Abstract: A method for distributing deep trench (DT) capacitance in an integrated circuit (IC) design is provided. The method includes forming a placement block that includes blockages defining openings in interstitial regions among the blockages, superimposing the placement block over the IC design and providing distributed DT capacitance to the IC design. The providing of the distributed DT capacitance includes adding DT capacitance cells through the openings to portions of the IC design where there are no reserved blocks.

Abstract: Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a memory cell and first, second, and third data lines located over a substrate. The memory cell includes a first transistor and a second transistor. The first transistor includes a charge storage structure located on a first level of the apparatus, and a first channel region electrically separated from the charge storage structure. The second transistor includes a second channel region located on a second level of the apparatus and electrically coupled to the charge storage structure. The first and second data lines are located on a third level of the apparatus and electrically coupled to the first channel region. The first level is between the substrate and the third level. The third data line is electrically coupled to the second channel region and electrically separated from the first channel region.

Abstract: The present disclosure provides a device structure for increasing the coupling ratio of a body-tied fin flash memory cell. The device includes a plurality of elongate fin structures arranged in parallel in an active layer on a substrate, a floating gate disposed on the top surface and the opposing sidewalls of each of the fin structures and at a predetermined location on the elongated fin, and dispersed structure. The dispersed structure comprises a plurality of stacked layers parallel to the substrate, spaced evenly apart; and two adjacent fin structures share one dispersed structure at their sidewalls. This device increases the distance between adjacent floating gates, reduces coupling capacitance, and reduces the disturbance between the cells, which is conducive to increasing the drain voltage, improving the programming speed, and further reducing the gate voltage. More optimization options for subsequent shrinking of the flash memory cells can be provided.

Abstract: A system for reconstructing wafer maps of semiconductor wafers includes: a processor; and memory having instructions stored thereon that, when executed by the processor, cause the processor to: receive test data of a wafer at sparse sampling locations of the wafer, the sparse sampling locations being selected based on a probing mask; and compute a reconstructed wafer map by performing compressed sensing with Zernike polynomials on the test data at sparse locations of the wafer.

Abstract: A Vertical Function Field Effect Transistor (VIFET) is disclosed with reduced noise and input capacitance and high input impedance. The VIFET has a substrate; a source disposed on the substrate; a drain, and a channel. The vertical channel has one or more channel sidewall surfaces. The channel sidewall surfaces have a total or aggregate channel sidewall surface area. A semiconductor gate grown on one or more of the channel sidewall surfaces has a thickness below 10 nanometers (nm), or between 3 am and 10 om, that reduces transistor noise. The interface surface area between the conductive (e.g. metal) external electrical gate contact and the contacted surface of the semiconductor gate is minimized to further reduce transistor noise.

Abstract: The disclosure relates to a CMOS structure and a manufacturing method thereof. The CMOS structure includes a substrate and an N-type TFT and a P-type TFT on the substrate. The N-type TFT includes a first gate electrode, a first active layer, and a first gate dielectric layer therebetween. The first active layer includes a first semiconductor layer, a second semiconductor layer of the N-type, and a third semiconductor layer of the N-type which are located at opposite ends of the first semiconductor layer and sequentially stacked in a direction away from the first gate dielectric layer. An N-type doping concentration of the second semiconductor layer is smaller than that of the third semiconductor layer. The P-type TFT includes a fifth semiconductor layer and a sixth semiconductor layer. A P-type doping concentration of the fifth semiconductor layer is smaller than that of the sixth semiconductor layer.

Abstract: A display substrate, a manufacturing method thereof, a display panel and a display device are provided. The display substrate includes: a base substrate, a plurality of display areas arranged in an array on the base substrate, and non-display areas between the display areas. A display structure is disposed in the display area and configured to display images. The non-display area is light-transparent and is provided with a photochromic pattern. The photochromic pattern is configured to adjust the light transmittance of the non-display area according to the illumination intensity of the received light.

Abstract: A thin film transistor, an array substrate, a display panel and a display device are provided, which is related to the field of display technologies. A thin film transistor comprises: a substrate; at least two active layers on the substrate, each active layer comprising a first terminal and a second terminal opposite to each other; a source and a drain above the substrate. The first terminal of each of the at least two active layers is electrically connected to the source, and the second terminal of each of the at least two active layers is electrically connected to the drain, and the at least two active layers are arranged on an upper surface of the substrate and separated from one another.

Abstract: Semiconductor devices and methods of manufacturing semiconductor devices are provided. In embodiments a passivation process is utilized in order to reduce dangling bonds and defects within work function layers within a gate stack. The passivation process introduces a passivating element which will react with the dangling bonds to passivate the dangling bonds. Additionally, in some embodiments the passivating elements will trap other elements and reduce or prevent them from diffusing into other portions of the structure.

Abstract: A semiconductor device includes a lead frame having a die pad; a semiconductor chip having a front surface in which an integrated circuit is formed, and a back surface that is die-bonded onto the die pad through intermediation of an interposing film and an adhesive layer; and an encapsulating resin for encapsulating the lead frame, the adhesive layer, the interposing film, and the semiconductor chip. The interposing film has a first opening which forms a space between a part of the back surface of the semiconductor chip and the adhesive layer.

Abstract: An LDMOS transistor can include: a field oxide layer structure adjacent to a drain region; and at least one drain oxide layer structure adjacent to the field oxide layer structure along a lateral direction, where a thickness of the drain oxide layer structure is less than a thickness of the field oxide layer, and at least one of a length of the field oxide layer structure and a length of the drain oxide layer structure is adjusted to improve a breakdown voltage performance of the LDMOS transistor.

Abstract: The present disclosure provides a display substrate, a display device, a mobile terminal, and a fabricating method of a display substrate. The display substrate includes a bending region and a non-bending region adjacent to the bending region. At least a portion of the non-bending region is provided with an inorganic layer, and at least a portion of the bending region is provided with a flexible filling layer. The display substrate further includes a stretching structure layer disposed in the bending region, and the stretching structure layer and the flexible filling layer are alternately distributed.

Abstract: Disclosed are semiconductor memory devices and methods of fabricating the same. The semiconductor memory devices may include a capacitor including first and second electrodes and a dielectric layer. The dielectric layer may include a zirconium aluminum oxide layer including a first zirconium region adjacent to the first electrode, a first aluminum region, a second aluminum region adjacent to the second electrode, and a second zirconium region between the first and second aluminum regions. The first and second zirconium regions may include zirconium and oxygen and may be devoid of aluminum. The first and second aluminum regions may include aluminum and oxygen and may be devoid of zirconium. The first aluminum region and the first zirconium region may be spaced apart by a first distance, and the first aluminum region and the second zirconium region may be spaced apart by a second distance shorter than the first distance.

Abstract: Disclosed is a vertically stacked 3D memory device, and the memory device may include a bit line extended vertically from a substrate, and including a first vertical portion and a second vertical portion, a vertical active layer configured to surround the first and second vertical portions of the bit line, a word line configured to surround the vertical active layer and the first vertical portion of the bit line, and a capacitor spaced apart vertically from the word line, and configured to surround the vertical active layer and the second vertical portion of the bit line.

Abstract: A layered heterostructure, comprising alternating layers of different semiconductors, wherein one of the atom species of one of the semiconductors has a faster diffusion rate along an oxidizing interface than an atom species of the other semiconductor at an oxidizing temperature, can be used to fabricate embedded nanostructures with arbitrary shape. The result of the oxidation will be an embedded nanostructure comprising the semiconductor having slower diffusing atom species surrounded by the semiconductor having the higher diffusing atom species. The method enables the fabrication of low- and multi-dimensional quantum-scale embedded nanostructures, such as quantum dots (QDs), toroids, and ellipsoids.

Abstract: A method of fabricating a plurality of field effect transistors with different threshold voltages, including forming a cover layer on a channel region in a first subset, forming a first sacrificial layer on two or more channel regions in a second subset, forming a second sacrificial layer on one of the two or more channel regions in the second subset, removing the cover layer from the channel region in the first subset, forming a first dummy dielectric layer on the channel region in the first subset, and forming a second dummy dielectric layer on the first dummy dielectric layer and the first sacrificial layer on the channel region in the second subset.

Abstract: A display panel includes a first substrate, a second substrate, and spacers. The first substrate includes a light-shielding layer having a matrix portion and widened portions, and each widened portion is disposed at an intersection of at least one column and at least one row of the matrix portion. The second substrate is disposed opposite to the first substrate. The spacers are disposed on the first substrate. Each spacer is covered with each widened portion respectively, and an end of each spacer abuts against a surface of the second substrate. A slidable scope on the surface of the second substrate, within which the end of each spacer abuts against the second substrate, is not greater than coverage of a corresponding widened portion.

Abstract: A method includes: providing a first substrate on which a plurality of first semiconductor devices is formed; providing a second substrate on which a plurality of second semiconductor devices is formed; and coupling the first and second substrates by contacting respective dummy pads of the first and second substrates, wherein at least one of the dummy pads of the first and second substrates comprises plural peaks and valleys.

Abstract: A normally-off heterojunction field-effect transistor is provided, including a superposition of a first layer, of III-N type, and of a second layer, of III-N type, so as to form a two-dimensional electron gas; a stack of an n-doped third layer making electrical contact with the second layer, and of a p-doped fourth layer placed in contact with and on the third layer, a first conductive electrode and a second conductive electrode making electrical contact with the two-dimensional electron gas; a dielectric layer disposed against a lateral face of the fourth layer; and a control electrode separated from the lateral face of the fourth layer by the dielectric layer.

Abstract: The present invention provides a thin-film transistor and a display panel. The thin-film transistor includes a substrate, an active layer, an insulating layer, a metal layer, a dielectric layer, a source electrode, a drain electrode, a first through hole, a second through hole, a third through hole, and a fourth through hole. A first contact portion in a first metal layer is connected to the active layer via the first through hole, and a second contact portion is connected to the active layer via a second through hole. The source electrode is connected to the first contact portion via the third through hole, and the drain electrode is connected to the second contact portion via the fourth through hole.