Abstract: A display panel and a method of fabricating the same are provided. The display panel includes: a base substrate; a first electrode disposed on the base substrate; a hole injection layer disposed on the first electrode, wherein a surface of the hole injection layer away from the first electrode is scattering surface. In the present invention, the surface of the hole injection layer away from the first electrode is set as the scattering surface, and changes of brightness and chromaticity caused by a change of viewing angles is weakened by the scattering surface, thereby expanding viewing angles of the display panel.

Abstract: A packaging structure, a packaging method, and a display apparatus are disclosed. The packaging structure includes: a first substrate and a second substrate opposite to each other; a plurality of first sealing frames located between the first substrate and the second substrate, wherein the first substrate, the second substrate and the plurality of first sealing frames enclose a plurality of sealed cavities not communicating with each other, and each of the sealed cavities is configured to package at least one to-be-packaged unit of a to-be-packaged device; and a first filler located in the sealed cavity.

Abstract: An organic light-emitting diode (OLED) display and method of fabricating the same are disclosed. In one aspect, the OLED display includes a first substrate including a display area and a peripheral area surrounding the display area. The display area includes a plurality of pixels each including an OLED and the peripheral area includes a signal driver electrically connected to the pixels. A conductive layer is formed over the signal driver and on opposing sides of the signal driver and a second substrate is formed over the first substrate. The OLED display further includes a first seal interposed between the first and second substrates in the peripheral area and substantially sealing the first and second substrates and a second seal surrounding the first seal and formed over the signal driver.

Abstract: An OLED is disclosed that includes an enhancement layer having optically active metamaterials, or hyperbolic metamaterials, which transfer radiative energy from the organic emissive material to a non-radiative mode, wherein the enhancement layer is disposed over the organic emissive layer opposite from the first electrode, and is positioned no more than a threshold distance away from the organic emissive layer, wherein the organic emissive material has a total non-radiative decay rate constant and a total radiative decay rate constant due to the presence of the enhancement layer, and the threshold distance is where the total non-radiative decay rate constant is equal to the total radiative decay rate constant; and an outcoupling layer disposed over the enhancement layer, wherein the outcoupling layer scatters radiative energy from the enhancement layer to free space.

Abstract: The embodiment of the present disclosure provides a display panel and a manufacturing method thereof. The display panel includes: an active area; and an aperture area at least partially surrounded by the active area, wherein at least one barrier wall is provided between the active area and the aperture area, a thin film encapsulation is provided on a first side of the display panel, and the thin film encapsulation covers the barrier wall and the active area, and wherein a convex-concave structure is provided on at least one surface of the barrier wall in contact with the thin film encapsulation.

Abstract: Disclosed are a display panel, a manufacturing method thereof, and a display device. The display panel includes a base substrate and sub-pixels thereon. At least one sub-pixel includes: a light emitting element including a first electrode, a luminous functional layer and a second electrode sequentially stacked, the first electrode being closer to the base substrate than the second electrode; a metal reflective layer, between the base substrate and the first electrode; a silicon nitride layer, between the first electrode and the metal reflective layer, and including a first via hole through which the first electrode is connected with the metal reflective layer; a driving circuit including a driving transistor and a storage capacitor between the base substrate and the metal reflective layer, the driving transistor including a gate electrode connected with the storage capacitor, and source and drain electrodes, one of which is connected with the metal reflective layer.

Abstract: A flattening device, a display substrate and a method for manufacturing the display substrate are provided. The method includes providing a base substrate, forming a pixel definition layer on the base substrate and forming an uncured sub-pixel material in a plurality of sub-pixel regions defined by the pixel definition layer, and flattening the uncured sub-pixel material by a flattening device. The flattening device includes a main body and a plurality of protrusions on a surface of the main body. A size of a protrusion surface of each protrusion facing away from the main body is not greater than that of each sub-pixel region. The sub-pixels are flattened by using the flattening device, so a sub-pixel material layer with a flat surface may be obtained, which improves the structure of the sub-pixels and improves the display performance of the display substrate.

Abstract: A method of forming a leadless packaged semiconductor device. First partial sawing leads is performed on a bottom side of an in-process leadless semiconductor package having a leadframe including die pad with a semiconductor chip thereon, and leads defining top and bottom surfaces and having an inner end and an outer end having a bottom corner region. Conductive bond wires connect to and extending between bond pads on the chip and respective leads, a mold compound is around the die pad, leads, chip, and conductive bond wires while exposing the bottom surface and outer end. The first sawing completely severs the leads while forming only a partial cut in the mold compound. A de-flash process is applied to the bottom side. The second sawing aligned to the partial cuts reaches the partial cuts to complete singulation of the package, wherein the second sawing does not touch the leads.

Abstract: The present disclosure provides a display panel and a mask. The display panel does not dispose a common electrode layer in a transparent area and an aisle area, and by this way, after the transparent area of the display panel is cut to form a through-hole, the common electrode layer can still be protected by other film layers and not be directly exposed to air, thereby preventing intrusion of water and oxygen.

Abstract: A semiconductor device including a substrate; a chip on which a surface electrode is formed; and a lead. The lead includes a first electrode connecting portion disposed on the surface electrode and electrically connected to the surface electrode of the chip via a conductive bonding material; a second electrode connecting portion electrically connected to an electrode portion of a wiring pattern. A lead connected to the first electrode connecting portion and the second electrode connecting portion. The lead further has a thermal shrinking stress equalizing structure on a portion of an outer periphery of the first electrode connecting portion. The lead is configured to make a thermal shrinking stress applied to a conductive bonding material between the first electrode connecting portion and the surface electrode equal.

Abstract: Embodiments described herein generally relate to sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes substrate, pixel-defining layer (PDL) structures disposed over the section of the substrate, inorganic or metal overhang structures disposed on an upper surface of the PDL structures, and a plurality of sub-pixels. The PDL structures include a trench disposed in the top surface of the PDL structure. Each sub-pixel includes an anode, an OLED material disposed over and in contact with the anode, and a cathode disposed over the OLED material. The inorganic or metal overhang structures have an overhang extension that extends laterally over the trench. An encapsulation layer is disposed over the cathode and extends under at least a portion of the inorganic or metal overhang structures and along a top surface of the PDL structures.

Abstract: A top emission organic EL element includes a substrate, an insulating layer including a hole portion, a lower electrode, a light emitting layer, a bank surrounding the lower electrode and the light emitting layer, and an upper transparent electrode. The insulating layer, the lower electrode, the light emitting layer, the bank, and the upper transparent electrode are disposed above the substrate. The bank is arranged on the insulating layer so as to surround the hole portion. The lower electrode is configured to cover an inner side of the hole portion and an area, where the bank is not arranged, of an upper surface of the insulating layer, and a thickness at a center area of the lower electrode is 150 nm or more.

Abstract: Disclosed is a display device configured such that a mixture of a transition metal and an organic material is used as a cathode, whereby the cathode exhibits low resistance, high transmittance, high reliability, and high performance in the state in which the cathode is thin.

Abstract: Provided is a method for preparing an organic electronic device, comprising steps of: applying an ink composition on a substrate, on which an organic electronic element is formed; applying heat thereto before curing the applied ink composition; and curing the applied ink composition by irradiating with light having a wavelength in a range of 300 nm to 450 nm. Also provided is an organic electronic device, comprising a substrate, an organic electronic element formed on the substrate, and an organic layer sealing the entire surface of the organic electronic element, wherein after the organic layer is maintained at 110° C. for 30 minutes, the out-gas amount measured using Purge & Trap-gas chromatography/mass spectrometry is less than 150 ppm.

Abstract: This disclosure relates to a discrete cascode semiconductor device and associated method of manufacture, the device includes: a high voltage depletion mode device die having gate, source and drain terminals arranged on a first major surface thereof; a low voltage enhancement mode device die having a gate and a source terminal formed on a first major surface thereof, and a drain terminal formed on a second major surface opposite the first major surface. The drain terminal of the high voltage device die is mounted on a drain connection; the source terminal of the low voltage device die and the gate terminal of the high voltage device are mounted on a common source connection; and the drain terminal of the low voltage device die is mounted on the source terminal of the high voltage device.

Abstract: Disclosed are a display panel, a manufacturing method thereof, and a display device. The display panel includes a base substrate and sub-pixels thereon. At least one sub-pixel includes: a light emitting element including a first electrode, a luminous functional layer and a second electrode sequentially stacked, the first electrode being closer to the base substrate than the second electrode; a metal reflective layer, between the base substrate and the first electrode; a silicon nitride layer, between the first electrode and the metal reflective layer, and including a first via hole through which the first electrode is connected with the metal reflective layer; a driving circuit including a driving transistor and a storage capacitor between the base substrate and the metal reflective layer, the driving transistor including a gate electrode connected with the storage capacitor, and source and drain electrodes, one of which is connected with the metal reflective layer.

Abstract: An electronic component comprising: an electronic substrate that includes an electronic element and a first connection terminal a package member that is disposed on the electronic substrate; and a circuit member that includes a second connection terminal, wherein the circuit member is disposed between the package member and the electronic substrate, and extends from the position between the package member and the electronic substrate outward beyond the edge of the electronic substrate; the electronic component includes a connecting member that is disposed between the circuit member and the electronic substrate, and electrically connects the second connection terminal and the first connection terminal, an adhesive member that is disposed between the circuit member and the package member, and joins the circuit member to the package member; the connecting member, the circuit member, and the adhesive member are located between the package member and the electronic substrate.

Abstract: A display substrate and preparation method thereof, an ink-jet printing method and a display device are provided. The display substrate includes a display area, a peripheral area, and a pixel definition layer; the pixel definition layer including: a display pixel definition region and an assistant pixel definition region surrounding the display pixel definition region; the display pixel definition region includes a plurality of first pixel definition units; the assistant pixel definition region includes a plurality of second pixel definition units, and opening areas of the second pixel definition units are respectively greater than those of the first pixel definition units; the display pixel definition region is in the display area, the assistant pixel definition region is in the peripheral area, the plurality of first pixel definition units is configured to form display pixels, and the plurality of second pixel definition units is configured to form assistant pixels.

Abstract: A display backplate and a manufacturing method thereof, and a display device are provided. The display backplate includes a base substrate and a pixel defining layer provided on the base substrate, the pixel defming layer defines a plurality of sub-pixel openings, an accommodation groove is provided at a surface of the pixel defining layer facing away from the base substrate, and the accommodation groove is located between two adjacent sub-pixel openings.

Abstract: In one general aspect, a semiconductor device package can include a die attach paddle having a first surface and a second surface that is opposite the first surface. The package can also include a semiconductor die coupled with the first surface of the die attach paddle. The package can further include a direct-bonded-metal (DBM) substrate. The DBM substrate can include a ceramic layer having a first surface and a second surface that is opposite the first surface; a first metal layer disposed on the first surface of the ceramic layer and coupled with the second surface of the die attach paddle; and a second metal layer disposed on the second surface of the ceramic layer. The second metal layer can be exposed external to the semiconductor device package. The second metal layer can be electrically isolated from the first metal layer by the ceramic layer.