Patents by Inventor Cheng Yi

Cheng Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230192209
    Abstract: A headlight horizontal lighting pattern adjustment system includes an inclination angle sensor connected to a vehicle to sense an inclination angle value of the vehicle. A processing unit receives the inclination angle value and processes the inclination angle value into a driving value. A driving module drives a lighting device. The driving module commands the driving device to driving and rotate the lighting device according the driving value. The headlight horizontal lighting pattern adjustment system is equipped to a motorbike or an electric motorbike. When the motorbike turns and tilt, the processing unit adjusts the light of the lighting device by the driving module and the driving device to eliminate dark corners in the dark zone and maintains the full scale of light pattern to enhance safety to all the road users.
    Type: Application
    Filed: March 21, 2022
    Publication date: June 22, 2023
    Inventor: CHENG-YI YU
  • Publication number: 20230181300
    Abstract: The present invention provides a smart tooth cleaning device comprises a hand piece having a bearing surface, a tooth cleaning piece, a driving module connected to the tooth cleaning piece for driving the tooth cleaning piece to move, a first camera module comprising a first optical lens and a first image capturing element, and a first light source module comprising a plurality of light-emitting elements. The tooth cleaning piece has a tooth cleaning body, a brush head, and a plurality of bristles. The first camera module is disposed on the bearing surface and is electrically connected to the control module. The first image capturing element receives light along an optical axis of the first optical lens. A first angle ?1 between the optical axis and a first direction, is in a range of 5°to 30°. The first light source module is disposed on the bearing surface.
    Type: Application
    Filed: May 11, 2022
    Publication date: June 15, 2023
    Inventors: Jeng-Ywan Jeng, Zheng-Ye She, Cheng-Yi Tsai, Azam Hamza, Ajeet Kumar
  • Patent number: 11676867
    Abstract: Methods of manufacturing a semiconductor structure are provided. One of the methods includes the following operations. A substrate is received, and the substrate includes a first conductive region and a second conductive region. A first laser anneal is performed on the first conductive region to repair lattice damage. An amorphization is performed on the first conductive region and the second conductive region to enhance silicide formation to a desired phase transformation in the subsequent operations. A pre-silicide layer is formed on the substrate. A thermal anneal is performed to the substrate to form a silicide layer from the pre-silicide layer. A second laser anneal is performed on the first conductive region and the second conductive region.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: June 13, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chun Hsiung Tsai, Cheng-Yi Peng, Ching-Hua Lee, Clement Hsingjen Wann, Yu-Ming Lin
  • Publication number: 20230176341
    Abstract: Wide angle lens for imaging objects disposed away from the optical axis towards the periphery of the field of view.
    Type: Application
    Filed: August 5, 2022
    Publication date: June 8, 2023
    Inventors: Maksim MAKEEV, Mark S. SCHNITTMAN, Xiaoyu MIAO, Ming-lin LEE, Cheng-Yi LAI, Chien-Hung CHOU
  • Patent number: 11670872
    Abstract: A movable device and a block-type millimeter wave array antenna module thereof are provided. The block-type millimeter wave array antenna module includes an antenna carrying substrate, an antenna signal transmitting group, an antenna signal receiving group, and a dummy antenna group. The antenna carrying substrate includes a plurality of block-shaped carrier bodies that are divided into a plurality of first, second, third, and fourth antenna carrier blocks. The antenna signal transmitting group includes a plurality of signal transmitting antenna structures respectively carried by the first antenna carrier blocks. The antenna signal receiving group includes a plurality of signal receiving antenna structures respectively carried by the second antenna carrier blocks. The dummy antenna group includes a plurality of first dummy antenna structures respectively carried by the third antenna carrier blocks, and a plurality of second dummy antenna structures respectively carried by the fourth antenna carrier blocks.
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: June 6, 2023
    Assignee: Taiwan Inpaq electronic Co., Ltd.
    Inventors: Ta-Fu Cheng, Ting-Wei Lin, Cheng-Yi Wang
  • Patent number: 11661131
    Abstract: A headlight horizontal lighting pattern adjustment system includes an inclination angle sensor connected to a vehicle to sense an inclination angle value of the vehicle. A processing unit receives the inclination angle value and processes the inclination angle value into a driving value. A driving module drives a lighting device. The driving module commands the driving device to driving and rotate the lighting device according the driving value. The headlight horizontal lighting pattern adjustment system is equipped to a motorbike or an electric motorbike. When the motorbike turns and tilt, the processing unit adjusts the light of the lighting device by the driving module and the driving device to eliminate dark corners in the dark zone and maintains the full scale of light pattern to enhance safety to all the road users.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: May 30, 2023
    Assignee: Ta Yih Industrial Co., Ltd.
    Inventor: Cheng-Yi Yu
  • Patent number: 11658032
    Abstract: A method includes providing a semiconductor structure having an active region and an isolation structure adjacent to the active region, the active region having source and drain regions sandwiching a channel region for a transistor, the semiconductor structure further having a gate structure over the channel region. The method further includes etching a trench in one of the source and drain regions, wherein the trench exposes a portion of a sidewall of the isolation structure, epitaxially growing a first semiconductor layer in the trench, epitaxially growing a second semiconductor layer over the first semiconductor layer, changing a crystalline facet orientation of a portion of a top surface of the second semiconductor layer by an etching process, and epitaxially growing a third semiconductor layer over the second semiconductor layer after the changing of the crystalline facet orientation.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: May 23, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wen-Chin Chen, Cheng-Yi Wu, Yu-Hung Cheng, Ren-Hua Guo, Hsiang Liu, Chin-Szu Lee
  • Patent number: 11658768
    Abstract: A multi-link device (MLD) includes a transmit (TX) circuit, a receive (RX) circuit, and a control circuit. The control circuit controls the RX circuit to receive a first frame under an operation mode parameter with a first setting, control the TX circuit to transmit a second frame responsive to the first frame under the operation mode parameter with the first setting, and after the second frame is transmitted, controls the RX circuit to receive at least one physical layer protocol data unit (PPDU) under the operation mode parameter with a second setting, wherein the second setting is different from the first setting.
    Type: Grant
    Filed: July 5, 2021
    Date of Patent: May 23, 2023
    Assignee: MEDIATEK INC.
    Inventors: Chien-Fang Hsu, Cheng-Yi Chang, Hung-Tao Hsieh, Yongho Seok
  • Publication number: 20230155784
    Abstract: Techniques pertaining to performance enhancement between non-access point (non-AP) multi-link devices (MLDs) by enhanced multi-link single radio (EMLSR) in wireless communications are described. A first non-AP MLD exchanges EMLSR capability information with a second non-AP MLD in a handshake procedure on one of a plurality of links. The first non-AP MLD then establishes an EMLSR operation with the second non-AP MLD on one or more links of the plurality of links. Each of the first non-AP MLD and the second non-AP MLD listens on at least one of the plurality of links.
    Type: Application
    Filed: November 12, 2022
    Publication date: May 18, 2023
    Inventor: Cheng-Yi Chang
  • Publication number: 20230151828
    Abstract: A telescopic actuator includes a first segment having a first hollow cavity, a second segment having a second hollow cavity, a third segment having a third hollow cavity, and a first port and a second port. The second segment is slidably connected to the first segment through the first hollow cavity, and the third segment is slidably connected to the second segment through the second hollow cavity, the second hollow cavity being insulated from the first hollow cavity and communicating with the third hollow cavity. The first port is configured to flow fluid into and out of the first hollow cavity, and the second port is configured to flow fluid into and out of the second hollow cavity and the third hollow cavity. Embodiments described herein also include a motion simulating apparatus and an actuating system incorporating the telescopic actuator.
    Type: Application
    Filed: October 22, 2022
    Publication date: May 18, 2023
    Inventor: Cheng-Yi LI
  • Publication number: 20230154998
    Abstract: In a method of manufacturing a negative capacitance structure, a dielectric layer is formed over a substrate. A first metallic layer is formed over the dielectric layer. After the first metallic layer is formed, an annealing operation is performed, followed by a cooling operation. A second metallic layer is formed. After the cooling operation, the dielectric layer becomes a ferroelectric dielectric layer including an orthorhombic crystal phase. The first metallic film includes a oriented crystalline layer.
    Type: Application
    Filed: January 23, 2023
    Publication date: May 18, 2023
    Inventors: Chun-Chieh LU, Carlos H. DIAZ, Chih-Sheng CHANG, Cheng-Yi PENG, Ling-Yen YEH
  • Patent number: 11652141
    Abstract: Transistor structures and methods of forming transistor structures are provided. The transistor structures include alternating layers of a first epitaxial material and a second epitaxial material. In some embodiments, one of the first epitaxial material and the second epitaxial material may be removed for one of an n-type or p-type transistor. A bottommost layer of the first epitaxial material and the second epitaxial material may be be removed, and sidewalls of one of the first epitaxial material and the second epitaxial material may be indented or recessed.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: May 16, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Yi Peng, Hung-Li Chiang, Yu-Lin Yang, Chih Chieh Yeh, Yee-Chia Yeo, Chi-Wen Liu
  • Publication number: 20230135230
    Abstract: An electronic device is provided that determines initial three-dimensional (3D) coordinates of a lighting device. The electronic device controls an emission of light from the lighting device based on control signals. The emitted light includes at least one of a pattern of alternating light pulses or a continuous light pulse. The electronic device controls a plurality of imaging devices to capture a first plurality of images that include information about the emitted light. Based on the determined initial 3D coordinates and the information about the emitted light included in the first plurality of images, the electronic device estimates a plurality of rotation values and a plurality of translation values of each imaging device. Based on the plurality of rotation values and the plurality of translation values, the electronic device applies a simultaneous localization and mapping process for each imaging device, for spatial synchronization of the plurality of imaging devices.
    Type: Application
    Filed: November 1, 2021
    Publication date: May 4, 2023
    Inventors: BRENT FAUST, CHENG-YI LIU
  • Publication number: 20230117111
    Abstract: Techniques pertaining to coverage enhancement for 6 GHz wireless communications are described. A first station (STA) communicates with a second STA in a 6 GHz wireless band and/or low-power indoor (LPI) channels. The first STA performs a receiving signal combination and detection across multiple bandwidths such that a power level or a signal strength is enhanced in communicating with the second STA.
    Type: Application
    Filed: October 12, 2022
    Publication date: April 20, 2023
    Inventors: Cheng-Yi Chang, Ching-Wen Hsiao, Shu-Ping Shiu
  • Publication number: 20230120024
    Abstract: The present invention provides a wireless communication method performed by an AP, wherein the AP is an NSTR AP MLD, and the wireless communication method includes the steps of: establishing a primary link and an non-primary link with a first MLD; during a first period, transmitting data to the first MLD or receiving data from the first MLD via the primary link and the non-primary link; and during a second period following the first period, in response to a channel used by the non-primary link being busy, performing a dynamic radio chain switching mechanism to adjust an antenna configuration of the primary link, and using the primary link to communicate with the first MLD.
    Type: Application
    Filed: October 11, 2022
    Publication date: April 20, 2023
    Applicant: MEDIATEK INC.
    Inventors: Cheng-Yi Chang, Meng-Hsiang Lai, Xingbo Zhao
  • Publication number: 20230117078
    Abstract: Techniques pertaining to low-power enhanced multi-link single radio (EMLSR) listen in wireless communications are described. A first multi-link device (MLD) reduces power consumption while supporting a latency-sensitive application by performing certain operations. The first MLD first listens at a lower power in a narrower bandwidth to receive an initial physical-layer protocol data unit (PPDU) from a second MLD as part of a frame exchange. In response to receiving the initial PPDU, the first MLD switches from the narrower bandwidth to a wider bandwidth to complete the frame exchange with the second MLD in the wider bandwidth. In reducing the power consumption, the first MLD reduces its power consumption to the lower power when operating in the narrower bandwidth compared to a higher power used by the first MLD when operating in the wider bandwidth.
    Type: Application
    Filed: October 6, 2022
    Publication date: April 20, 2023
    Inventors: Cheng-Yi Chang, Yi-Chun Chou, Ching-Wen Hsiao, Chien-Wei Chen
  • Publication number: 20230123499
    Abstract: A control method employed by a wireless fidelity (Wi-Fi) multi-link device (MLD) includes: in response to gaining access of a first link at a first time point through channel contention, enabling a multi-link coherent operation mode on the first link for performing frame exchange process on the first link by using N spatial streams, wherein N is a positive integer not smaller than 2; and in response to gaining access of a second link at a second time point through channel contention, blocking the multi-link coherent operation mode from being enabled on the second link, wherein performance of the second link is lower than performance of the first link.
    Type: Application
    Filed: October 12, 2022
    Publication date: April 20, 2023
    Applicant: MEDIATEK INC.
    Inventor: Cheng-Yi Chang
  • Patent number: 11631755
    Abstract: In a method of manufacturing a negative capacitance structure, a dielectric layer is formed over a substrate. A first metallic layer is formed over the dielectric layer. After the first metallic layer is formed, an annealing operation is performed, followed by a cooling operation. A second metallic layer is formed. After the cooling operation, the dielectric layer becomes a ferroelectric dielectric layer including an orthorhombic crystal phase.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: April 18, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Chieh Lu, Cheng-Yi Peng, Chien-Hsing Lee, Ling-Yen Yeh, Chih-Sheng Chang, Carlos H. Diaz
  • Patent number: 11630601
    Abstract: A method and apparatus for performing access control of a memory device with aid of a multi-phase memory-mapped queue are provided. The method includes: receiving a first host command from a host device; and in response to the first host command, utilizing a processing circuit within the controller to send a first operation command to the NV memory through a control logic circuit of the controller, and trigger a first set of secondary processing circuits within the controller to operate and interact via the multi-phase memory-mapped queue, for accessing the first data for the host device, wherein the processing circuit and the first set of secondary processing circuits share the multi-phase memory-mapped queue, and use the multi-phase memory-mapped queue as multiple chained message queues associated with multiple phases, respectively, for performing message queuing for a chained processing architecture including the processing circuit and the first set of secondary processing circuits.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: April 18, 2023
    Assignee: Silicon Motion, Inc.
    Inventors: Cheng Yi, Kaihong Wang, Sheng-I Hsu, I-Ling Tseng
  • Publication number: 20230116495
    Abstract: A dual-band patch array antenna module and an electronic device using the same are provided. The dual-band patch array antenna module includes an insulative carrier substrate, a common conductive metal layer, a common grounding metal layer, an outer surrounding shielding structure, a plurality of first band antenna structures, and a plurality of second band antenna structures. The common conductive metal layer is disposed inside the insulative carrier substrate. The common grounding metal layer is disposed on the insulative carrier substrate. The outer surrounding shielding structure is electrically connected between the common conductive metal layer and the common grounding metal layer. Each first band antenna structure includes a first radiator, two first metal elements, two first feeding elements, and two first inner surrounding shielding assemblies.
    Type: Application
    Filed: January 4, 2022
    Publication date: April 13, 2023
    Inventors: Ta-Fu Cheng, Cheng-Yi Wang, Ting-Wei Lin