Abstract: A register circuit adapted to store data is described. The register circuit comprises a master-slave flip flop coupled to receive the data to be stored by the master-slave flip flop at an input; and a delay element coupled to the master-slave flip flop, the delay element receiving a reference clock signal and generating a slave clock signal the slave clock signal which is delayed relative to a master clock signal. A method of storing data in a register circuit is also described.

Abstract: A circuit includes a complimentary metal-oxide semiconductor (CMOS) storage element implemented within a p-type substrate and an n-well implemented within the p-type substrate that is independent of the storage element. The n-well and the storage element are separated by a minimum distance in which the p-type substrate includes no n-well.

Abstract: An apparatus relating generally to a current steering cell includes a first bleeder circuit, a second bleeder circuit, a steering circuit, and an output circuit. The first bleeder circuit and the second bleeder circuit are coupled to receive a first current-source bias voltage. The steering circuit is coupled to receive a second current-source bias voltage independent from the first current-source bias voltage.

Abstract: A semiconductor package includes an interposer and a plurality of integrated circuit (IC) dice disposed on and intercoupled via the interposer. A first IC die has a clock speed rating that is greater than a clock speed rating of another of the IC dice. A plurality of programmable voltage tuners are coupled to the plurality of IC dice, respectively. A first voltage tuner is coupled to the first IC die, and the first voltage tuner is programmed to reduce a voltage level of voltage input to the first voltage tuner and output the reduced voltage to the first IC die.

Abstract: In one embodiment, a method of block decoding is provided. For each of a plurality of data blocks input to a memory arrangement, a plurality of decoding iterations are performed using a circular pipeline of processing stages. For each decoding iteration, one processing stage of the circular pipeline performs a first set and a second set of soft-input-soft-output (SISO) decoding operations on a block of data. The first set of SISO decoding operations produces an intermediate block of data. The second set of SISO decoding operations is performed on the intermediate data block to complete the one decoding iteration. The next decoding iteration of the plurality of decoding iterations is performed using the next processing stage following the one processing stage of the circular pipeline of processing stages.

Abstract: An apparatus relating generally to matrix inversion is disclosed. This apparatus includes a matrix inversion module coupled to receive matrix information and to provide an approximation of an inversion of the matrix information. The matrix inversion module comprises a decomposition block coupled to receive the matrix information and to decompose the matrix information into diagonal matrix information and off diagonal matrix information, and an expansion block. The expansion block is coupled to receive the diagonal matrix information and the off diagonal matrix information, and to invert a matrix sum of the diagonal matrix information and the off diagonal matrix information by generation of a portion of a series expansion.

Abstract: An embodiment for skew compensation for a stacked die is disclosed. For an embodiment of an apparatus, an interposer has a first and a second integrated circuit die coupled to the interposer. The first integrated circuit die includes an information generator, a signal delay compensator, and an input/output block. The information generator is configured to determine: a first delay value for a first path of the interposer between the first integrated circuit die and the second integrated circuit die; a second delay value for a second path of the interposer between the first integrated circuit die and the second integrated circuit die; and a difference between the first delay value and the second delay value. The signal delay compensator is coupled to receive the difference and configured to adjust a parameter of the first integrated circuit die to reduce the difference.

Abstract: A circuit for shifting bussed data includes a first column of shift blocks, a compare block, and a second column of multiplexer blocks. The first column shifts the bussed data by a number of bits specified by first bits of a shift control input. The compare block determines the value of a second bit of the shift control input and creates an output reflecting that value. The second column has a control input coupled to the output of the compare block, shifts the data by one byte when the second bit of the shift control input has a first value, and does not shift the data when the second bit has a second value. The shift, compare, and multiplexer blocks can be substantially similar logic blocks programmable to perform any of these functions, can include N-bit data inputs and outputs, and can operate on the bussed data as an N-bit bus.

Abstract: A method, apparatus, and computer readable medium for synchronizing a main thread and a slave thread executing on a processor system are disclosed. For example, the method includes the following elements: transitioning the slave thread from a sleep state to a spin-lock state in response to a wake-up message from the main thread; transitioning the slave thread out of the spin-lock state to process a first work unit from the main thread; determining, at the main thread, an elapsed time period until receipt of a second work unit for the slave thread; transitioning the slave thread to the spin-lock state if the elapsed time period satisfies a threshold time period; and transitioning the slave thread to the sleep state if the elapsed time period does not satisfy the threshold time period.

Abstract: A system for calibrating impedance of an input/output (I/O) buffer on a semiconductor die includes: the I/O buffer; a temperature sensor on the semiconductor die; and a supply sensor on the semiconductor die. The temperature sensor is configured to acquire temperature information for calibrating the I/O buffer. The supply sensor is configured to acquire voltage information for calibrating the I/O buffer. The I/O buffer comprises: a memory component coupled to the temperature and supply sensors and configured to store the acquired temperature or voltage information; a logic component coupled to the memory component; and a driver with driver legs. The driver is coupled to the logic component. The logic component is configured to generate driver control signals representing an on/off configuration for the driver legs of the driver based at least in part on the acquired temperature information or the acquired voltage information stored in the memory component.

Abstract: A method of analyzing a phase of a clock signal for receiving data is described. The method comprises identifying an end of an eye pattern associated with received data; testing points along a contour of the eye pattern to establish a margin for an opening of the eye pattern; and determining whether a phase of the clock signal is acceptable for receiving the received data. A circuit for analyzing a phase of a clock signal for receiving data is also described.

Abstract: Methods and circuitry for evaluating reciprocal, square root, inverse square root, logarithm, and exponential functions of an input value, Y. In one embodiment, an approximate value, RA, of the reciprocal of Y is generated. One Newton-Raphson iteration is performed as a function of RA and Y, resulting in a truncated approximate value, R. R is multiplied by Y and 1 is subtracted, resulting in a reduced argument, A. A Taylor series evaluation of A is performed, resulting in an evaluated argument, B. B is multiplied by a post-processing factor for the final result.

Abstract: Method and apparatus for programmable heterogeneous integration of stacked semiconductor die are described. In some examples, a semiconductor device includes a first integrated circuit (IC) die including through-die vias (TDVs); a second IC die vertically stacked with the first IC die, the second IC die including inter-die contacts electrically coupled to the TDVs; the first IC die including heterogeneous power supplies and a mask-programmable interconnect, the mask-programmable interconnect mask-programmed to electrically couple a plurality of the heterogeneous power supplies to the TDVs; and the second IC die including active circuitry, coupled to the inter-die contacts, configured to operate using the plurality of heterogeneous power supplies provided by the TDVs.

Abstract: A method for tracking an interposer die of a stacked silicon interconnect technology (SSIT) product includes forming a plurality of dummy components on the interposer die, and modifying one or more of the plurality of dummy components on the interposer die to form a unique identifier for the interposer die. An apparatus for a stacked silicon interconnect technology (SSIT) product includes an interposer die, and a plurality of dummy components at the interposer die. One or more of the plurality of dummy components is modifiable to form a unique identifier for the interposer die.

Abstract: In one approach for improving timing in an electronic circuit design having a finite state machine (FSM), control bit logic is generated based on next state logic of the FSM that generates current state bits of the FSM. The control bit logic and a control state bit are added to operate in parallel with the next state logic and the current state bit registers, and the output signal from the control bit register replaces selected logic in logic downstream from the FSM and current state bit registers. If a worst case delay is improved with the design having the control bit logic and control state bit, the modified circuit design is saved for evaluating other possible timing improvements. Otherwise, the modification is discarded.

Abstract: An embodiment of a video processing system can include an alignment detector block configured to determine whether a video signal is misaligned and, responsive to determining that the video signal is misaligned, generate notifications indicating misalignment of the video signal. The video processing system also can include an unlock detector block coupled to the alignment detector block that is configured to determine an amount of time that the video signal is misaligned according to the notifications from the alignment detector block. The unlock detector block can be configured to ignore misalignment of the video signal until the video signal is misaligned for an amount of time exceeding a threshold amount of time. Another embodiment of the video processing system can include a buffer, a packetizer block that is coupled to the buffer, and a buffer controller that is coupled to the buffer and the packetizer block.

Abstract: A circuit for routing signals in an integrated circuit is disclosed. The circuit comprises a path having a plurality of registers coupled in series and including a source register, a destination register and at least one intermediate register; a clock generator generating a clock signal; and a delay element coupled to receive the clock signal and generate a delayed clock signal, wherein the delayed clock signal is coupled to a clock input of the at least one intermediate register. A method of routing signals in an integrated circuit is also disclosed.

Abstract: Electro-static discharge (“ESD”) protection for a die of a multi-chip module is described. A contact has an externally exposed surface after formation of the die and prior to assembly of the multi-chip module. The contact is for a die-to-die interconnect of the multi-chip module. The contact is for an internal node of the multi-chip module after the assembly of the multi-chip module. A driver circuit is coupled to the contact and has a first input impedance. A discharge circuit is coupled to the contact for electrostatic discharge protection of the driver circuit and has a first forward bias impedance associated with a first discharge path. The first forward bias impedance is a fraction of the first input impedance.

Abstract: Physical optimization for timing closure for an integrated circuit includes processing a circuit design at least partially through a design flow to a late stage of the design flow. Using a processor, a baseline delay is calculated for each of a plurality of paths of the circuit design. A slack for each of the plurality of paths is determined. Physical optimization further includes selecting a path of the circuit design that meets a selection criterion according, at least in part, to the slack of the path, applying, using the processor, a physical optimization to the selected path resulting in an optimized path, and calculating a delay of the optimized path. The optimized path is incorporated into the circuit design only responsive to determining that the delay of the optimized path is less than the baseline delay of the selected path.

Abstract: Approaches for restricting the use of an integrated circuit (IC) are described. In response to receiving an encrypted configuration bitstream, a cryptographic key is retrieved from an internal memory of the IC and the encrypted configuration bitstream is decrypted using the cryptographic key to produce a decrypted configuration bitstream. A first signature value of the decrypted configuration bitstream is calculated. A second signature value is retrieved from a write-once memory of the IC. In response to the first signature value being different from the second signature value, configuration of the IC with the bitstream is prevented. In response to the first signature value being equal to the second signature value, configuration of the IC with the bitstream is permitted.