Abstract: A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members 16a and 16b is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit 24 and water vapor from a vapor generator 26 in a fluorination process section 12. The bond members 16a and 16b are then placed in contact at the fluorinated surface on table 36 in bonding process section 14. Argon is then introduced to bonding chamber 34. Pressure is then applied to the first bond member 16a and second bond member 16b by a cylinder 46, and heated to below the melting point by a heater 48, to bond the first and second bond members together.

Abstract: An ultrasonic sealing apparatus comprises at least one horn having an elongated sealing face for sealing a packing material. Plural converters are erected on a side of the horn opposite to the sealing face for resonating the horn with a vibrating frequency. The ultrasonic sealing apparatus has a length that is one wavelength of the vibrating frequency and is fixed in position to a sealing jaw at a nodal plane of the vibrating frequency.

Abstract: A three-dimensional element is fabricated from a high-temperature superconductor. The method and apparatus can fabricate, for example, a single-electron tunnel device or an intrinsic Josephson device which utilize the layer structure peculiar to the high-temperature superconductor, with machining from the side surface of a monocrystal or thin film. In the focused-ion beam etching, a substrate holder which is rotatable about 360°, is rotated, at the minimum, through an angle of about 90°, and the thin film or monocrystal on the substrate is etched from the side surface thereof so as to fabricate the element. After the thin film or monocrystal is machined from above by means of an focused-ion beam to thereby form a bridge having a junction length, the sample is rotated by about 90° (270°). Subsequently, a multi-layer current path layer is formed through side-surface machining. The junction length is accurately controlled through measurement of the current path length from an image display.

Abstract: A method and an apparatus for bonding optical disk substrates, includes placing a pair of optical disk substrates on a stage while securing a height difference at an upper face of the stage loading the substrates between an upper face at a side of a center of the substrates and an upper face at a side of an outer circumference of the substrates. The method and the apparatus also includes photosetting the adhesive layer on the stage by irradiating a setting light to the substrate pair, thereby photosetting the adhesive layer and bonding the substrates.

Abstract: A method is disclosed for manufacturing parts with intimate connection of least two material phases, of which at least one is a solid body phase. Prior to intimate connection, at least the surface of the solid body phase to be connected is pretreated by a plasma-activated gas that contains nitrogen. The method is used, for example, for connecting integrated circuits with an HLST or for the electrical connection of the printed circuits by wire bonding or for the sheathing of electrical circuits joined with HLST and connected by wire bonding, with a potting compound.

Abstract: A method of making a vehicle windshield. First and second flat glass sheets are bent together into a shape desired for the windshield. The bent sheets are separated, and an interlayer (e.g., PVB) positioned therebetween. After the sheets have been heat laminated to one another via the interlayer, the convex tin side of the outer sheet is ion beam milled to shave off a portion thereof. Then, a diamond-like carbon (DLC) inclusive coating is deposited using an ion beam(s) on the milled convex shaped surface of the laminate to produce a windshield. In certain optional embodiments, the windshield may be hydrophobic in nature.

Abstract: A method of manufacturing a ceramic electronic component including: a first step of providing a plurality of ceramic sheets containing ceramic powder and polyethylene and having a porosity of 30% or more, and a conductor layer containing metal powder, plasticizer and resin on a base film; a second step of laminating and pressurizing the conductor layer together with the base film on one of the ceramic sheets, and peeling off the base film to form a ceramic sheet with the conductor layer; a third step of disposing another ceramic sheet on top of the conductor layer; a fourth step of laminating and pressurizing another conductor layer on top of the another ceramic sheet; a fifth step of repeating the third and the fourth steps to form a laminated body having a desired number of layers; and a sixth step of sintering the laminated body.

Abstract: A belt-like film 18 is moved along a plate 15 folded to be rectangular in section, so that the film 18 is formed into a continuous tube by a tubular frame of the plate 15. A spring piece 30 having an anvil 31 bulged out therefrom is securely held on the inner side edge 16 of the aforementioned plate 15, and an ultrasonic hammer 32 is located face to face with said anvil 31, so that both side edges of the belt-like film 18 formed into a tube are placed on the anvil 31 to be melded by the ultrasonic vibration of the hammer 32.

Abstract: In order to provide a method of carrying out working steps in at least one work station on miniaturized modules which are held by a module carrier provided with a holding device, whereby the method enables a plurality of processing steps to be carried out on a module, it is proposed that the module be moved by one of the module carriers to a plurality of work stations for carrying out the working steps and that it be precisely positioned for carrying out one of the working steps by means of a relative movement between the module carrier and the currently relevant one of the plurality of workstations, and in that the positioning of the module relative to the module carrier be maintained for carrying out the working steps.

Abstract: A method of mounting a component on a substrate includes applying a conductive adhesive on a contact pad joined to a substrate, aligning a component with the substrate such that at least one lead of the component is juxtaposed with the conductive adhesive, performing a partial cure of the conductive adhesive, testing performance of the component, and performing a full cure of the conductive adhesive. Another method includes the additional steps of applying a tacky film to the substrate and juxtaposing the component with the tacky film. When the testing in either embodiment shows a defective or misaligned component, the component may be replaced or repositioned by cold separation of the at least one component lead from the partially cured conductive adhesive. Optionally, additional conductive adhesive may be applied, when needed, before replacement or repositioning of a component.

Abstract: A method for filling a via formed through a silicon wafer is disclosed. The method entails mounting the silicon wafer on a mounting substrate and depositing either molten or solid balls of a conductive material into the via. The deposited conductive material may be reflowed to provide electrical contact with other components on the surface of wafer.

Abstract: A method of mounting a component on a substrate includes applying a conductive adhesive on a contact pad joined to a substrate, aligning a component with the substrate such that at least one lead of the component is juxtaposed with the conductive adhesive, performing a partial cure of the conductive adhesive, testing performance of the component, and performing a full cure of the conductive adhesive. Another method includes the additional steps of applying a tacky film to the substrate and juxtaposing the component with the tacky film. When the testing in either embodiment shows a defective or misaligned component, the component may be replaced or repositioned by cold separation of the at least one component lead from the partially cured conductive adhesive. Optionally, additional conductive adhesive may be applied, when needed, before replacement or repositioning of a component.

Abstract: A method of making a liquid crystal display, including the steps of providing a substrate; providing a first electrode over the substrate; coating the first electrode with aqueous dispersed material which when dried provides a protective dielectric layer over the first electrode; coating the dielectric layer with liquid crystal bearing material and drying such liquid crystal bearing material, providing a second substrate having a second electrode, coating the second electrode with a dielectric adhesive layer; and laminating the coated second electrode to the liquid crystal bearing material by means of the dielectric adhesive material.

Abstract: A method for bonding an oxide-containing member to an aluminum surface, includes the steps of: providing a substrate, wherein a portion of a surface of the substrate has aluminum thereon; positioning an oxide-containing member on the aluminum surface of the substrate; and bonding the oxide-containing member to the aluminum surface by pressing the oxide-containing member against the aluminum surface while simultaneously heating the interface between the oxide-containing member and the aluminum surface. The interface between the oxide-containing member and the aluminum surface is heated with a laser.

Abstract: Several embodiments of a method for manufacturing an optical assembly for use in an optical flying head are provided. The optical assembly may include a solid immersion lens and a magnetic coil. Techniques are provided for fabricating the solid immersion lens and the magnetic coil. Techniques are also provided for installing the optical assembly into a slider for the optical flying head. Other embodiments are described in which a solid immersion lens is installed in or is integral with a transparent slider. A magnetic coil may also be installed in these embodiments.

Abstract: An apparatus fabricating a resonator including a horn member and a plurality of piezoelectric members which are secured together by an adhesive layer, including a support element for holding said horn securely in place; and a plurality of clamping bars for applying a discrete force to each one of said plurality of piezoelectric members, each one of said plurality of clamping bars is in contact and associated with an individual piezoelectric member from said plurality of piezoelectric elements thereby maintaining a substantially uniform adhesive layer thickness between said horn and each of one said plurality of piezoelectric members.

Abstract: A method and system of manufacturing an air bag cover assembly utilizing infrared radiation is disclosed. The assembly includes a front panel, a back plate, a switch and infrared-absorbing material. Initially, the front panel and the back plate are positioned so that inner surfaces of the front panel and the back plate define a switch pocket therebetween. Then the switch is positioned in the switch pocket. Thereafter, infrared radiation is directed at the infrared-absorbing material for a time sufficient to heat the infrared-absorbing material to a desired temperature. The amount of heat applied to the infrared-absorbing material by the infrared radiation is controlled by a controller. Finally, the heated material cools to fixedly secures the back plate to the front panel. The heated material may be forced to flow prior to cooling.

Abstract: A carrier for semiconductor components, and a method and system for handling semiconductor components using the carrier, are provided. The carrier includes a frame having component mounting sites that include adhesive members for retaining the components on the carrier. The adhesive members can include one or more pieces of polymer tape having low tack adhesive surfaces for retaining the components, and high tack adhesive surfaces for bonding to the carrier. The low tack adhesive surfaces are formulated to provide adhesive forces sufficient to retain the components on the component mounting sites, but low enough to allow a conventional pick and place vacuum tool to remove the components from the carrier. The adhesive forces on the components are determined by a contact area between the components and low tack adhesive surfaces, and by adhesive qualities of the low tack adhesive surfaces.

Abstract: Systems and methods are described for loss dielectrics. A method of manufacturing a lossy dielectric includes providing at least one high dielectric loss layer and providing at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer and then densifying together. The systems and methods provide advantages because the lossy dielectrics are less costly and more environmentally friendly than the available alternatives.

Abstract: A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive.