Abstract: A multi-layer structure includes a fluoropolymer bonded to a substrate. The structure is prepared by exposing a bonding composition to actinic radiation, such as ultraviolet radiation, to form the bond. The bonding composition includes a light-absorbing compound and an electron donor. The bonding composition includes non-adhesive materials.

Abstract: In a method and a device for sealing a ceramic package of a SAW (Surface Acoustic Wave) filter, when making a ceramic package of an environmentally sensitive SAW filter such as a SAW duplexer filter or a SAW filter, a first sealing is carried out between a ceramic main body and a metal case so as to protect the chip component, and then, a second sealing is carried out also between the metal case and the ceramic main body again, so that the shielding effect against external electromagnetic fields would be superior, and so that costs are reduced and so that a workability improvement can be realized, and so that the sealing can be made more secure. The first sealing is carried out on a step that is formed on the top of the ceramic main body to bond the metal case thereupon. The second sealing is carried out on the top of the ceramic main body to bond the metal case on the ceramic main body.

Abstract: When manufacturing a foil-wrapped breast prosthesis with a filling consisting of a curable compound, the curing is performed after placing a filled prosthesis bag formed by two joined foil sheets in a mould cavity without closing the mould cavity and maintaining vacuum at least in the beginning of the curing, whereby especially an increased degree of freedom is obtained with respect to shaping the rear side of the prosthesis, so that this, among other things, can be provided with thin edge parts for obtaining good fitting to the body. To ease the mounting of the bag and the accurate positioning of this in the mould cavity, the latter is formed in a first mould part of a shaping tool, which furthermore comprises a tightening frame having a packing, which provides an unambiguously oriented tightening of the bag when this is placed in the mould cavity.

Abstract: Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a first plurality of elements, each of which is designed to mate with a receptor region on said substrate and each of which comprises a functional element, and wherein the slurry also includes a second plurality of elements which are not designed to mate with receptor regions on the substrate. Typically, these second plurality of elements help movement of the first plurality of elements. A method according to another aspect of the invention includes dispensing in a flow having a first direction a slurry onto a substrate, wherein the slurry includes a fluid and a plurality of elements, each of which is designed to mate with a receptor region on the substrate and each of which includes a functional element, and vibrating substrate in a second direction which is substantially perpendicular to the first direction.

Abstract: A method for making a laminated carrier film for use in releasing interstitial fluid from skin for collection or measurement includes providing a printhead having an orifice and a reservoir containing a meltable absorber substance, the printhead being capable in response to electrical signals, to eject droplets of said meltable absorber substance from the orifice; supporting a carrier film having a series of spaced apart openings for a meltable absorber substance on a support base, in close proximity to the printhead, whereby the spaced apart openings on the carrier film can be positioned relative to the orifice to receive absorber substance droplets ejected from the printhead; filling the spaced apart openings of the carrier film with meltable absorber substance ejected from the printhead; and covering the carrier film on one side with a clear polymer film strip selected to allow laser energy to pass through the clear polymer film in order to reach the meltable absorber substance inside the openings.

Abstract: A die system for use in formation of a welded flashing, comprising a body portion comprised of a conducting material, the body portion having a first end and a second end; an indent portion at the first end of said body portion adapted to accept a portion of the flashing during welding; and where the portion of the flashing accepted in the indent portion of the body portion is folded away from an operational connection between the first end of the body portion and a welder during welding.

Abstract: A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members 16a and 16b is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit 24 and water vapor from a vapor generator 26 in a fluorination process section 12. The bond members 16a and 16b are then placed in contact at the fluorinated surface on table 36 in bonding process section 14. Argon is then introduced to bonding chamber 34. Pressure is then applied to the first bond member 16a and second bond member 16b by a cylinder 46, and heated to below the melting point by a heater 48, to bond the first and second bond members together.

Abstract: A method and apparatus for continuously seaming cured EPDM membrane to form a composite sheet of predetermined width and indefinite length. The method includes the steps of providing at least two rolls of cured EPDM membrane having longitudinal marginal edges and feeding the cured EPDM membrane from the at least two rolls in a first direction. The longitudinal marginal edges of the cured EPDM membranes are positioned in an overlapping relationship as the cured EPDM membranes are fed in the first direction and then the overlapping longitudinal marginal edges are continuously seamed to form a composite sheet of indefinite length.

Abstract: A method for producing integral capacitance components for inclusion within printed circuit boards. Hydrothermally prepared nanopowders permit the fabrication of a very thin dielectric layers that offer increased dielectric constants and are readily penetrated by microvias. Disclosed is a method of preparing a slurry or suspension of a hydrothermally prepared nanopowder and solvent. A suitable bonding material, such as a polymer is mixed with the nanopowder slurry, to generate a composite mixture which is formed into a dielectric layer. The dielectric layer may be placed upon a conductive layer prior to curing, or conductive layers may be applied upon a cured dielectric layer, either by lamination or by metallization processes, such as vapor deposition or sputtering.

Abstract: A die system for use in formation of a welded flashing, comprising a body portion comprised of a conducting material, the body portion having a first end and a second end; an indent portion at the first end of said body portion adapted to accept a portion of the flashing during welding; and where the portion of the flashing accepted in the indent portion of the body portion is folded away from an operational connection between the first end of the body portion and a welder during welding.

Abstract: An optical information recording medium is manufactured by bonding a first substrate having a first central bore and a second substrate having a second central bore to each other with radiation cure resin. The radiation cure resin is coated on the first substrate. The first and second substrates are brought into close contact with each other so as to form the first and second substrates integrally with the radiation cure resin. A neighborhood of the first and second central bores is radiated. A whole of at least one of opposite outer faces of the integral first and second substrates is irradiated with radiation so as to wholly cure the radiation cure resin.

Abstract: Thermoplastic welding is an emerging technology targeted at significantly reducing the manufacturing cost of aerospace structure by eliminating fasteners and the touch labor associated with fasteners to prepare, install, and inspect the assemblies. Quality welds are highly dependent upon achieving appropriate temperatures everywhere along the bond line. The present invention is a system that evaluates the quality of the welds involving inputting an EM pulse to the embedded susceptor and listening to the acoustic response that the pulse generates to determine weld quality from the sound.

Abstract: The electrical properties of the bond formed between a metal substrate and an electrically conductive adhesive is improved, especially in high humidity conditions, by applying to the metal substrate an organic coupling agent prior to application of the electrically-conductive adhesive thereto.

Abstract: Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

Abstract: A LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame. The lead frame has stress relief slots formed in the undersides of the lead elements proximate the adhesive to accommodate filler particles lodged between the leads and the active surface of the die during transfer molding of a plastic encapsulant. The increased space created by the slots and flexure in the leads about the slots reduces point stresses on the active surface of the die by the filler particles. The increased flexure in the leads about the slots further enhances the locking of the leads in position with respect to the die.

Abstract: A method includes adhesively mounting an adhesive lower surface of a protective layer to a top surface of a die such as an image sensor die or a micromachine die. A special-purpose area on the top surface of the die is contacted and protected by said protective layer. The protective layer includes a polymerizable material, which includes the adhesive lower surface. The method further includes rendering the adhesive lower surface to be nonadhesive. The adhesive lower surface is rendered nonadhesive by polymerizing the polymerizable material of the protective layer with ultraviolet radiation.

Abstract: A dielectric substrate useful in the manufacture of printed wiring boards is disclosed wherein the dielectric substrate comprises at least one organic polymer having a Tg greater than 140° C. and at least one filler material. The dielectric substrate of this invention has a dielectric constant that varies less than 15% over a temperature range of from −55 to 125° C.

Abstract: Adhesive systems comprised of one or more photoinitiators and one or more adhesives capable of radiation-induced reaction are useful in one-step or multi-step perfect binding of books and other printed articles. The adhesive may be a low viscosity mixture of a monomer and/or polymer which is cross-linkable by UV or stronger electromagnetic radiation.

Abstract: A first adhesively coated tape material length is supplied to a first die associated with a cutting and application mechanism. A second length of adhesively coated tape material is also provided to a second die of the cutting and application mechanism. A plurality of LOC leadframes is supplied sequentially through the application structure to apply a first decal cut from the first tape material to a first die site at a first location and to apply a second decal cut from the second tape material to a second die site at a second location.

Abstract: A method for fastening a flat strip lamella (10) to the surface of a building component (12). According to the inventive method, the face (14) of the flat strip lamella (10) is pressed against the surface of the building using an adhesive coating (16) consisting of a reaction resin applied in a paste-like consistency (16) and hardened to form an adhesive joint. The flat strip lamella (10) comprises a plurality of carbon fibers which are embedded in a binder matrix (28) and placed parallel to each other in a longitudinal direction. In order to increase the speed at which the adhesive coating hardens, the invention provides that an electrical current flows through least one part of the carbon fibers (26), heating the flat strip lamella (10) which in turn heats the adhesive coating (16).