Abstract: The present invention applies management frame defined in IEEE 802.11 standard to a wireless distribution system (WDS) mode by adding an information element (IE) into the management frame, which enables any access point (AP) in WDS to maintain IE based on its own setting and state, then send IE via the management frame for providing state of the AP under WDS mode, determine whether a physical link (i.e., a wireless link between APs) should be established therewith based on received IE, and maintain the established physical link through the wireless management frame in a real time manner. Thus, the existence and necessity of the physical link between different APs in WDS can be determined correctly.

Abstract: A transformer is disclosed. The transformer includes a first pin, a second pin, a first side winding, a second side winding, and a jump pin. The second side winding is coupled to the first pin and the second pin. The first pin is between the jump pin and the second pin. The jump pin is coupled to the second pin inside the transformer.

Abstract: In a package, a heat slug, encapsulated by molding compound, encases an integrated circuit device (IC). In an example embodiment, a semiconductor package structure comprises a substrate having conductive traces and pad landings. The conductive traces have pad landings. An IC is mounted on the substrate. The IC has bonding pads. With conductive wires, the IC bonding pads are connected to the pad landings, which in turn, are connected to the conductive traces. A heat slug, having predetermined height, is disposed on the substrate surface. The heat slug includes a plurality of mounting feet providing mechanical attachment to the substrate. A cavity in the heat slug accommodates the IC. A plurality of first-size openings surrounds the IC. A second-size opening constructed from one of the first size-openings, is larger than the first-size opening. The second size-opening facilitates the introduction of molding compounds into the cavity of the heat slug.

Abstract: Disclosed is a lithography system. The lithography system includes a source designed to provide energy; an imaging system configured to direct the energy onto a substrate to form a predefined image thereon, and defining an optical axis; and an aperture incorporated with the imaging system, the aperture having a plurality of transmitting regions defined along radial axis not parallel to the optical axis, and each transmitting region operable to transmit the energy with adjustable intensity.

Abstract: In a package, a heat slug, encapsulated by molding compound, encases an integrated circuit device (IC). In an example embodiment, a semiconductor package structure comprises a substrate having conductive traces and pad landings. The conductive traces have pad landings. An IC is mounted on the substrate. The IC has bonding pads. With conductive wires, the IC bonding pads are connected to the pad landings, which in turn, are connected to the conductive traces. A heat slug, having predetermined height, is disposed on the substrate surface. The heat slug includes a plurality of mounting feet providing mechanical attachment to the substrate. A cavity in the heat slug accommodates the IC. A plurality of first-size openings surrounds the IC. A second-size opening constructed from one of the first size-openings, is larger than the first-size opening. The second size-opening facilitates the introduction of molding compounds into the cavity of the heat slug.

Abstract: The present disclosure provides a method of making an integrated circuit (IC) device. The method includes forming a first IC feature and a second IC feature in a semiconductor substrate, the first and second IC features being spaced from each other and separated by a scribe region; forming, in the semiconductor substrate, a doped routing feature at least partially within the scribe region and configured to connect the first and second IC features; forming a multilayer interconnect (MLI) structure and an interlayer dielectric (ILD) on the semiconductor substrate, wherein the MLI is configured to be absent within the scribe region; and etching the ILD and the semiconductor substrate within the scribe region to form a scribe-line trench.

Abstract: An electrical connector includes a plurality of pins, an isolation body and a latching mechanism. The isolation body includes a receiving part. The receiving part is arranged at a front edge of the isolation body and has a first engaging element. The latching mechanism has a second engaging element engaged with the first engaging element, so that the latching mechanism is fixed onto the isolation body.

Abstract: Disclosed is an improved aperture design for improving critical dimension accuracy and electron beam lithography. A pattern may be created on a reticle by passing an electron beam through a first aperture having a first shape comprising an upper horizontal edge, a lower horizontal edge, a vertical edge, an upper bevel, and a lower bevel, wherein a portion of the electron beam is projected onto a second aperture. The portion of the electronic beam is passed through the second aperture having a second shape, wherein the second shape is the first shape rotated horizontally by 180 degrees, and an overlapped portion of the first and second aperture is exposed on a surface of the reticle to create a pattern.

Abstract: The invention discloses a transformer for a backlight apparatus including a lamp and a detecting unit. The transformer includes a bobbin, a first winding and a second winding. The bobbin has a low-voltage winding region and a high-voltage winding region. The first winding is wound on the high-voltage winding region and is coupled to the lamp. The low-voltage winding region has a first pin, a second pin and a third pin. Firstly, the second winding is wound on the first pin and then wound on the low-voltage winding region for M turns. Next, the second winding is drawn out from the low-voltage winding region, then wound on the second pin, and then drawn back to be wound on the low-voltage winding region for N turns again. Afterwards, the second winding is drawn out again and wound on the third pin, where each of M and N is a nature number. In addition, the third pin is coupled to the detecting unit.

Abstract: The present invention proposed a trace compression method for a debug and trace interface of a microprocessor, in which the debug and trace interface is associated with a plurality of registers for storing data. The trace compression method comprises the steps of: (1) finding register content of each of the registers in a first cycle and register content of each of the registers in a second cycle, in which the second cycle is next to the first cycle; (2) calculating difference of the register content of each of the registers in the second cycle and the register content of each of the registers in the first cycle; and (3) packing the differences of the register contents into data trace packets, in which the differences of the register contents of adjacent registers are condensed into a single data trace packet when the differences of the register contents of the adjacent registers are zeroes.

Abstract: Disclosed is a n atmospheric-pressure double-plasma graft polymerization apparatus. The apparatus includes a workbench, an initial roller of a roll-to-roll device, an atmospheric-pressure plasma activation device, a peroxide formation device, a coating and grafting device, a drying device, a graft polymerization and curing device, a curing device and a final roller of a roll-to-roll device. The devices are sequentially provided on the workbench.

Abstract: The present invention discloses a strain relief collar for use with an accessory associated with a mobile device and its method of making. The first step is the making of an outer molded body having an engagement portion with a cutout. The second step is inserting a cord into the outer molded body. The third step is the forming of an inner molded body having a hooking portion extending outward from the periphery thereof and beyond the cutout for engaging with an accessory. The present invention also discloses another strain relief collar for use with another accessory associated with a mobile device and its method of making. The first step is connecting the cord to an electrical component associated with the accessory. The second step is the forming of an inner molded body. The third step is the forming of an outer molded body.

Abstract: A method includes forming an absorption material layer on a mask; applying a plasma treatment to the mask to reduce chemical contaminants after the forming of the absorption material layer; performing a chemical cleaning process of the mask; and performing a gas injection to the mask.

Abstract: An automatic apparatus includes an input platform, a creature shaking mechanism, a flushing unit and an output platform. The input platform has a transporting unit. A creature container containing at least one creature is placed on the input platform. The creature shaking mechanism is connected to the input platform. When the creature container is transported to a positioning region of the creature shaking mechanism, the creature container is subject to a shaking operation in response to a power source, thereby turning over the creature and exposing different surfaces of the at least one creature. The flushing unit generates a spout of water to flush the different surfaces of the at least one creature so as to sufficiently shed superficial adherent substances off the at least one creature. The output platform is connected to the creature shaking mechanism for receiving the creature container that is departed from the positioning region.

Abstract: An assembled structure includes a power semiconductor device, a first insulating member, a heat sink and a fastening element. The power semiconductor device has a first perforation. The first insulating member includes a first opening and a second opening corresponding to the first perforation and a receiving portion between the first opening and a second opening. The fastening element includes a head portion and a body portion. The body portion is penetrated through the first opening, the receiving portion, the second opening and the first perforation such that the power semiconductor device is fastened onto the heat sink. The head portion is received in the receiving portion so as to isolate the head portion of the fastening element from adjacent electronic components.

Abstract: The disclosed is a silica-polymeric resin composite of blending the silicon dioxide nanoparticles in thermoplastic polymer and method for manufacturing the same, thereby improving its scratch-resistance. A thermoplastic polymer is dissolved in solvent to form a thermoplastic polymer solution. The polymer solution is evenly mixed with a silicon dioxide sol, and the solvent is then removed to complete the silica-polymeric resin composite. In the silica-polymeric resin composite, the silicon dioxide nanoparticles and the thermoplastic polymer have no chemical bonding therebetween, and the silicon dioxide nanoparticles are evenly dispersed in the thermoplastic polymer.

Abstract: A microphone having a first shell with a cavity region is disclosed. A PCB and a sound receiving member are mounted within the cavity region. A brace is disposed over the cavity region having opposite ribs located against two opposite sides of the PCB. A push button is operably mounted on the brace and is adapted to be moveably operated to actuate the PCB ON or OFF.

Abstract: The present invention discloses a strain relief collar for use with an accessory associated with a mobile device and its method of making. The first step is the making of an outer molded body. The second step is inserting a cord into the outer molded body. The third step is the forming of an inner molded body. The present invention also discloses another strain relief collar for use with another accessory associated with a mobile device and its method of making. The first step is connecting the cord to an electrical component associated with the accessory. The second step is the forming of an inner molded body. The third step is the forming of an outer molded body.

Abstract: Provided is an exposure apparatus including a variable focusing device. The variable focusing device may include a transparent membrane that may be deformed in the presence of an electric field. The deformation of the transparent membrane may allow the focus length of a radiation beam to be modified. In an embodiment, the variable focusing device may be modulated such that a radiation beam having a first focus length is provided for a first position on an exposure target and a radiation beam having a second focus length is provided for a second position on the exposure target. A method and computer-readable medium are also provided.

Abstract: A puzzle with combined interlocking members includes R interlocking members, of which R?7. The interlocking member is composed of two ends and a central portion as well as a first surface and a corresponding second surface. The first and second surfaces are provided with 16 blocks for changing the recessed positions of the central portion. Six interlocking members from R interlocking members can be assembled into at least two configurations or solutions. In addition, this invention provides many other configurations with at least 14 predefined interlocking members of different constructions. So, it presents many flexible configurations with excellent amusement and strong challenge.