Abstract: Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to implement circuits configured to compensate for parameter variations in layers of memory by adjusting access signals during memory operations. In some embodiments, memory cells are based on third dimensional memory technology. In at least some embodiments, an integrated circuit includes multiple layers of memory, a layer including sub-layers of semiconductor material. The integrated circuit also includes an access signal generator configured to generate an access signal to facilitate an access operation, and a characteristic adjuster configured to adjust the access signal for each layer in the multiple layers of memory.

Abstract: Disclosed herein are 3D stacked memory devices having WL select gates. The 3D stacked memory device could have NAND strings. The WL select gates may be located adjacent to a word line hookup area of a word line plate. The word line plate may be driven by a word line plate driver and may have many word lines. The WL select gates may select individual word lines or groups of word lines. Therefore, smaller units that the entire block may be selected. This may reduce capacitive loading. The WL select gates may include thin film transistors. 3D decoding may be provided in a 3D stacked memory device using the WL select gates.

Abstract: A memory device includes a memory array, a special mode enable register, and a controller. When the controller receives a register write command to write first data into the special mode enable register and the memory device does so, the memory device operates in a first mode. When the controller receives a register write command to write second data into the special mode enable register and the memory device does so, the memory device operates in a second mode.

Abstract: Exemplary embodiments of the present invention disclose a method and system for asserting a voltage transition from a low voltage to a high voltage with a voltage difference between the low and high voltages on a word line with a word line driver logic that is composed of thin-oxide MOS transistors, wherein the thin-oxide MOS transistors experience less than the voltage difference on the word line between any two of a source, a drain, and a gate. In a step, charging the word line from the low voltage to an intermediate voltage level. In another step, charging the word line to the high voltage from the intermediate voltage level.

Abstract: A system and methods for programming non-volatile memory elements by using latches to transfer data. Upon discovering errors in previously programmed non-volatile memory elements, the system recovers the corresponding data from the latches and programming the recovered data to other non-volatile memory elements.

Abstract: According to one embodiment, a semiconductor memory device includes: a memory cell array; a first data latch; a second data latch; a first data bus; a second data bus; a first temporary latch; a second temporary latch; and a control unit. The first and the second data latches are electrically connected to the memory cell array. The first data bus is electrically connected to the first data latch. The second data bus is electrically connected to the second data latch. The first temporary latch is electrically connected to the first data bus. The second temporary latch is electrically connected to the second data bus. The control unit is configured to write data on the first temporary latch and transfer data retained in the first temporary latch to the first data latch while writing data on the second temporary latch.

Abstract: Techniques are described herein for detecting and recovering over-erased memory cells in a flash memory device. In one embodiment, a flash memory device includes a memory array including a plurality of blocks of memory cells. The device also includes a command interface to receive a command from a source external to the memory device. The device also includes a controller including logic to perform a leakage-suppression process in response to the command. The leakage-suppression process includes performing a soft program operation to increase a threshold voltage of one or more over-erased memory cells in a given block of memory cells and establish an erased state.

Abstract: Apparatus and methods for signal margin centering for single-ended eDRAM sense amplifier. A plurality of DRAM cells is connected to an input side of a multiplexer by a first bitline. A single-ended sense amplifier is connected to an output side of the multiplexer by a second bitline. The single-ended sense amplifier has a switch voltage. The second bitline is precharged to a selected voltage level. The multiplexer passes a signal voltage from a selected one of the plurality of DRAM cells to the second bitline. The selected voltage level is selected such that reception of the signal voltage of a first type adjusts a voltage of the second bitline in a first direction and reception of the signal voltage of a second type adjusts the voltage of the second bitline in a second direction opposite from the first direction, centering the signal voltage around the switch voltage.

Abstract: A semiconductor memory device includes a plurality of banks, a plurality of compression blocks configured to compress a plurality of first read data respectively provided by the banks and output a plurality of second read data, a plurality of pipe latches configured to latch the second read data and output third read data in series, an output controller configured to receive the third read data from the pipe latches and sequentially output fourth read data in response to a plurality of bank addresses and a read enable signal, and a pad configured to transfer the fourth read data sequentially outputted from the output controller to an outside of the semiconductor memory device.

Abstract: An embodiment of the invention includes a ternary content addressable memory (TCAM) that has input search data bits, TCAM words and range search input data bits. Each TCAM word is operable to store a match pattern and provide a match output. The match output indicates a match when the match pattern of the TCAM word matches the TCAM input search data bits. The range search input data bits are separated into groups. Each group has a bit width N where N is the number of range search input data bits. For the match pattern in each group, there is a Boolean function that uses the N range of search input data bits. (2N)/2 TCAM bits are provided for each TCAM word. 2N internal TCAM search lines are operable to search the (2N)/2 TCAM bits. Decoder logic is associated with each group that decodes the N range search input data bits.

Abstract: Chip selection and internal clocking functions are enabled within an integrated circuit memory component in response to a single “chip-enable” control signal, thus reducing memory system pin count and wiring complexity relative to designs that require separate chip-select and clock-enable signals. Internal clocking logic may also be provided to generate timing signal edges more precisely limited to the number required to complete a given memory component operation, reducing the number of unnecessary timing events and lowering power consumption. Further, internal read and write clock signals may be speculatively enabled within the memory component to more quickly stabilize those clocks in preparation for data transmission and reception operations, potentially lowering memory access latency.

Abstract: An embodiment of the invention includes first and second Ternary Content Addressable Memories (TCAMs), a first vector, and TCAM match-merge unit. Each of the TCAMs includes a plurality of words, stores TCAM match entries and outputs a TCAM match signal for each word in the plurality of words. The first vector includes first TCAM group enable register bits. An enabling value on the first TCAM register bit indicates that the first TCAM match signal and the neighboring first TCAM match are in the same TCAM group. The TCAM match-merge unit receives the first TCAM match signal from each of the words and the first vector and outputs a first TCAM group match signal for each of the words. The TCAM match-merge unit outputs a match indication when any of the TCAM match signals indicate a match and outputs a mismatch when none of the TCAM match signals match.

Abstract: An operating method of a delay locked loop (DLL) circuit for a semiconductor memory device is disclosed. The DLL circuit may include a plurality of sub-circuits. The method may include calculating an additive latency value based on predetermined parameters, and controlling a set of the plurality of sub-circuits of the DLL circuit to be maintained in a turn-off state based on the calculated additive latency value, during a period of time after the semiconductor device receives an operation command in a power saving mode.

Abstract: The present disclosure relates to a semiconductor device and a method of operating the semiconductor device, and particularly to a semiconductor memory device including a memory cell array and a method of operating the semiconductor memory device. The memory device includes a memory cell array including a plurality of memory cells; and a peripheral circuit configured to program a selected memory cell into a target program state, wherein the peripheral circuit performs a program operation by applying a bit line voltage determined according to the threshold voltage to a bit line of the selected memory cell when a threshold voltage of the selected memory cell is higher than a first verification voltage and is lower than a second verification voltage.

Abstract: A magnetic memory includes memory array tiles (MATs), intermediate circuitry, global bit lines and global circuitry. Each MAT includes bit lines, word lines, and magnetic storage cells having magnetic junction(s), selection device(s) and at least part of a spin-orbit interaction (SO) active layer adjacent to the magnetic junction(s). The SO active layer exerts a SO torque on the magnetic junction(s) due to a preconditioning current passing through the SO active layer. The magnetic junction(s) are programmable using write current(s) driven through the magnetic junction(s) and the preconditioning current. The bit and word lines correspond to the magnetic storage cells. The intermediate circuitry controls read and write operations within the MATs. Each global bit line corresponds to a portion of the MATs. The global circuitry selects and drivesportions of the global bit lines for read operations and write operations.

Abstract: A magneto-resistive random access memory (MRAM) including an MRAM cell array having an MRAM cell, and a control and voltage generation unit configured to generate a back bias voltage for the MRAM cell. The control and voltage generation unit including a command decoder configured to generate a decoding signal in response to a command output from a memory controller, and a voltage controller and generator configured to generate the back bias voltage with a magnitude based on the decoding signal and a reset signal output from the memory controller.

Abstract: A microelectronic package can include a support element having first and second surfaces and substrate contacts at the first or second surface, zeroth and first stacked microelectronic elements electrically coupled with the substrate contacts, and terminals at the second surface electrically coupled with the microelectronic elements. The second surface can have a southwest region encompassing entire lengths of south and west edges of the second surface and extending in orthogonal directions from the south and west edges one-third of each distance toward north and east edges of the second surface, respectively. The terminals can include first terminals at a southwest region of the second surface, the first terminals configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations of the memory storage arrays of at least one of the zeroth or first microelectronic elements.

Abstract: Provided is a semiconductor system and method for repairing the same that may improve repair capacity of the semiconductor system. The semiconductor system comprises a semiconductor circuit configured to output a remaining repair information and perform a repair operation in response to an external command, and a host configured to determine a number of available repairs based on the remaining repair information and provide the semiconductor circuit with the external command based on the number of available repairs.

Abstract: In a memory, a signal holder holds voltages according to data in the storage elements. A busy-signal controller controls a busy-signal. The busy-signal determines whether to permit or reject reception of a read/write enable signal. During reception of the read/write enable signal is rejected, the signal holder holds a first to a third voltages. The first voltage corresponds to target data stored in a first storage element. The second voltage corresponds to first sample data of first logic written to the first storage element. The third voltage corresponds to second sample data of second logic. A sense amplifier detects logic of the target data by comparing a read signal of the first voltage with a reference signal generated by the second and third voltages. The write driver writes the target data/write data to the first storage element. After writing, the reception of the read/write enable signal is permitted.

Abstract: A memory includes storage elements, a signal holding part and a sense amplifier. A driving-method includes a read operation for reading target data stored in a first storage element of the storage elements. In the read operation, the signal holding part holds a first voltage according to the target data. First sample data of a first logic is written to the first storage element. The signal holding part holds a second voltage according to the first sample data. Second sample data of a second logic opposite to the first logic is written to the first storage element. The signal holding part holds a third voltage according to the second sample data. The sense amplifier compares a read signal based on the first voltage with a reference signal generated based on the second and third voltages to detect a logic of the target data stored in the first storage element.