed by a PLC device, such as a PLC meter, may include active discovering and identifying at least one bootstrapping agent and a personal area network (PAN) identifier for one or more networks that are operating within a personal operating space of the PLC device. The device selects a target bootstrapping agent to use for the join process with a target network. The target bootstrapping agent may be selected from a list of bootstrapping agents associated with the target PAN identifier. If the attempt to join the target network fails, then the device further determines if other bootstrapping agents are associated with the target PAN identifier. The device selects an alternate target bootstrapping agent from the other bootstrapping agents that are associated with the target PAN identifier and reattempts the join process.

Abstract: This invention generally relates to the technical field of integrated circuits. More specifically the invention relates to output stages for providing an output signal, into which an integrated circuit may be used. An aspect relates to an integrated circuit capable of driving an external class-B output stage in a manner that allows providing a continuous output signal over the full range of desired outputs. The integrated circuit may comprise a class-AB output stage working in conjunction with the class-B output stage so as to provide a hybrid output stage. The integrated circuit may prevent dead band problems commonly faced when employing a class-B output stage. The integrated circuit may also reduce the quiescent current of the hybrid output stage. This may have further advantages, such as for example, the output stage producing less heat/power than needs to be dissipated.

Abstract: An integrated circuit (IC) package, device, including a substrate having a top surface with an IC die mounting area and a peripheral area surrounding the mounting area, a plurality of parallel conductor layers, a plurality of insulating layers and a plurality of plated through holes (PTHs) extending through the conductor layers and insulating layers. Various substrate structures in which certain of the PTHs and/or conductor layers and/or insulating layers have different CTE's than the others is disclosed. The various structures may reduce circuit failures due to substrate warpage and/or solder joint damage associated with a CTE mismatch between the substrate and the IC die.

Abstract: Radiation hardened NMOS devices suitable for application in NMOS, CMOS, or BiCMOS integrated circuits, and methods for fabricating them. A device includes a p-type silicon substrate, a field oxide surrounding a moat region on the substrate tapering through a Bird's Beak region to a gate oxide within the moat region, a heavily-doped p-type guard region underlying at least a portion of the Bird's Beak region and terminating at the inner edge of the Bird's Beak region, a gate included in the moat region, and n-type source and drain regions spaced by a gap from the inner edge of the Bird's Beak and guard regions. A variation of minor alterations to the conventional moat and n-type source/drain masks. The resulting devices have improved radiation tolerance while having a high breakdown voltage and minimal impact on circuit density.

Abstract: A first rendering of symbols is generated with typeset font, and the first rendering is displayed by a display device. From among the symbols, a selection is received from a user. A second rendering of the selection is generated with ink font, and the second rendering is displayed by the display device. At least one handwritten edit to the second rendering is received from the user, and recognition of the handwritten edit is performed. The selection is updated to incorporate the recognized handwritten edit. A third rendering of the updated selection is generated with typeset font, and the third rendering is displayed by the display device for replacing at least a portion of the first rendering.

Abstract: Several methods and systems for masking multimedia data are disclosed. In an embodiment, a method for masking includes performing a prediction for at least one multimedia data block based on a prediction mode of a plurality of prediction modes. The at least one multimedia data block is associated with a region of interest (ROI). A residual multimedia data associated with the at least one multimedia data block is generated based on the prediction. A quantization of the residual multimedia data is performed based on a quantization parameter (QP) value. The QP value is variable such that varying the QP value controls a degree of masking of the ROI.

Abstract: A process of forming an integrated circuit forms a high precision capacitor bottom plate with a metallic surface and performs a plasma treatment of the metallic surface. A high precision capacitor dielectric is formed by depositing a first layer of the capacitor dielectric on the high precision capacitor bottom plate wherein the first layer is silicon nitride, depositing a second layer of the capacitor dielectric on the first layer wherein the second portion is silicon dioxide, and depositing a third layer of the capacitor dielectric on the second portion wherein the third layer is silicon nitride. Plasma treatments may also be performed on the layers of capacitor dielectric pre- and/or post-deposition. A metallic high precision capacitor top plate is formed on the high precision capacitor dielectric.

Abstract: A bandwidth estimator circuit for an analog to digital converter. The bandwidth estimator computes a bandwidth estimate of an analog signal and includes: an amplitude averaging block configured to determine an average change in amplitude of N samples, a delta time block configured to determine a minimum time difference; a peak voltage block configured to determine the maximum magnitude; a peak to root mean square block configured to determine a ratio of a peak voltage to the root mean square of the magnitude; a bandwidth estimator block configured to compute a product of a ratio of the average change in amplitude to the minimum time difference, multiplied by a ratio of the peak voltage to the root mean square, squared, to the peak voltage multiplied by a constant; and a parameter adjustment circuit configured to modify sampler parameters controlling an analog signal sampling rate. Methods are described.

Abstract: A regulated charge pump power supply is implemented with a QP regulation loop providing QP clocking to control pumping operation based on sensing output voltage using residual charge on a flying capacitor Cfly. Cfly is used not only in normal charge pumping operation as an active charge shuttle element, but also to determine/measure output voltage VOUT. Voltage sensing using measured residual charge on Cfly is accomplished by introducing a sample phase into the normal charge pumping operation—after the pump phase and before the charge phase. In the sample phase, VOUT is determined (sampled) based on the residual charge on Cfly corresponding to (Vsense=VOUT?VIN). During the sample phase, the Cfly bottom plate is connected to ground, and the Cfly top plate is sampled (such as with a sense capacitor), with the sample phase completed prior to initiating a charge phase (by connecting the Cfly top plate to VIN).

Abstract: An integrated circuit includes a diode/bipolar ESD protection device. The diode/bipolar ESD device includes at least one gate separated ESD diode and at least one gate spaced ESD bipolar transistor coupled in parallel between a fixed voltage and an input/output pin.

Abstract: An electronic device comprising a semiconductor structure having a back end capacitor and a back end thin film resistor and a method of manufacturing the same. The semiconductor structure includes a first dielectric layer, a bottom plate of the capacitor and a thin film resistor body. The bottom plate and the resistor body are laterally spaced apart portions of the same thin film layer. The bottom plate further includes a conductive layer overlying the thin film layer. A second dielectric layer is disposed on the conductive layer of the bottom plate of the capacitor. A top plate of the capacitor is disposed on the second dielectric layer.

Abstract: At least one tone is generated. An output signal is generated in response to an input signal and the at least one tone. The output signal is modulated. The input signal and the at least one tone are represented in the modulated output signal. The at least one tone is outside a bandwidth of the input signal as represented in the modulated output signal. The modulated output signal is amplified. The at least one tone in the amplified signal is attenuated after the amplifying.

Abstract: A method of bonding or debonding objects includes providing a first object including a first substrate with moveable features thereon which provide an actuated and a non-actuated state having different protrusion from the first substrate or a different curvature. A second object has an array of loops thereon. The moveable features while in one of the actuated state and non-actuated state are positioned, sized and shaped to fit within the loops. The moveable features include or are mechanically coupled to a material which responds to application of an actuating condition including electrical current, temperature, or an electromagnetic field by changing between the actuated state and the non-actuated state. Electrical current, temperature, or an electromagnetic field is automatically applied or changed to trigger a state change between the actuated state and non-actuated state that results in a bonding event or a debonding event between the first object and the second object.