Abstract: A mask film includes a base material, a parting layer and a non-parting portion placed on the base material. Accordingly, an optimum adhesion strength of the mask film and a prepreg sheet can be maintained, and peeling between the mask film and prepreg sheet can be prevented. Further, by preventing the fusing adhesion between the mask film and prepreg sheet due to heat generated when forming penetration holes, a circuit board having an excellent quality is obtained.

Abstract: A method of linking commutator bars of a commutator for a motor wherein N is the number of magnetic poles of the motor and N is an even integer greater than 2. The method include a) arranging a plurality of commutator bars to be generally equally spaced in a circular arrangement to define the commutator, each commutator bar having a tang extending therefrom, b) contacting an end of a continuous, insulated conductive member to a tang, c) moving the member to contact a second tang which is disposed at an angle of 720°/N from the previously contacted tang to form a link, and when N is greater than four, repeating this step until N/2−1 links are created, d) moving the member to contact a tang which is immediately adjacent to the second tang contacted in step (c) such that the member defines a bridging portion between the adjacent tangs, e) repeating steps (c) and (d) and until all tangs have been contacted by the member, and f) cutting the bridging portion between adjacent tangs.

Abstract: A device for mounting components using mounting heads having a plurality of suction nozzles that provide a plurality of component pickups, positions or mounting operating positions. The mounting heads are positioned on a rotating table that is cooperatively positioned adjacent a component supply table having a plurality of component feeder members. The control unit can rotate the rotating table to position a mounting head at a component supply position and further position one of the plurality of suction nozzles to a first, second and third section operating position for picking up a component from a component feeder. The relative movement of the component supply table and the positioning of first and second suction operating positions relative to our reference point where the edge of the rotating table contacts the line of movement of the component supply table can increase the pickup speed of components.

Abstract: An apparatus is provided to assist a user in aligning and sizing a plurality of spaced-apart channels to be formed in a cleat connected to a power generator housing so as to secure a plurality of leads extending from a power generator through the housing. The apparatus includes a main member to which secondary members removably and movingly connect to align with the leads. Channel sizers connect to the secondary members to register the diameter of each lead. The apparatus first aligns with and registers the diameter of each lead and is then positioned adjacent the housing to assist the user in correctly spacing and forming holes in a support structure such as a cleat. Related methods are also provided for aligning and sizing channels to be formed in a cleat or other support structure to secure the leads extending from the power generator through the housing.

Abstract: A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrically connected to the tabs. An encapsulant is applied to the upper and side surfaces of the leadframe. Finally, the leadframe is cut in situ so that the die pad and tabs are severed from the frame, the sides of the package are formed, and the package is severed from the leadframe.

Abstract: A toroidal printed coil includes a plurality of annular holes (2) and a plurality of center holes (3) surrounded by the annular holes (2) in an insulating substrate (1). A plurality of annular juts (4), each comprising a portion surrounded by the annular hole (2) and the center hole (3), are formed. A printed coil sheet having a plurality of toroidal printed coils, in which a conductor film (6) is spirally formed at front-and-rear surfaces and side surfaces of annular portions (5) of the annular juts (4) with each annular portion taken as an axis, is obtained. With this printed coil sheet, a plurality of toroidal printed coils (P) are obtained by cutting the insulating substrate (1) off from the individual annular juts (4).

Abstract: An extraction device for removing a connector plug from a disc drive socket including first and second lever plates having a length extending between opposed first and second ends and a width extending between opposed sides and the first and second lever plates being pivotally connected between the first and second ends to form lever handles and lever arms. The lever arms include opposed fingers spaced along the width of the lever plates between opposed sides. The lever arms include a slot between fingers, a width of which is sized to enclose a length of the connector plug. A spring biases the lever arms of the first and second lever plates towards one another and the lever plates being movable against a spring bias to open the lever arms to remove a connector plug. A method for removing a connector from a disc drive socket including aligning an extraction device with the connector plug and operating the device to remove the connector plug.

Abstract: A method for controlling the flow of signals by selectively switching signals to ground and allowing signals to pass through a signal line based a position of a conductive pad. The method includes the steps of forming a conductive coplanar signal line and ground planes, depositing a first release layer over the signal line and ground planes, and forming a conductive pad spanning portions of both the signal line and ground planes on the first release layer. The method also includes the steps of forming a second release layer over the conductive pad, forming two sets of holes through the first and second release layers down to the ground planes with the two sets of holes being formed around portions of the conductive path, and forming a dielectric suspension in a first set of the two sets of holes.

Abstract: A video game system includes a video game machine, a memory medium and a controller. A CPU included in the video game machine detects a vibration generating condition that a player object comes into collision or contact with an enemy object or a stationary object. If the vibration generating condition is detected, the CPU drives a vibration source included in the controller, thereby generating vibration on the controller.

Abstract: The present invention is directed to improved cover compositions for golf ball construction and the resulting low modulus golf balls produced utilizing the improved cover compositions. The novel golf ball cover compositions of the invention comprise a blend of a relatively low amount of at least one hard ionomeric resins and a relatively large amount (i.e. from about 75 to about 85-90 percent) of at least one soft ionomer resin. When the cover compositions of the invention are utilized to manufacture golf balls, the golf balls produced thereby, exhibit properties of improved playability at low swing speeds without substantial sacrifices in durability and/or distance characteristics when compared to known hard-soft ionomer blends.

Abstract: A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The conditioning device is preferably arranged to apply different conditioning treatments to different portions of the glazed pad. The conditioning device may have roller segments that rotate at different speeds. Alternatively, the device may have non-cylindrical rollers that provide different rotational speeds at the pad surface, or the device may apply different pressures at different portions of the pad. The device may be arranged to provide uniform conditioning across the width of the pad. The invention is applicable to methods of planarizing semiconductor wafers. The invention may be used to condition circular pads in addition to web-shaped pads.

Abstract: The present invention features a novel design for a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one indicators. Methods of fabricating a carrier substrate and fabricating a semiconductor device package using the combination pin one indicator and alignment fiducial of the present invention are also provided. Preferably, the pin one indicator/alignment fiducial is placed adjacent a comer area of a ball grid array, and comprises an “L”-shaped narrow opening in a solder mask layer in which two lines, mutually perpendicular to one another, form components of an X-Y axis. The pin one indicator/alignment fiducial of the present invention is configured to provide only a minimal opening in the solder resist, making smaller pitches between solder balls and tighter dimensional controls possible.

Abstract: The invention relates to a method for the production of an MID device. Proceeding from a conductor track sheet, which comprises a support sheet as well as conductor tracks arranged thereon, a plastic body is injection-molded onto this conductor track sheet. The conductor tracks have a surface having numerous microscopically small projections and depressions and are designed so as to thereby produce a positively locking connection between the conductor tracks and the plastic body.

Abstract: A printed circuit board with SMD components electrically connected to the printed circuit board by means of a reflow soldering process. In order to provide the printed circuit board with connection elements which can be mounted at minimal cost, the printed circuit board is provided with one or more connection elements for making an electric connection to other electric components. These connection elements are journaled in recesses of the printed circuit board and do not project to the exterior via the surface of the printed circuit board on which the SMD components are secured.

Abstract: A method of mounting electronic components on a circuit substrate using an electronic component mounting device. The electronic component mounting device is operatively associated with (1) a component-supply table which includes a displaceable table and a plurality of component-supply units on the displaceable table and (2) a table displacing device which displaces the displaceable table in a desired direction and which positions the component-supply portion of each component-supply unit at a predetermined component-supply position. The electric component mounting device includes a plurality of component holders which are positioned at a component received position opposed to the component supply position. The method includes causing the component holder to receive, at the component receive position, an electric component from the component-supply portion of each component-supply unit which is positioned at the component-supply position.

Abstract: A method of transferring of integrated circuit devices into and/or out of a plurality of underlying sockets having contacts and mounted to a board, comprising the steps of (A) disposing a socket presser block across at least some of the plurality of sockets, the presser block defining a matrix of cutouts and ribs and being configured to assume a first position in which the presser block is movable and a second position in which the matrix of cutouts is adapted to align with the sockets, (B) placing the presser block in the first position and moving the presser block so the cutouts are aligned with the sockets, and (C) placing the presser block in the second position and transferring the devices into and/or out of the sockets.

Abstract: A wiring method is provided, in which a wire conductor is stuck on a surface of a substrate by causing a three-dimensional relative movement between a wiring head for guiding the wire conductor and the substrate such that the wiring head relatively moves along an adhesive layer on the surface of the substrate and the wiring head and the adhesive layer intermittently come close to each other for point contact.

Abstract: An apparatus for mounting one or more electric components on a circuit substrate, the apparatus including a nozzle moving device which moves a suction nozzle having an end surface that applies a suction to an electric component and thereby holds the component, in a direction intersecting an axis line of the suction nozzle, and an elevating and lowering device which elevates and lowers the suction nozzle so that the suction nozzle performs at least one of sucking and holding the electric component and mounting the component on the circuit substrate, the elevating and lowering device including a movable member, and a connecting device which connects the movable member to the suction nozzle such that the suction nozzle continues moving while the movable member continues moving, the connecting device including a downward-movement control device which changes, while the apparatus performs an electric-component mounting operation, at least one of a position of an end of a downward movement of the suction nozzle cau

Abstract: A Z-axis electrical contact may be formed using a resinous deposit containing conductive particles which may align along surface regions to form an electrical conduction path over the resinous material. If the resinous material is thermoplastic, the material may be heated to mechanically bond to contact surfaces. Advantageously, the resinous material may be formed by forcing a resinous matrix containing conductive particles through an annular opening in a stencil. The resulting member allows surfaces to be contacted which may be irregular or may be covered by native oxide layers.

Abstract: In this method, a ground wire 2 is overlaid on a shield wire 1 in cross. Next, overlapping portions of the shield wire 1 and the ground wire 2 are interposed between an upper resin tip 13 and a lower resin tip 14. By executing a first ultrasonic oscillation while inserting a projection 7a of an ultrasonic horn 7 into a through hole 13b of the tip 13, outside rinds 1d, 2b of the wires 1, 2 are removed in the vicinity of the overlapping portions. Next, by arranging a low-melting metal 15 and a resin piece 16 on a contact between the braided wire 1c and the core line 2a and executing a second ultrasonic oscillation, the contact can be brazed with the mutual welding of the tips 13, 14.