Abstract: A method and apparatus for assembling a semiconductor device. A chip (901) with solder bodies (903) on its contact pads is flipped onto a substrate (904). After the reflow process, a gap (910) spaces chip and substrate apart. A polymer precursor is selected for its viscosity of known temperature dependence. The apparatus has a plate (800) with heating and cooling means to select and control a temperature profile from location to location across the plate. After preheating, the assembly is placed on a mesa (801) of the plate configured to heat only a portion of the substrate. Movable capillaries (840, 921) blow cooled gas onto selected locations of the assembly. After the temperature profile is reached, a quantity of the precursor is deposited at a chip side and pulled into the gap by capillary action. The capillary flow is controlled by controlling the precursor viscosity based on the temperature profile, resulting in a substantially linear front, until the gap is filled substantially without voids.

Abstract: An embodiment of the invention provides a method of reducing a drop in voltage on a pre-biased output of a DC-DC step-down switching converter. A high side switch is activated to conduct a first current to the pre-biased output. After the high side switch is activated, a low side switch is activated to draw a second current from the pre-biased output such that the magnitude of the first current is greater than the magnitude of the second current for at least a portion of a time period T1. After the time period T1 ends, the magnitudes of the first and second currents are changed to maintain a predetermined voltage on the pre-biased output.

Abstract: A scannable integrated circuit (100) including a functional integrated circuit (P1, P2) having scan chains, multiple scan decompressors (120.1, 120.2), each operable to supply scan bits to some of the scan chains (101.k, 102.k), a shared scan-programmable control circuit (110, 300), a tree circuit (400) coupled with the functional integrated circuit (P1, P2), the shared scan-programmable control circuit (110, 300) coupled to control the tree circuit (400), and a selective coupling circuit (180) operable to provide selective coupling with the shared scan-programmable control circuit (110, 300) for scan programming through any of the multiple scan decompressors (120.1, 120.2). Other circuits, devices, systems, and processes of operation and manufacture are disclosed.

Abstract: A DC-to-DC converter has a leading full-bridge inverter and a lagging full-bridge inverter for receiving a DC input and producing respective AC output voltages. A full-wave rectifier circuit rectifies the AC output voltages to produce a rectified output voltage, which is filtered by a current doubling output filter circuit to produce a DC output voltage. A master phase-shift controller and a slave phase-shift controller respectively provide first and second control signals to the leading full-bridge inverter and third and fourth control signals to the lagging full-bridge inverter to regulate the DC output voltage by changing a phase of the second and fourth control signals with respect to the first and third control signals below a predetermined DC output voltage, and by changing a phase of the third and fourth control signals with respect to the first and second control signals above the predetermined threshold.

Abstract: A wireless communications device (110) has a digital section (800) and a radio frequency section (840). The digital section (800) does setup and execution on a set of data in at least first and second threads concurrently in a series of overlapping iterations by dividing the set of data into at least two different subsets and concurrently reading and writing in both subsets. A state machine (1010, 1100) is shared by the setup and execution iterations. Two or more memory units (930, 940) segregate the set of data, the predetermined size of the set of data in the memories (930, 940) combined comprehending the total number of addresses occupied by the set of data utilized in operation of circuitry (910). Dirty bits (1430) are accessible at addresses corresponding to addresses in the memory. A selector circuit (1412) has a selector output selectively coupled to an address line, and to a data line.

Abstract: An example embodiment provides a resizer in an image processing system. The resizer includes a receiving module that receives pixel data representative of an image. A triple line buffer is coupled to the receiving module that stores the pixel data in response to a write control signal from control logic. The triple line buffer is operated as a circular buffer. The resizer further includes a resizer core that reads pixel data from the triple line buffer in response to a read control signal from the control logic. The pixel data is replicated to up-scale the image vertically according to a vertical up-scale ratio such that the resizer achieves a maximum input data rate and also eliminates an overflow condition in the resizer. The vertical up-scale ratio is a fraction.

Abstract: A wireless receiver for multiple frequency bands reception includes a single receive radio frequency (RF) circuit (160, 170) having an RF bandpass substantially confined to encompass at least two non-overlapped such frequency bands at RF, a single in-phase and quadrature (approximately I, Q) pair of intermediate frequency (IF) sections (120I, 120Q) having an IF passband, and a mixer circuit (110) including an in-phase and quadrature (I,Q) pair of mixers (110I, 110Q) fed by said RF circuit (160, 170) and having a local oscillator (100) with in-phase and quadrature outputs coupled to said mixers (110I, 110Q) respectively, said mixer circuit (110) operable to inject and substantially overlap the at least two non-overlapped frequency bands with each other into the IQ IF sections (120I, 120Q) in the IF passband, the IF passband substantially confined to a bandwidth encompassing the thereby-overlapped frequency bands. Other receivers, circuits.

Abstract: An integrated circuit containing a SRAM memory with SRAM bits optimized to have a lower minimum read voltage than the minimum write voltage. A method for reading a SRAM memory bit using a read voltage that is lower than the write voltage.

Abstract: A voltage clamping circuit includes a current source having a fixed current source and a variable current source and a variable resistor receiving current from the current source. The variable resistor varies its resistance in response to an environmental operating condition. The voltage clamping circuit also includes an amplifier configured to compare a sensor node voltage with a reference voltage, the sensor node voltage being in communication with the voltage drop across the variable resistor. The amplifier is configured and connected to provide a control output to control the variable current source to modify current output from the variable current source to at least in part prevent the sensor node voltage from exceeding a reference voltage when certain operating conditions are present.

Abstract: An illumination source and a method therefor. A light source includes a light circuit configured to process light and direct light, and a lighting element optically coupled to the light circuit to provide multiple colors of light. The light circuit propagates light using light guides. The use of light guides eliminates the use of free space optical elements, enabling the creation of more compact light sources. Furthermore, the use of light guides may enable the creation of light sources with fewer mechanical restrictions, thereby making the light sources potentially more reliable and less expensive.

Abstract: The present invention provides a method for forming a semiconductor device, as well as a semiconductor device. The method for manufacturing a semiconductor device, among others, includes providing a gate structure (240) over a substrate (210), the gate structure (240) including a gate electrode (248) located over a nitrided gate dielectric (243), and forming a nitrided region (310) over a sidewall of the nitrided gate dielectric (243).

Abstract: A mobile communication system is designed with an input circuit coupled to receive a first plurality of signals (rj(i+?j), i=0?N?1) during a first time (T0-T1) from an external source and coupled to receive a second plurality of signals (rj (i+?j), i=N?2N?1) during a second time (T1-T2) from the external source. The input circuit receives each of the first and second plurality of signals along respective first and second paths (j). The input circuit produces a first input signal (Rj1) and a second input signal (Rj2) from the respective first and second plurality of signals. A correction circuit is coupled to receive a first estimate signal (?j1), a second estimate signal (?j2) and the first and second input signals. The correction circuit produces a first symbol estimate ({tilde over (S)}1) in response to the first and second estimate signals and the first and second input signals.

Abstract: A secure demand paging system (1020) includes a processor (1030) operable for executing instructions, an internal memory (1034) for a first page in a first virtual machine context, an external memory (1024) for a second page in a second virtual machine context, and a security circuit (1038) coupled to the processor (1030) and to the internal memory (1034) for maintaining the first page secure in the internal memory (1034).

Abstract: Within a wireless network, uplink control information (UCI) transmitted by user equipment is received by a base station. The UCI includes a least two elements, a first set of symbols produced using a first information element and a second set of symbols produced using a second information element. At least a first metric is produced using the first set and the second set of received symbols. The first information element may then be detected using the first metric.

Abstract: The disclosure describes novel methods and apparatuses for controlling a device's TCA circuit when the device exists in a JTAG daisy-chain arrangement with other devices. The methods and apparatuses allow the TCA test pattern set used during device manufacturing to be reused when the device is placed in a JTAG daisy-chain arrangement with other devices, such as in a customers system using the device. Additional embodiments are also provided and described in the disclosure.

Abstract: A wireless communication system (10). The system comprises transmitter circuitry (BST1) comprising circuitry for transmitting a plurality of frames to a receiver in a first cell (Cell 1). Each of the plurality of frames comprises a bit group (22), and the bit group uniquely distinguishes the first cell from a second cell (Cell 2) adjacent the first cell. The transmitter circuitry further comprises circuitry (54) for inserting a bit sequence into the bit group. The bit sequence is selected from a plurality of bit sequences (S1-SK) such that successive transmissions by the transmitter circuitry comprise a cycle of successive ones of the plurality of bit sequences.

Abstract: The disclosure provides an apparatus for reducing speckle in a projection visual display (PVD) system, a method of reducing visible speckle in a PVD system and a PVD system incorporating the method or apparatus. In one embodiment, the apparatus includes a diffuser interposable in an optical path of a PVD system and a diffuser actuator having a single drive axis configured to cause the diffuser to travel in a Lissajous curve at least partially transverse to the optical path.

Abstract: An electronic circuit (4000) includes a bias value generator circuit (3900) operable to supply a varying bias value in a programmable range, and an instruction circuit (3625, 4010) responsive to a first instruction to program the range of said bias value generator circuit (3900) and further responsive to a second instruction having an operand to repeatedly issue said second instruction with said operand varied in an operand value range determined as a function of the varying bias value.

Abstract: Special test circuitry in an IC for wafer level testing selectively connects the specialized test circuitry to the functional circuitry during wafer test. Following wafer test the special test circuitry is electrically isolated from the functional circuitry and power supplies such that it does not load functional circuit signals nor consume power.

Abstract: An IC includes an IEEE 1149.1 standard test access port (TAP) interface and an additional Off-Chip TAP interface. The Off-Chip TAP interface connects to the TAP of another IC. The Off Chip TAP interface can be selected by a TAP Linking Module on the IC.