Patents Examined by Minh Trinh
  • Circuit substrate manufacturing method
    Patent number: 7222421
    Abstract: A circuit substrate manufacturing method including the steps of preparing a substrate on which a metallic foil is formed in a releasable state, forming a build-up wiring on the metallic foil, obtaining a circuit member having a structure that the build-up wiring is formed on the metallic foil by releasing the metallic foil from the substrate, and exposing a lowest wiring layer of the build-up wiring by removing the metallic foil of the circuit member.
    Type: Grant
    Filed: January 14, 2005
    Date of Patent: May 29, 2007
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Junichi Nakamura
  • Method for making a front and back conductive substrate
    Patent number: 7222420
    Abstract: A front-and-back electrically conductive substrate includes a plurality of posts composed of a material that can be anisotropically etched and having an electrically conductive portion that has at least a first surface and a second surface that communicate with each other, and an insulative substrate that supports the plurality of posts.
    Type: Grant
    Filed: March 17, 2004
    Date of Patent: May 29, 2007
    Assignee: Fujitsu Limited
    Inventor: Kiyokazu Moriizumi
  • Method of manufacturing protruding-volute contact
    Patent number: 7219426
    Abstract: A method of manufacturing a protruding-volute contact for attaining electrical continuity with an electrode of electronic equipment or inspection equipment, the method comprising the steps of forming a plastic mold (resist structure) with a metal mold; forming a layer consisting of metallic material on the plastic mold (resist structure) by means of electroforming; and performing convex formation of a metal microstructure made from the layer consisting of metallic material so as to form a spiral spring that protrudes volutedly outward. With such method, an inspection contact or coupling contact having high reliability and capable of attaining electrical continuity of large electric current can be produced at low cost.
    Type: Grant
    Filed: October 26, 2004
    Date of Patent: May 22, 2007
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventor: Tsuyoshi Haga
  • Method for manufacturing commutator having commutator segments
    Patent number: 7219411
    Abstract: A feed rate of a single-point cutting tool, which is an axial relative moving distance of the cutting tool along an outer peripheral surface of an unfinished commutator product per revolution of the unfinished commutator product, is reduced in an end part of a cutting region of the outer peripheral surface of the unfinished commutator product, which is adjacent to a commutator riser of each commutator segment provided in the outer peripheral surface of the unfinished commutator product.
    Type: Grant
    Filed: March 17, 2004
    Date of Patent: May 22, 2007
    Assignee: ASMO Co., Ltd.
    Inventor: Shinji Ikeda
  • Arrangement in explosion joining of ends of wires and the like
    Patent number: 7219425
    Abstract: A method of joining the interfacing ends of cables, one to another, wherein each comprises a plurality of conductor strands, comprising (i) providing each of the ends with an enlarged terminal portion of greater diameter than the cable adjacent the end, (ii) inserting the ends into a connecting tube having an outer layer of an explosive charge, and (iii) detonating the explosive layer so as to compress the connecting tube around the conductor strands. The method offers a cheaper, faster and simpler method of joining a bundle of wires and the like than prior art methods.
    Type: Grant
    Filed: March 23, 2004
    Date of Patent: May 22, 2007
    Inventor: Ciro Pasini
  • Method of forming a non-continuous conductive layer for laminated substrates
    Patent number: 7216425
    Abstract: A method of fabricating a circuit board is provided that includes forming a first layer of conductive material over an insulating layer, removing portions of the conductive material to define a first circuit pattern and a first rail area that is electrically isolated from the first circuit pattern, and removing portions of the conductive material from the first rail area. Optionally, the first rail area is positioned generally adjacent to a first edge of the circuit board and spans at least a portion of the length of the first edge. Optionally, portions of the conductive material of the first layer are removed to define a second rail area that is electrically isolated from the first circuit pattern and the first rail area, and portions of the conductive material of the first layer are also removed from the second rail area.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: May 15, 2007
    Assignee: Micron Technology, Inc.
    Inventor: Patrick W. Tandy
  • Method of forming a capacitor assembly in a circuit board
    Patent number: 7216422
    Abstract: A circuit board includes an assembly having first and second power reference plane layers, and an insulator layer between the first and second power reference plane layers. Discrete decoupling capacitors are further provided with the assembly. Additional layers are provided above and below the assembly.
    Type: Grant
    Filed: December 8, 2004
    Date of Patent: May 15, 2007
    Assignee: NCR Corp.
    Inventors: Jun Fan, James L. Knighten, Arthur R. Alexander, Norman W. Smith
  • Method for using divider rods for separating superconducting regions in fine filament internal tin wire
    Patent number: 7216418
    Abstract: A method for decreasing the effective magnetic filament sizes for high current internal tin Nb3Sn superconductors. During processing composite rods preferably comprised of copper clad Ta rods of approximately the same dimensions as the hexes in the designed filament billet stack are used as dividers in the subelement. Along with the Ta rods, Ta strips are strategically situated against the Nb or Nb alloy barrier tube which surrounds the subelement. The use of Ta as a spacer instead of copper prevents any reasonable likelihood of bridging of the superconducting phases formed after final reaction.
    Type: Grant
    Filed: October 22, 2004
    Date of Patent: May 15, 2007
    Assignee: Oxford Superconducting Technology
    Inventors: Seung Hong, Jeff Parrell, Youzhu Zhang, Michael Field
  • Method for forming stencil
    Patent number: 7213331
    Abstract: A method of forming a stencil for the manufacture of semiconductor devices includes defining a plurality of slightly spaced segmental annular openings in a stencil plate. The spacing between the segmental annular openings define spokes extending from a central portion of said stencil connected via those spokes to the rest of the stencil plate. The spokes extend past two adjacent annular segments.
    Type: Grant
    Filed: October 20, 2003
    Date of Patent: May 8, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Tongbi Jiang, Edward A. Schrock
  • Method for manufacturing printed circuit boards
    Patent number: 7213335
    Abstract: The amount of time required to manufacture double-sided printed circuit boards that contain conductor bridges can be reduced. A method is provided which includes the steps of forming holes which pass through an insulating board and a first conductor layer formed on a first main side of the insulating board, bonding a second conductor layer to a second main side of the insulating board having the holes, forming a third conductor layer on the whole first main side of the insulating board after bonding the second conductor layer, masking preset holes with a plating resist, plating the first conductor and holes in the insulating board, patterning the first conductor layer to form a first conductor pattern, patterning said second conductor layer to form a second conductor pattern, and removing the plating resist and the third conductor layer from an area which is covered with the plating resist.
    Type: Grant
    Filed: March 1, 2004
    Date of Patent: May 8, 2007
    Assignee: Hitachi Cable, Ltd.
    Inventors: Akiji Shibata, Toyoharu Koizumi, Tsuyoshi Ishihara, Takashi Sato
  • Method and device for through-hole plating of substrates and printed circuit boards
    Patent number: 7207107
    Abstract: A method and apparatus for through-contacting flexible substrates 1, in particular circuit boards, having electrically conductive contact zones 4, 41 present on two opposing surfaces 1a, 1b of the substrate provides that a cut 11 is produced obliquely to the surfaces of the substrate in the area of the contact zones, and the two substrate areas 20, 30 adjoining the oblique cut are moved past each other until they lock behind each other. Moving them past each other is effected by a ram 12, by the action of compressed air 13, by applying a vacuum 14 or by a driving hook 15 fixed to the cutting tool. The two steps of producing the cut and moving the two substrate areas adjoining the cut past each other are effected in a common processing station, preferably in a single operation.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: April 24, 2007
    Assignee: Giesecke & Devrient GmbH
    Inventors: Juergen Usner, Ando Welling
  • Powder compaction press for capacitor anodes
    Patent number: 7207103
    Abstract: A powder compaction press having opposed rib and channel punches which are interleaved and a production method are used to produce capacitor elements having a uniform compaction density and which are free of surface imperfections.
    Type: Grant
    Filed: December 8, 2003
    Date of Patent: April 24, 2007
    Assignee: Kemet Electronics Corporation
    Inventor: Jeffrey P. Poltorak
  • Method for producing an integral ceramic circuit board
    Patent number: 7207105
    Abstract: A substrate for mounting an electronic component, includes a baseplate having a main surface formed with or without a recess. A ceramic substrate is provided on the main surface of the baseplate and has a smaller size than the baseplate. A metal layer is provided to cover both of the baseplate and the ceramic substrate. The metal layer has a surface remote from the baseplate and the ceramic substrate is made flat, the baseplate is made of a metal-ceramic composite of a metallic material and a ceramic material, and the metallic material in the composite and the metal layer have different compositions. Thus, an integral ceramic circuit board, which is resistant to repeated thermal stress and is superior in reliability can be realized.
    Type: Grant
    Filed: February 4, 2005
    Date of Patent: April 24, 2007
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Akira Miyai, Yukihiko Nakajima, Hideki Hirotsuru, Ryozo Nonogaki, Takuya Okada, Masahiro Ibukiyama
  • Manufacturing method of a modularized leadframe
    Patent number: 7204017
    Abstract: A manufacturing method of a modularized leadframe, using a first mold set to contact and hold the upper surface of rows of multiple block leads, using a second mold set to contact and hold at least one selected surface of the lower surface of leads, the second mold set has a protruding part between each row of leads so that the upper surface of the protruding part be in close contact with the inner surface of the first mold set. The hollow space between the mold sets is then injected with packaging materials such that a leadframe structure having packaged and fixed leads therein and surfaces for wire-bonding and soldering is obtained. A packaging material filling space is formed in the leadframe after removing the first and the second mold sets.
    Type: Grant
    Filed: October 7, 2004
    Date of Patent: April 17, 2007
    Assignee: Optimum Care International Tech. Inc.
    Inventors: Jeffrey Lien, Shihlin Chang
  • Component mounting method
    Patent number: 7200925
    Abstract: Disclosed is a component mounting method. Moved in first and second orthogonal directions is a first mounting head section having first nozzles. The first mounting head is rotated such that the first nozzles rotate and successively pickup components from a first component supply table arranged on one side of a board transfer path. These components are then successively mounted onto a board positioned in the board transfer path. Moved in third and fourth orthogonal directions is a second mounting head section having second nozzles. The second mounting head section is rotated such that the second nozzles rotate and successively pickup components from a second component supply table arranged on an opposite side of the board transfer path. These components are then successively mounted onto the board while positioned in the board transfer path.
    Type: Grant
    Filed: May 15, 2006
    Date of Patent: April 10, 2007
    Assignee: Matsushita Electric, Industrial Co., Ltd.
    Inventors: Kanji Hata, Noriaki Yoshida
  • Method for producing a wiring transfer sheet
    Patent number: 7200927
    Abstract: A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electrically insulating substrate with this wiring transfer sheet, convexities which are complementary to the concavities are formed on the electrically insulating substrate. The convexities improve adhesion between a wiring board and a resin stacked thereon. Therefore, the wiring board thus obtained has surface coplanarity suitable for mounting a semiconductor bare chip and an electronic component as a whole, and a microscopical surface structure which adheres to a material stacked thereon.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: April 10, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Hideki Higashitani
  • Method of packaging electronic parts
    Patent number: 7200924
    Abstract: A method of fabricating electronic parts includes the steps of: mounting electronic elements in regular cavities that are two-dimensionally arranged on a baseboard on which dummy cavities are provided so as to surround the regular cavities, and covering a top of the baseboard with a resin sheet.
    Type: Grant
    Filed: February 13, 2004
    Date of Patent: April 10, 2007
    Assignee: Fujitsu Media Devices Limited
    Inventor: Shingo Masuko
  • Method of making a variable capacitor component
    Patent number: 7200908
    Abstract: A method of making a variable capacitor by forming a grove portion in an insulating substrate, two upper portions of the substrate located on either side of the groove portion forming two lateral edges, a conductive layer covering the inside of the groove portion, a flexible conductive membrane, placed above the groove portion by bearing on the edges, a dielectric layer covering the conductive layer or the membrane to insulate the conductive layer and the membrane, and terminals of application of a voltage between the conductive layer and the membrane, and such that the depth of the groove portion continuously increases from one of the edges to the bottom of the groove portion, and that the conductive layer covers the inside of the groove portion at least to reach one of the two edges, that it may cover.
    Type: Grant
    Filed: May 26, 2006
    Date of Patent: April 10, 2007
    Assignees: STMicroelectronics S.A., Commissariat a l'Energie Atomique
    Inventors: Fabrice Cassett, Guillaume Bouche, Maurice Rivoire
  • Method for manufacturing cylindrical members and method for manufacturing motors having the cylindrical member
    Patent number: 7197823
    Abstract: A magnet (10) that is an annular member is fixed or secured on an outer circumference surface or an inner circumference surface of a yoke (4) that is a cylindrical member. An lower end surface in the axial direction of the magnet is fixed or secured to the same plane as a lower end surface in the axial direction of the yoke (4), or the lower end surface in the axial direction of the magnet is fixed or secured so as to protrude a little from the lower end surface in the axial direction of the yoke. An annular groove (4a) that is recessed outward in the radial direction or inward in the radial direction is formed on a part of the outer circumference surface or the inner circumference surface that is continuous to the yoke (4).
    Type: Grant
    Filed: April 26, 2004
    Date of Patent: April 3, 2007
    Assignee: Nidec Corporation
    Inventors: Yoshio Fujii, Yosuke Yamada, Akira Otagaki
  • Hand-held apparatus for installing flashover protection covers on energized electrical conductors
    Patent number: 7197816
    Abstract: Hand-held devices that can be used to quickly install flashover protection covers around energized electrical conductors and equipment are provided. Each device includes a guide assembly that defines a pair of spaced-apart, converging passageways that are configured to slidably receive the elongated edge portions of a flexible panel therethrough. The converging passageways force together the opposite edge portions of a flexible panel being advanced through the guide assembly.
    Type: Grant
    Filed: March 3, 2000
    Date of Patent: April 3, 2007
    Assignee: Tyco Electronics Corporation
    Inventor: Terry Edward Frye