Abstract: A special path generating device includes a base, a first axis slide assembly, a second axis slide assembly, a working portion, a driving portion, a first cam and a second cam. This first axis slide assembly includes a first bar and a first slide. The second axis slide assembly includes a second bar and a second slide. This working portion is mounted on the second slide that has two contacting portions. The driving portion is mounted on the base. When the driving portion drives the driving shaft rotating, the first cam and the second cam rotate accordingly and makes the working portion generating a special path. It can generate a constant-speed circular movement. It is easy to control. In addition, its volume is small.

Abstract: A method and system is disclosed for inspecting defects on a wafer. After acquiring at least one digitized image of at least one portion of a wafer, at least one design database file corresponding to the portion of the wafer is converted into at least one inspection file. After setting one or more error detection thresholds, the digitized image and the inspection file are compared by an inspection tool for detecting defects with regard to the portion of the wafer based on the set error detection thresholds.

Abstract: A system and method are disclosed for monitoring a dimensional change of a pattern for an object having a transparent layer exposed through the pattern and a non-transparent pattern laminated therewith. According to the method, a first beam is projected to the pattern. A second beam resulted from the first beam passing through the transparent layer exposed by the pattern, or from the first beam reflected from the non-transparent layer of the pattern, is detected. A value of a predetermined property from the second beam detected is obtained. A variation of the value is monitored for identifying the dimensional change of the pattern.

Abstract: A method for detecting the cleanliness of a filter. The filter is disposed on an air inlet or an air outlet of a fan. The method includes the following steps. At first, outputting a rotation control voltage to the fan, and an airflow generated by the rotation of the fan flows through the filter. Then, detect an actual rotation rate of the fan, and calculate an actual dust value f1 according to the actual rotation rate and the rotation rate control voltage. Then, a dust upper limit value of the filter is defined. Finally, the cleanliness of the filter is determined according to the actual dust value and the dust upper limit value.

Abstract: In a package, a heat slug, encapsulated by molding compound, encases an integrated circuit device (IC). In an example embodiment, a semiconductor package structure comprises a substrate (200) having conductive traces (235) and pad landings (265). The conductive traces have pad landings (265). An IC (230) is mounted on the substrate (200). The IC (230) has bonding pads (245). With conductive wires (225), the IC bonding pads (245) are connected to the pad landings (265), which in turn, are connected to the conductive traces (235). A heat slug (220), having predetermined height, is disposed on the substrate surface (200). The heat slug includes a plurality of mounting feet (210) providing mechanical attachment to the substrate. A cavity (220a) in the heat slug accommodates the IC. A plurality of first-size openings (215) surrounds the IC. A second-size opening (255) constructed from one of the first size-openings, is larger than the first-size opening.

Abstract: A circuit protecting structure of an electronic device includes a circuit carrier and a shielding member. The circuit carrier includes a first surface and a second surface. The second surface includes a specific region thereon. The shielding member includes a shielding frame and a shielding plate. The shielding frame is arranged on the second surface of the circuit carrier and encloses the specific region. The shielding plate is fixed onto the shielding frame. The shielding frame and the shielding plate cooperatively define a closed space for accommodating and shielding the specific region of the circuit carrier.

Abstract: A substrate splitting apparatus and a method for splitting a substrate using the substrate splitting apparatus are provided. The substrate splitting apparatus includes a servo motor, a transmission device, a substrate breaking bar, and a stage. One end of the transmission is directly or indirectly coupled to the servo motor while the other end is coupled with the breaking bar. The stage has a load-lock surface and the load-lock surface faces the breaking bar. The servo motor drives the transmission device to move the breaking bar toward the load-lock surface. A substrate with a pre-crack on the bottom is disposed on the load-lock surface. The servo motor drives the substrate breaking bar to move towards or away from the pre-crack. The method of splitting includes the following steps: forming a pre-crack on the substrate; controlling the servo motor to drive the breaking bar to move towards the substrate; and controlling the breaking bar to press the substrate at the pre-crack.

Abstract: Methods and systems for lithographically exposing a substrate based on a curvature profile of the substrate.

Abstract: A pellicle-mask assembly includes a mask substrate having an absorber pattern, and a hard pellicle held against movement with respect to the mask substrate by gas pressure.

Abstract: A method for photolithography processing includes forming a photoresist layer on a surface of a substrate, baking the substrate to remove solvents from the photoresist layer, cleaning an edge of the substrate with a tape, and exposing the photoresist layer with radiation energy. The tape includes a cleaning material. The tape is positioned proximate to or in contact with the edge of the substrate while the substrate is rotating.

Abstract: A power supply apparatus includes a main body, a power input device, a first power output device and a second power output device. The first power output device includes a first cable and a first connector. The first cable is connected to a first surface of the first connector and includes at least a stop block and at least a fastening element. The second power output device includes a second cable and a second connector. The second cable is connected to a first surface of the second connector and includes an extension part and a retaining wall. An edge of the retaining wall is confined by the stop block and the extension part is clamped by the fastening element so as to selectively combine the first connector with the second connector as a composite connector assembly and facilitate securely fixing the composite connector assembly in a common power socket.

Abstract: A method and system is disclosed for examining mask pattern fidelity. A mask picture is generated from a first mask with a first OPC model applied to a mask design. The mask picture is converted into a mask based simulation file. A first simulation is conducted under a first set of predetermined lithography processing conditions using the converted simulation file to generate one or more files of a first set representing wafer photo resist profile thereof. The first OPC model is applied to the mask design in the database mask file. A second simulation is conducted under the first set of predetermined lithography processing conditions using the OPCed mask design to generate one or more files of a second set representing wafer photo resist profile thereof. The first and second sets of files are evaluated for inspecting mask fidelity.

Abstract: A circuit protecting structure of an electronic device includes a circuit carrier and a shielding member. The circuit carrier includes a first surface and a second surface. The second surface includes a specific region thereon. The shielding member includes a shielding frame and a shielding plate. The shielding frame is arranged on the second surface of the circuit carrier and encloses the specific region. The shielding plate is fixed onto the shielding frame.

Abstract: Zirconium-rich bulk metallic glass alloys include quinary alloys containing zirconium, aluminum, titanium, copper and nickel. The bulk metallic glass alloys may be provided as completely amorphous pieces having cross-sectional diameters of at least about 5 mm or even greater.

Abstract: A mask and method for forming the same including carrying out a photolithographic patterning process the method including providing a substantially light transparent portion; forming a substantially light shielding layer disposed over the substantially light transparent portion; forming at least one barrier layer disposed over the substantially light shielding layer; forming a resist layer disposed over the at least one barrier layer; patterning the resist layer for producing a circuitry pattern; and, carrying out an etching process according to the circuitry pattern to expose a portion of the substantially light transparent portion to form a mask.

Abstract: A straight down back light module including a diffuser plate, a lamp, a reflector plate (back plate) and a support. The reflector plate is located below the diffuser plate. The lamp is located between the diffuser plate and the reflector plate. The support is installed between the diffuser plate and the reflector plate. The support includes a lamp cover for supporting the lamp. The lamp is directly covered by the lamp cover for preventing the lamp from deformation that could occur because of temperature difference. When used in a large-sized liquid crystal display, at least one pin can be provided on the support in order to support the diffuser plate and the lamp so as to prevent them from deformation that could occur because of temperature difference.

Abstract: An assembled structure includes a power semiconductor device, a first insulating member, a heat sink and a fastening element. The power semiconductor device has a first perforation. The first insulating member includes a first opening and a second opening corresponding to the first perforation and a receiving portion between the first opening and a second opening. The fastening element includes a head portion and a body portion. The body portion is penetrated through the first opening, the receiving portion, the second opening and the first perforation such that the power semiconductor device is fastened onto the heat sink.

Abstract: A dielectric barrier discharge uses three electrodes at an atmospheric pressure. A wide discharge gap can be used and an enhanced plasma density can be achieved so that thick materials can be processed and its processing speed can also be greatly improved.

Abstract: An electrical connector includes a plurality of pins, an isolation body and a latching mechanism. The isolation body has a specified side including a first portion, a second portion and an indentation. The second portion is higher than the first portion. The indentation is formed in the first portion and the second portion. The latching mechanism has an end fixed onto the second portion and extended above a bottom surface of the indentation, wherein the latching mechanism includes at least a fastening part.

Abstract: The invention relates to an electronic component with Sn rich deposit layer on the part for electric connection, wherein the Sn rich deposit layer is a fine grained Sn rich deposit layer composed of grains with smaller size in the direction perpendicular to the deposit surface than in the direction parallel to the deposit surface. It also relates to a process for plating an electronic component, so as to form a Sn rich deposit layer on the part for electric connection, comprising the steps of: adjusting the composition of tin plating solution in which starter additive and brighter additive are included; moving the electronic component through the tin plating solution, so as to form a fine grained Sn rich deposit layer on the part for electric connection. As compared with the prior art, the invention can validly inhibit the whisker growth with low cost and reliable property.