Abstract: Apparatuses, systems, and methods for data timing alignment in stacked memory. The memory a number of core dice stacked on an interface die. The core and interface die each include adjustable delay circuits along each of a delay and native path. A state machine operates interface and core aligner control circuits to set values of the delay(s) in the interface and core dice respectively. The state machine may initialize the delays and then enter a maintenance state where averaging is used to determine when to adjust the delay in the core dice. If an overflow or underflow condition is met, the state machine may cycle between adjusting the delay in the interface die and adjusting the delays in the core dice without averaging until the overflow and underflow conditions are no longer met and the maintenance state is returned to.

Abstract: A memory circuit includes a first memory array including first memory cells wherein a plurality of first word lines is coupled with a plurality of rows of first memory cells in a first segment of the first memory array, and a plurality of second word lines is coupled with the plurality of rows of first memory cells in a second segment of the first memory array. The memory circuit also includes a read circuit configured to retrieve data from the first memory cells of the first memory array and a computation circuit configured to perform a matrix computation by combining first data retrieved from the first memory cells of the first segment with second data retrieved from the first memory cells of the second segment.

Abstract: A semiconductor memory device includes an array of memory cells arranged in a plurality of rows and columns, with each memory cell including a plurality of bit cell transistors. The semiconductor memory device further includes a plurality of write assist circuits, including one or more write assist circuits within each column of the array of memory cells, each write assist circuit configured to provide a core voltage to memory cells within the same column and to reduce the core voltage during a write operation. The array of memory cells and the plurality of write assist circuits have a common semiconductor layout.

Abstract: Memories are provided. A memory includes a plurality of ferroelectric random access memory (FRAM) cells arranged in a first memory array, and a plurality of static random access memory (SRAM) cells arranged in a second memory array. The first memory array and the second memory array share the same bus. Each of the FRAM cells includes a ferroelectric field-effect transistor (FeFET). A gate structure of the FeFET includes a gate electrode over a channel of the FeFET, and a ferroelectric layer over the gate electrode.

Abstract: A read-write conversion circuit, a read-write conversion circuit driving method, and a memory are provided. The read-write conversion circuit includes a first precharge circuit, a positive feedback circuit, a second precharge circuit, a fourth switch unit, a sixth switch unit, a seventh switch unit, an eighth switch unit, a tenth switch unit, an eleventh switch unit, a twelfth switch unit, a thirteenth switch unit, a fourteenth switch unit, and a fifteenth switch unit. In the read-write conversion circuit, corresponding signals can be read from a third signal terminal and a fourth signal terminal by using only one of a first signal terminal or a second signal terminal in a signal read stage, and corresponding signals can be written to the first signal terminal and the second signal terminal by using only one of the third signal terminal or the fourth signal terminal in a signal write stage.

Abstract: A flash controller for managing at least one MLC non-volatile memory module and at least one SLC non-volatile memory module. The flash controller is adapted to determine if a range of addresses listed by an entry and mapped to said at least one MLC non-volatile memory module fails a data integrity test. In the event of such a failure, the controller remaps said entry to an equivalent range of addresses of said at least one SLC non-volatile memory module. The flash controller is further adapted to determine which of the blocks in the MLC and SLC non-volatile memory modules are accessed most frequently and allocating those blocks that receive frequent writes to the SLC non-volatile memory module and those blocks that receive infrequent writes to the MLC non-volatile memory module.

Abstract: A signal generation circuit includes: a clock circuit configured to receive a flag signal and generate a clock signal; a control circuit configured to generate a control circuit; and a generation circuit connected to both the clock circuit and control circuit and configured to receive the clock signal, the control signal, and the flag signal and generate a target signal, wherein when the flag signal changes from a first level to a second level, the target signal changes from a third level to a fourth level, and after the target signal is maintained at the fourth level for a target duration, the target signal changes from the fourth level to the third level; and the generation circuit is further configured to determine the target duration according to the clock signal and control signal.

Abstract: A processing device determines a target bit error rate corresponding to a point of a first programming voltage distribution level corresponding to memory cells of a memory sub-system and a second programming voltage distribution corresponding to the memory cells of the memory sub-system. An offset voltage level corresponding to the point at the target bit error rate is selected. A first portion of a first group of the memory cells in the first programming voltage distribution level is programmed at a threshold voltage level to set a first embedded data value. A second portion of a second group of the memory cells in the second programming voltage distribution level is programmed at the threshold voltage level offset by the offset voltage level to set a second embedded data value.

Abstract: Embodiments provide a write operation circuit, a semiconductor memory, and a write operation method. The write operation circuit includes: a data determination module that determines whether to flip the current input data according to the previous depending on the number of changed data bits between the previous input data and the current input data of the semiconductor memory so as to generate a flip flag data and an intermediate data; a data buffer module that is used to determine an initial state of a global bus according to an enable signal and the intermediate data; and a data receiving module that receives the global bus data on the global bus, and receives the flip flag data through the flip flag signal line, and that is used to decode the global bus data according to the flip flag data, and write the decoded data into a memory block of the semiconductor.

Abstract: A memory device includes a command interface configured to receive a two-cycle command from a host device via multiple command address bits. The memory device also includes a command decoder configured to decode a first portion of the multiple command address bits in a first cycle of the two-cycle command. The command decoder includes mask circuitry. The mask circuitry includes mask generation circuitry configured to generate a mask signal. The mask circuitry also includes multiplexer circuitry configured to apply the mask signal to block the command decoder from decoding a second portion of the multiple command address bits in a second cycle of the two-cycle command.

Abstract: A semiconductor device may include a word line, a bit line crossing the word line, and a memory cell coupled to the word line and the bit line to receive an electrical signal to control the memory cell and including a switching material layer and an oxidation-reduction reversible material layer that is in contact with the switching material layer to allow for either oxidation reaction or reduction reaction to occur in response to different amplitudes and different polarities of the electrical signal, wherein the oxidation-reduction reversible material layer and the switching material layer responds to a first threshold voltage and a first polarity of the electrical signal to generate an oxidation interface between the switching material layer and the oxidation-reduction reversible material layer, and responds to a second threshold voltage and a second polarity of the electrical signal to reduce the generation of the oxidation interface.

Abstract: A memory subsystem architecture that includes two register clock driver (RCD) devices to increase a number of output drivers for signaling memories of the memory subsystem is described herein. In a two RCD device implementation, first and second RCD devices may contemporaneously provide first subchannel C/A information and second subchannel C/A information, respectively, to respective first and second group of memories of the memory subsystem responsive to a common clock signal. Because each of the first and second RCD devices operate responsive to the common clock signal, operation of the first and second RCD devices may be synchronized such that all subchannel driver circuits drive respective subchannel C/A information contemporaneously.

Abstract: A duty adjustment circuit, and a delay locked loop circuit and a semiconductor memory device including the same are provided. The duty adjustment circuit includes a pulse generator configured to generate a pulse signal at a constant pulse width regardless of a frequency of a reference clock signal, based on frequency information, a code generator configured to generate a first predetermined number of delayed pulse signals by delaying the pulse signal, as a first code in response to the pulse signal, and a duty adjuster configured to receive a delay clock signal, and generate a duty correction clock signal by adjusting a slope of rising transition and a slope of falling transition of the delay clock signal in response to the first code and a second code.

Abstract: The disclosure provides a sense amplifier and a control method thereof. The sense amplifier includes: a pre-charge module, a first input and output terminal, a second input and output terminal, a first PMOS transistor, a second PMOS transistor, a first NMOS transistor, and a second NMOS transistor, a first switch unit, a second switch unit, a third switch unit, a fourth switch unit, a fifth switch unit, a sixth switch unit, a seventh switch unit, an eighth switch unit, a first energy storage unit and a second energy storage unit. The sense amplifier can compensate for the offset voltage. The result is a sense amplifier with greatly reduced offset voltage, thereby improving the sensitivity and resolution of the sense amplifier.

Abstract: A spin-orbit torque type magnetoresistance effect element including a magnetoresistance effect element having a first ferromagnetic metal layer with a fixed magnetization direction, a second ferromagnetic metal layer with a varying magnetization direction, and a non-magnetic layer sandwiched between the first ferromagnetic metal layer and the second ferromagnetic metal layer; and spin-orbit torque wiring that extends in a first direction intersecting with a stacking direction of the magnetoresistance effect element and that is joined to the second ferromagnetic metal layer; wherein the magnetization of the second ferromagnetic metal layer is oriented in the stacking direction of the magnetoresistance effect element; and the second ferromagnetic metal layer has shape anisotropy, such that a length along the first direction is greater than a length along a second direction orthogonal to the first direction and to the stacking direction.

Abstract: An inverter includes a transistor, an additional transistor overlying the transistor, and a hybrid gate electrode interposed between and shared by the transistor and the additional transistor. The hybrid gate electrode includes a region overlying a channel structure of the transistor, an additional region overlying the region and underlying an additional channel structure of the additional transistor, and further region interposed between the region and the additional region. The region has a first material composition. The additional region has a second material composition different than the first material composition of the region. Memory devices and electronic systems are also described.

Abstract: A unit structure of non-volatile memory is provided. The unit structure includes a substrate, an n-type ferroelectric field effect transistor (FeFET) and a p-type FeFET disposed on the substrate, first circuitry by which sources of the n-type FeFET and the p-type FeFET are electrically coupled in parallel downstream from a common terminal and second circuitry by which top electrodes of the n-type FeFET and the p-type FeFET are electrically coupled in parallel upstream of a common terminal.

Abstract: A semiconductor memory device includes: a local write bit (LWB) line; a local write bit_bar (LWB_bar) line; a global write bit (GWB) line; a global write bit_bar (GWBL_bar) line; a column of segments, each segment including bit cells that are connected correspondingly between the LWB and LWB_bar lines; and a distributed write driving arrangement including a global write driver and local write drivers included correspondingly in the segments; and the global write driver including a first equalizer circuit, arranged in a switched-coupling between the LWB line and the LWB_bar line, and arranged in a control-coupling with respect to signals correspondingly on the GWB line and the GWB_bar line, and the global write driver and the local write drivers each including first inversion couplings (coupled in parallel between the GWB line and the LWB line) and second inversion couplings (coupled in parallel between the GWB_bar line and the LWB_bar line).

Abstract: A semiconductor device includes: a substrate extending in a first direction and a second direction intersecting with the first direction; a plurality of input/output pads disposed at one side of the substrate; a first circuit adjacent to the input/output pads in the first direction; a second circuit disposed to be spaced farther apart from the input/output pads in the first direction than the first circuit; a first memory cell array overlapping the first circuit; a second memory cell array overlapping the second circuit; first metal source patterns overlapping the first memory cell array and being spaced apart from each other in the second direction; and a second metal source pattern overlapping the second memory cell array and formed to have a width wider than a width of each of the first metal source patterns in the second direction.

Abstract: Systems, apparatuses, and methods related to a memory device, such as a low-power dynamic random-access memory (DRAM), and an associated host device are described. The memory device includes control circuitry that can determine an operational status of the memory device (e.g., whether the memory device is currently performing a self-refresh operation). The control circuitry can also transmit a signal indicative of the operational status to the host device in response to receiving a command directing the memory device to exit a self-refresh mode. The host device can operate based on the signal. The signal may therefore allow the memory device, the host device, or both to manage operations, including whether to send, receive, or process commands and data read/write requests during times that may be associated with self-refresh operations.