Abstract: A wall-mountable aquarium has a slim tank for containing water to keep living aquatic animals or plants. The tank includes a transparent front wall, a rear wall, opposite left and right side walls and a bottom wall, with the side and bottom walls being considerably narrower than the front and rear walls. A fixed enclosure is provided externally on at least one of the left and right side walls and bottom wall for containing part of accessory for the aquarium. A frame is attached on the front wall, which conceals the enclosure from direct sight from the front and includes a see-through portion therein to reveal only the living habitat inside the tank through the front wall.

Abstract: A reflective sheet includes at least a substrate, a metal reflection layer formed on a top of the substrate, and a diffusion layer formed on a top of the metal diffusion layer to provide an increased reflecting efficiency and enable more even diffusion of light.

Abstract: A projector and a dust detection device for an air filter thereof. The projector comprises a lamp, a fan, an filter, and a dust detection device. The lamp comprises a housing with an inlet and an exit. The fan is disposed in front of the inlet of the housing, and generates airflow to dissipate heat produced by the lamp. The air filter is disposed in front of the exit of the housing, and filters the airflow passing around the lamp. The dust detection device is disposed behind the air filter, and detects the state of the filtered airflow.

Abstract: A new method is provided for the creation of a seal ring or fuse ring over the surface of a Phase Shift Mask. A seal ring pattern is created over the surface of a phase shift mask through a layer of phase shift material and a layer of opaque material. The seal ring is surrounded by a layer of opaque material by etching the layer of opaque material.

Abstract: In accordance with the objectives of the invention a new method is provided for the creation of a layer of a Resistance Protective Oxide (RPO) layer. A layer of ONO is deposited that is to function as the layer of RPO. The deposited layer of ONO is patterned and wet etched, removing the upper or first layer of silicon dioxide. The patterned and etch upper of first layer of silicon dioxide is used as a hardmask to remove the central layer of silicon nitride applying a wet etch. A wet etch is then applied to remove the remaining lower of second layer of silicon dioxide, completing the patterning of the layer of RPO.

Abstract: A method of fabricating a photomask having improved critical dimension (CD) uniformity that meets or exceeds 90 nanometer technology requirements. The method includes the steps of: providing a transparent substrate covered with a layer of opaque material and a layer of photoresist; patterning the layer of photoresist to expose an area of the layer of opaque material that has a shape that follows a contour of a main pattern area to be defined by the layer of opaque material; removing the exposed area to define the layer of opaque material into the main pattern area and an area that surrounds the main pattern area; removing the patterned layer of photoresist; and removing the surrounding area of the layer of opaque material.

Abstract: A scald-preventive disposable cup holder is disclosed to have an endless peripheral wall formed of paper material, a through hole defined by the endless peripheral wall and extending through top and bottom sides thereof, a -shaped cut formed in the endless peripheral wall for enabling a part of the endless peripheral wall to be turned outwards from the endless peripheral wall to form a handle.

Abstract: A background setting for an aquarium having front and rear walls and opposite left and right side walls. The setting comprises a water-resistant background sheet bearing a background scenery for direct submersion in the water of the aquarium to cover the rear wall, and a fixture for fixing the background sheet inside the aquarium.

Abstract: A heat-dispersing module of an electronic device is disclosed.

Abstract: A method and system is disclosed for examining mask pattern fidelity. First, a mask picture is generated from a first mask with a first OPC model applied to a mask design thereon. The mask picture is then converted into a mask based simulation file. A first simulation is conducted under a first set of predetermined lithography processing conditions using the converted simulation file to generate one or more files of a first set representing wafer photo resist profile thereof. On the other hand, a mask design in a database mask file is identified which was used for generating the first mask. The first OPC model is applied to the mask design in the database mask file. A second simulation is then conducted under the first set of predetermined lithography processing conditions using the OPCed mask design to generate one or more files of a second set representing wafer photo resist profile thereof. The first and second sets of files are then evaluated together for the purpose of inspecting mask fidelity.

Abstract: In accordance with the objectives of the invention a new method is provided for the creation of a layer of a Resistance Protective Oxide (RPO) layer. A layer of ONO is deposited that is to function as the layer of RPO. The deposited layer of ONO is patterned and wet etched, removing the upper or first layer of silicon dioxide. The patterned and etch upper of first layer of silicon dioxide is used as a hardmask to remove the central layer of silicon nitride applying a wet etch. A wet etch is then applied to remove the remaining lower of second layer of silicon dioxide, completing the patterning of the layer of RPO.

Abstract: A process via mismatch detecting device is disclosed. Because the vias in the detecting circuit of process via mismatch detecting device are mismatched while the vias between the metal layers of the chips are mismatched, by appropriately placing vias in detecting circuit of process via mismatch detecting device properly, metal lines of different metal layers in the detecting circuit can become short-circuited by mismatched vias, so as to output a voltage signal that is higher after vias mismatch and is regarded as the result of detecting via mismatch. Therefore, the direction and quantity of via mismatch between the metal layers in the chip are detected and monitored effectively, so as to optimize the process. Thus, the yield of process is increased and the cost is decreased.

Abstract: A heat-dissipating fan module of an electronic apparatus is disclosed. The heat-dissipating fan module includes a casing having an opening, the opening having a guiding device along an edge thereof, and a heat-dissipating fan fixed to one side of the casing and correspondingly disposed on the opening.

Abstract: The present invention relates to a suction device with telescopic evacuating pipes which includes a cantilever, a plurality of glide pieces, a pipe-collecting piece and a plurality of telescopic evacuating pipes. The cantilever is provided with a glide groove at both sides thereof. The glide pieces are movable along the glide groove of the cantilever and are positioned by fastening knobs. Each of the glide pieces has a vacuum sucker 132 at the bottom thereof. A first connector is arranged at one side of the glide pieces and used to connect through the internal piping with the vacuum sucker. The pipe-collecting piece is installed at the inner end of the cantilever and is used to join second connectors in connection with a vacuum generator through hosepipes. One end of the telescopic evacuating pipe is fastened at the outer end of the pipe-collecting piece while the other end is connected to the first connector.

Abstract: A method and system is disclosed for inspecting defects on a wafer. After acquiring at least one digitized image of at least one portion of a wafer, at least one design database file corresponding to the portion of the wafer is converted into at least one inspection file. After setting one or more error detection thresholds, the digitized image and the inspection file are compared by an inspection tool for detecting defects with regard to the portion of the wafer based on the set error detection thresholds.

Abstract: A self-adhesive bulletin board assembly includes a bulletin board with a surface coated with a first adhesive layer that is adapted to be attached to a support surface, and a transparent sheet with opposite first and second surfaces that are coated with second and third adhesive layers, respectively. The transparent sheet is sandwiched between first and second protecting sheets prior to attachment of the same to the bulletin board, and is capable of visually exposing the bulletin board when removed from the first and second protecting sheets and attached to the bulletin board by one of the second and third adhesive layers.

Abstract: A new method is provided that extends the process of automation of the CMP process by monitoring the in-line removal rate, by using methods of curve-fitting that enable a reduction in the frequency of monitoring the removal rate of the CMP process, by enhancing the life expectancy of the polishing pad thereby further reducing the frequency of the required Preventive Maintenance and by allowing for the polishing of non-standard lots of wafers.

Abstract: A method of accessing data from field equipments by the host through intelligent network gateways which link field equipments over control network and the host over local area network is disclosed. A configuration software in the host is used to install intelligent network gateways and field equipments as virtual equipment data servers. After finishing installation, the virtual equipment data servers accessupdate store data of the field equipments continuously. Now, the virtual equipment data servers always possess the last field equipment data and can link any application program with a standard communication protocol. The application can integrate easily and high speed access data of a various of field equipments in the factory with only one standard communication protocol through distributed virtual equipment data servers.

Abstract: The present invention discloses an improved multifunctional drinking cup structure, comprising a cup body, an inner cup lid, and an outer cup lid, wherein the inner cup lid is used to cover the opening of the cup body directly, the inner cup lid has an outlet hole, a convection hole, a primary insert hole, and a secondary insert hole (as needed), and the outer cup lid has a corresponding outlet hole, a convection hole, a main insert hole, and a secondary insert hole; the outer cup lid is covered inside the cup body, such that when the outer cup lid is rotated to align the corresponding holes, beverage can be drunk from the outlet hole by the mouth, or by sucking a straw that is inserted into the primary insert hole or the secondary insert hole. Both of the primary insert hole and the secondary insert hole have a guiding structure that prevents the straw from being askew. The outer cup lid may have no holes at all, but is simply used to cover the inner cup lid.

Abstract: A process via mismatch detecting device is disclosed. Because the vias in the detecting circuit of process via mismatch detecting device are mismatched while the vias between the metal layers of the chips are mismatched, by appropriately placing vias in detecting circuit of process via mismatch detecting device properly, metal lines of different metal layers in the detecting circuit can become short-circuited by mismatched vias, so as to output a voltage signal that is higher after vias mismatch and is regarded as the result of detecting via mismatch. Therefore, the direction and quantity of via mismatch between the metal layers in the chip are detected and monitored effectively, so as to optimize the process. Thus, the yield of process is increased and the cost is decreased.