Abstract: An embodiment of the invention relates to an integrated circuit that includes an identifier reader which may be, e.g., a physically unclonable function reader that generates a unique and reproducible identifier for the integrated circuit, and a related method. An error correction code may be employed to correct an error in the value of the reproducible identifier. Values of signals in the integrated circuit are selectively inverted dependent on values of the reproducible identifier, and an error corrector uses the values of the reproducible identifier to restore the values of the signals. The signals may be produced as outputs of look-up tables that selectively invert the values of the signals dependent on the value of the reproducible identifier. The signals may be inputs to the integrated circuit, internal signals, outputs, or state data. A test may validate a state of the integrated circuit and disable operation if the test fails.

Abstract: An integrated circuit includes a fingerprint element and a decryption circuit. The fingerprint element generates a fingerprint, where the fingerprint is reproducible and represents an inherent manufacturing process characteristic unique to the integrated circuit device. The decryption circuit decrypts, using a decryption key that is based on the fingerprint, an encrypted data in order to extract data. In one embodiment, the propagation delay of various circuit elements are used to generate the fingerprint. In another embodiment, the specific frequency of an oscillator is used to generate the fingerprint. In yet another embodiment, a ratio of measurable values is used to generate the fingerprint. In another embodiment, differences in transistor threshold voltages are used to generate the fingerprint. In yet another embodiment, variations in line widths are used to generate the fingerprint.

Abstract: An embodiment of a multichip module is disclosed. For this embodiment of the multichip module, a transceiver die has transceivers. A crossbar switch die has at least one crossbar switch. A protocol logic blocks die has protocol logic blocks. The transceiver die, the crossbar switch die, and the protocol logic blocks die are all coupled to an interposer. The interposer interconnects the transceivers and the protocol logic blocks to one another and interconnects the protocol logic blocks and the at least one crossbar switch to one another.

Abstract: A method of component placement for a multi-die integrated circuit (IC) can include partitioning a plurality of components of a netlist among a plurality of dies of the multi-die IC and selecting a superimposition model specifying a positioning of at least two of the plurality of dies at least partially superimposed with respect to one another. The method also can include assigning, by a processor, components of the netlist to hardware units within each of the plurality of dies according, at least in part, to a wire-length metric calculated using the superimposition model.

Abstract: In one embodiment, an integrated circuit (IC) is presented. The IC includes first and second sets of power distribution lines formed in the IC. The IC includes first and second capacitors formed in one or more layers of the IC. A first plurality of vias couple a first input of the first and second capacitors to the first set of power distribution lines, and a second plurality of vias couple a second input of the first and second capacitors to the second set of power distribution lines. The first capacitor and the first plurality of vias and the second plurality of vias coupled thereto having an equivalent series resistance greater than an equivalent series resistance of the second capacitor and the first plurality of vias and the second plurality of vias coupled thereto.

Abstract: Predicting simultaneous switching output noise of an IC device is described. User input is obtained. The user input includes: an identification of an input/output bank of an integrated circuit die; an identification of a device package substrate to which the integrated circuit die is to be attached; and an identification of input/output interface to be used by the input/output bank. A noise factor and an impedance are selected responsive to the user input. The noise factor is multiplied with the impedance to provide a result. The result, which is output, is a prediction of the simultaneous switching output noise of the integrated circuit device.

Abstract: A semiconductor device includes a semiconductor die and a plurality of lead-free solder bumps disposed on a surface of the semiconductor die. A substrate includes a plurality of metal layers and a plurality of dielectric layers. One of the metal layers includes a plurality of contact pads corresponding to the plurality of lead-free solder bumps, and one of the dielectric layers is an exterior dielectric layer having a plurality of respective openings for the contact pad. A plurality of respective copper posts is disposed on the contact pads. The respective copper post for each contact pad extends from the contact pad through the respective opening for the contact pad. The semiconductor die is mounted on the substrate with connections between the plurality of lead-free solder bumps and the plurality of copper posts.

Abstract: A method and apparatus for a multiple lane transmission system that provides a fixed, low-latency mode of operation with reduced lane-lane skew while process, voltage, and temperature (PVT) variation, as well as other sources of variation, occur over time. Multiplexing techniques are utilized within each transmission lane to allow programmably adaptive use of phase alignment circuitry for various modes of operation. As a result, power consumption and semiconductor die area are reduced because multiple copies of phase alignment circuitry within each transmission lane are not required. Also, injection of additional jitter on the serial outputs due to continuous operation of phase alignment circuitry is prevented. Rather, multiplexers within the phase alignment circuitry selectively adapt the timing architecture to that required by the selected mode of operation.

Abstract: A bias circuit generates a bias voltage. The bias circuit includes a first, a second, and a third detection circuit and a summing circuit. The first detection circuit generates a first characterization voltage that represents a variation of a power supply voltage from a nominal voltage. The first characterization voltage increases as the power supply voltage decreases and the first characterization voltage decreases as the power supply voltage increases. The second detection circuit generates a second characterization voltage that represents a threshold voltage of one or more p-type transistors. The third detection circuit generates a third characterization voltage that represents a threshold voltage of one or more n-type transistors. The summing circuit generates the bias voltage that is the power supply voltage reduced by a weighted sum of the first, second, and third characterization voltages.

Abstract: An integrated circuit (IC) has an under-bump metal (UBM) pad disposed between a solder bump and a semiconductor portion of the IC. A UBM layer is disposed between the solder bump and the semiconductor portion and includes the UBM pad and a UBM field. The UBM pad has a contact perimeter formed with the solder bump. The UBM pad extends beyond the contact perimeter a sufficient distance to block alpha particles emitted from the surface of the solder bump from causing an upset event in the semiconductor portion. The UBM field is separated from each UBM pad by a gap extending from the UBM pad to the UBM field so as to electrically isolate the UBM field from the UBM pad.

Abstract: In one embodiment, a circuit for matrix decomposition is provided. The circuit includes an input circuit for receiving a first matrix. A permutation circuit is coupled to the input circuit and configured to interchange columns of the first matrix according to a selected permutation to produce a second matrix. A systolic array is coupled to the permutation circuit and configured to perform QR decomposition of the second matrix to produce a third matrix and a fourth matrix. A reverse permutation circuit is coupled to the systolic array and configured to interchange rows of the third matrix according to an inverse of the selected permutation to produce a first factor matrix and interchange rows of the fourth matrix according to the inverse of the selected permutation to produce a second factor matrix.

Abstract: Approaches for estimating a derating factor for a plurality of potential soft errors in a circuit implementation of a circuit design. A plurality of respective estimated toggle rates are determined for a plurality of circuit elements for implementing the circuit design. A derating factor of the circuit design is determined as a function of the estimated toggle rates of the plurality of circuit elements. The derating factor is an estimation of a fraction of the plurality of potential soft errors that would cause functional failure of the circuit design.

Abstract: Disclosed are approaches for operating a plurality of debugger tools. A common debugger receives first-type commands for processing. Each first-type command references one of the debugger tools. Each debugger tool provides control over a respective set of one or more components of the electronic system and recognizes a respective set of tool-specific commands. Each input first-type command is translated into a respective tool-specific command that is compatible with the one of the debugger tools specified in the first-type command. Each respective tool-specific command from the common debugger is provided to the one of the debugger tools specified in the input first-type command from which the respective tool-specific command was translated. Each translated tool-specific command is performed by the targeted debugger tool.

Abstract: A semiconductor assembly with an integrated circuit (IC) and a companion device. An exemplary semiconductor assembly includes a printed circuit board (PCB) and first and second ICs. The PCB has first contacts on a top surface and second contacts on a bottom surface. The first contacts are vertically aligned with the second contacts and are electrically coupled by vias in the PCB. The first IC has first terminals respectively coupled to the first contacts of the PCB, the first terminals including first input/output (IO) terminals. The second IC includes at least one die, and second terminals coupled to at least a portion of the second contacts of the PCB. The second terminals include second IO terminals of the companion die, and are respectively coupled to those of the second contacts that are vertically aligned with those of the first contacts respectively coupled to the first IO terminals.

Abstract: An asynchronous communication network in an integrated circuit is described. The asynchronous communication network comprises a plurality of circuit elements enabling the transmission of tokens, each circuit element having a component interface comprising: a routing network coupled to a first adjacent circuit element of the plurality of circuit elements; and a control circuit coupled to the routing network, the control circuit having a first input coupled to receive a first command requesting a detection of a token received at a second input of the control circuit, and a first acknowledgement output coupling a first acknowledgement signal indicating whether the first command is received at the first input. Methods of enabling asynchronous communication in an integrated circuit are also disclosed.

Abstract: An embodiment of an integrated circuit is disclosed. For this embodiment, the integrated circuit includes circuit blocks. At least one transistor of a circuit block of the circuit blocks includes a portion of a semiconductor substrate having a diffusion layer. The circuit block has a relatively high diffusion pattern density as compared with others of the circuit blocks. The diffusion layer has an exposed surface active area constrained responsive to a design rule. The design rule is to limit to a maximum amount the surface active area in order to improve at least one parameter of the at least one transistor selected from a group consisting of an increase in switching speed and a decrease in leakage current of the at least one transistor of the circuit block having the relatively high diffusion pattern density.

Abstract: A method of reducing aberrations in a digital image comprises capturing input samples associated with a plurality of pixels arranged in a matrix, wherein each pixel is associated with a color defining the digital image; establishing vertical chrominance groups associated with columns of the matrix and horizontal chrominance groups associated with rows of the matrix; determining chrominance values for the chrominance groups; determining, for each chrominance group, a mean value and, a sum of absolute differences between the chrominance values and the mean value for the chrominance values of the chrominance group; calculating, by a signal processing device, a plurality of weights comprising vertical weights associated with the vertical chrominance groups and horizontal weights associated with the horizontal chrominance groups based upon the sums of absolute differences; and determining a missing color component for a predetermined pixel of the plurality of pixels using the plurality of weights.

Abstract: Method and apparatus for generating an implementation of a program language circuit description for a programmable logic device (PLD) is described. In one example, the program language circuit description is analyzed to identify constructs indicative of dynamic function re-assignment. A hardware description of the program language circuit description is generated. The hardware description includes a plurality of implementations responsive to the identified constructs. Physical implementation data is generated from the hardware description. The physical implementation includes a plurality of partial configurations for the PLD based on the respective plurality of implementations in the hardware description.

Abstract: A circuit detects symbols transmitted from multiple transmitting antennas to multiple receiving antennas. A distance block for an initial transmitting antenna in an ordering of the transmitting antennas determines a distance value for each symbol in a constellation. A selector block selects a limited number of candidates for the initial transmitting antenna from the symbols having smaller distance values. For each first and successive second transmitting antenna in the ordering, a distance-selector block selects a candidate for the second transmitting antenna for each candidate for the first transmitting antenna. The candidate for the second transmitting antenna is a pairing having a smaller distance value among the pairings of the candidate for the first transmitting antenna and the symbols. An identifier block selects a last candidate having a smaller distance value among the candidates for a last transmitting antenna in the ordering. The last candidate includes the detected symbols.

Abstract: An interdigitated capacitor having digits of varying width is disclosed. One embodiment of a capacitor includes a first plurality of conductive digits and a second plurality of conductive digits positioned in an interlocking manner with the first plurality of conductive digits, such that an interdigitated structure is formed. The first plurality of conductive digits and the second plurality of conductive digits collectively form a set of digits, where the width of a first digit in the set of digits is non-uniform with respect to a second digit in the set of digits.