Abstract: A nonvolatile memory device includes a first pin that receives a first signal, a second pin that receives a second signal, third pins that receive third signals, a fourth pin that receives a write enable signal, a memory cell array, and a memory interface circuit that obtains a command, an address, and data from the third signals in a first mode and obtains the command and the address from the first signal and the second signal and the data from the third signals in a second mode. In the first mode, the memory interface circuit obtains the command from the third signals and obtains the address from the third signals. In the second mode, the memory interface circuit obtains the command from the first signal and the second signal and obtains the address from the first signal and the second signal.

Abstract: Several embodiments of memory devices and systems with offset memory component automatic calibration error recovery are disclosed herein. In one embodiment, a system includes at least one memory region and calibration circuitry. The memory region has memory cells that read out data states in response to application of a current read level signal. The calibration circuitry is operably coupled to the at least one memory region and is configured to determine a read level offset value corresponding to one or more of a plurality of offset read level test signals, including a base offset read level test signal. The base offset read level test signal is offset from the current read level signal by a predetermined value. The calibration circuitry is further configured to output the determined read level offset value.

Abstract: An information handling system includes a first z-axis compression connector, a first dual in-line memory module (DIMM), a second z-axis compression connector, a second DIMM, and a printed circuit board. A first side of the first compression connector is affixed to the printed circuit board. A first surface of a first memory circuit board of the first DIMM is affixed to a second side of the compression connector. A first side of the second compression connector is affixed to a second side of the first memory circuit board. A first side of a second memory circuit board of the second DIMM is affixed to a second side of the second compression connector. The first compression connector has a first depth, and the second compression connector has a second depth that is different from the first depth.

Abstract: A computer-implemented method includes an act of configuring hardware to cause at least a part of the hardware to operate as a double data rate (DDR) memory controller, and to produce a capture clock to time a read data path, where a timing of the capture clock is based on a first clock signal of a first clock, delay the first clock signal to produce a delayed first clock signal, adjust the delay such that at least one clock edge of the delayed first clock signal is placed nearer to at least one clock edge of at least one data strobe (DQS), or at least one signal dependent on a DQS timing, and produce a modified timing of the capture clock based on the delay of the first clock signal.

Abstract: A method for writing to a non-volatile electronic memory with data words and assigned pieces of index information. The non-volatile electronic memory is initially filled exclusively with empty data frames. The empty data frames are overwritable with multi-data frames and/or individual data frames. A multi-data frame includes a selectable number of sequentially stored data words, and a multi-data frame header. A frame-type marker, the number of data words, and a selectable start index are stored in the multi-data frame header so that each data word is assignable a unique index value from an index interval by incrementing or decrementing. An individual data frame includes one data word and an individual data frame header. A frame-type marker and a selectable index value for the one data word of the individual data frame are stored in the individual data frame header.

Abstract: Disclosed in some examples are methods, systems, devices, and machine-readable mediums that provide for techniques for scrambling and/or updating meta-data that enable an efficient internal copyback operation. In some examples, improved data distribution techniques decouple the scrambling key from a physical address to allow for copyback operations while maintaining data distribution requirements across a memory device. The controller may generate a seed value that is used by a scrambling algorithm to scramble the host-data and meta-data prior to the data being written. The seed value is then encoded and written to the page with encoded versions of the scrambled user data and meta-data—the random seed is written without scrambling the random seed.

Abstract: A storage circuit includes: the array of a memory cell MC including a variable-resistance element; a conversion circuit that converts the resistance value of each memory cell into the signal level of an electric signal; a reference signal generation circuit that generates a reference signal common to a plurality of columns; a correction circuit that corrects one of the signal level of the reference signal and the signal level of the electric signal for each column of the array of the memory cell; and an RW circuit that determines data stored in the memory cell belonging to a corresponding column by comparing one of the reference level and the signal level of the electric signal, corrected by the correction circuit, and the other of the reference level and the signal level of the electric signal.

Abstract: A data storage apparatus is provided to include a memory device including memory cells for storing data; and an interface circuit coupled as an interface between the host device and the memory device and configured to transmit a transmission signal to the host. The interface circuit includes a delay circuit configured to generate a delay code and is configured to generate an additional signal to be combined with the transmission signal based on the delay code.

Abstract: Systems, apparatuses, and methods related to media management, including “garbage collection,” in memory or storage systems or sub-systems, such as solid state drives, are described. For example, a criticality value can be determined and used as a basis for managing a garbage collection operation on a data block. A controller or the system or sub-system may determine that a criticality value associated with performing a garbage collection operation satisfies a condition. Based on determining that the condition is satisfied, a parameter associated with performing the garbage collection operation can be adjusted. The garbage collection operation is performed on the data block stored on the memory component using the adjusted parameter.

Abstract: Systems are methods are provided for implementing an analog content addressable memory (analog CAM), which is particularly structured to allow for an amount of variance (fuzziness) in its search operations. The analog CAM may search for approximate matches with the data stored therein, or matches within a defined variance. Circuitry of the analog CAM may include transistor-source lines that receive search-variance parameters, and/or data lines that receive search-variance parameters explicitly within the search input data. The search-variance parameters may include an upper bound and a lower bound that define a range of values within the allotted amount of fuzziness (e.g., deviation from the stored value). The search-variance parameters may program (using analog approaches) the analog CAM to perform searches having a modifiable restrictiveness that is tuned dynamically, as defined by the input search-variance. Thus, highly efficient hardware for complex applications involving fuzziness are enabled.

Abstract: According to one embodiment, a memory system includes a semiconductor memory and a controller. The semiconductor memory includes blocks each containing memory cells. The controller is configured to instruct the semiconductor memory to execute a first operation and a second operation. In the first operation and the second operation, the semiconductor memory selects at least one of the blocks, and applies at least one voltage to all memory cells contained in said selected blocks. A number of blocks to which said voltage is applied per unit time in the second operation is larger than that in the first operation.

Abstract: A memory device, a memory system including the memory device, and a method of operating the memory device are described. The memory device includes a memory cell array including a plurality of planes, a peripheral circuit configured to perform a read operation including a channel initialization operation on a selected memory block among a plurality of memory blocks included in each of the plurality of planes, and a control logic configured to control the peripheral circuit to perform the read operation including the channel initialization operation, and the control logic sets an activation time of the channel initialization operation based on an read mode of the read operation.

Abstract: A memory device in which reliability of a clock signal is improved is provided. The memory device comprises a data module including a clock signal generator configured to receive an internal clock signal from a buffer, and to generate a first internal clock signal, a second internal clock signal, a third internal clock signal, and a fourth internal clock signal having different phases, on the basis of the internal clock signal, and a first data signal generator configured to generate a first data signal on the basis of first data and the first internal clock signal, generate a second data signal on the basis of second data and the second internal clock signal, generate a third data signal on the basis of third data and the third internal clock signal, and generate a fourth data signal on the basis of fourth data and the fourth internal clock signal.

Abstract: A memory device includes a first layer, wherein the first layer includes a first memory array, a first row decoder circuit, and a first column sensing circuit. The memory device includes a second layer disposed with respect to the first layer in a vertical direction. The second layer includes a first peripheral circuit operatively coupled to the first memory array, the first row decoder circuit, and the first column sensing circuit. The memory device includes a plurality of interconnect structures extending along the vertical direction. At least a first one of the plurality of interconnect structures operatively couples the second layer to the first layer.

Abstract: A multi-level signal transmitter includes a voltage selection circuit, which is configured to select one amongst a plurality of driving voltages, which have different voltage levels, in response to input data including at least two bits of data therein. A driver circuit is also provided, which is configured to generate an output data signal as a multi-level signal, in response to the selected one of the plurality of driving voltages. This selected signal is provided as a body bias voltage to at least one transistor within the driver circuit. This driver circuit may include a totem-pole arrangement of first and second MOS transistors having respective first and second body bias regions therein, and at least one of the first and second body bias regions may be responsive to the selected one of the plurality of driving voltages.

Abstract: Apparatus and methods are disclosed, including memory devices and systems. Example memory devices, systems and methods include a buffer to translate high speed data interactions on a host interface side into slower, wider data interactions on a DRAM interface side. Example memory devices, systems and methods include a multiplexer circuit to further facilitate use of slower, and wider bandwidth memory devices. Devices and methods described may be configured to substantially match the capacity of a narrower, higher speed host interface.

Abstract: A memory sub-system configured to improve performance using signal and noise characteristics of memory cells measured during the execution of a command in a memory component. For example, the memory component is enclosed in an integrated circuit and has a calibration circuit. The signal and noise characteristics are measured by the calibration circuit as a byproduct of executing the command in the memory component. A processing device separate from the memory component transmits the command to the memory component, and receives and processes the signal and noise characteristics to identify an attribute about the memory component. Subsequently, an operation related to data stored in the memory component can be performed based on the attribute.

Abstract: A test structure for 3D memory arrays and methods of forming the same are disclosed. In an embodiment, a memory array includes a first word line over a semiconductor substrate and extending in a first direction; a second word line over the first word line and extending in the first direction; a memory film contacting the first word line and the second word line; an oxide semiconductor (OS) layer contacting a first source line and a first bit line, the memory film being between the OS layer and each of the first word line and the second word line; and a test structure over the first word line and the second word line, the test structure including a first conductive line electrically coupling the first word line to the second word line, the first conductive line extending in the first direction.

Abstract: The present technology includes a semiconductor memory device. The semiconductor memory device includes a stack including a conductive pattern and an insulating pattern, a channel structure penetrating the stack, and a memory pattern between the conductive pattern and the channel structure. The memory pattern includes a blocking pattern, a tunnel pattern, a storage pattern, and a ferroelectric pattern.

Abstract: A data storage device includes a memory device including a plurality of wordlines, each including a plurality of cells, and a cell statistics generator (CSG) disposed on the memory device. The CSG includes logic configured to receive a first read sense at a threshold voltage of one or more threshold voltages of each cell of a wordline of the plurality of wordlines, determine that a second read sense is required based on the first read sense, receive the second read sense, determine a deviation parameter and a dispersion parameter for an asymmetric adjustment of the left threshold voltage and the right threshold voltage, and adjust the left threshold voltage and the right threshold voltage based on the deviation parameter and the dispersion parameter. The second read sense includes a plurality of left read senses at a left threshold voltage and a plurality of right senses at a right threshold voltage.