Abstract: In an embodiment, a magnetic assembly includes: an inner permeance annulus; and an outer permeance annulus connected to the inner permeance annulus via magnets, wherein the outer permeance annulus comprises a peak region with a thickness greater than other regions of the outer permeance annulus.

Abstract: A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.

Abstract: The disclosed techniques include a space filling device to be used with a wet bench in chemical replacement procedures. The space filling device has an overall density that is higher than the chemicals used to purge the wet bench. As such, when embedded into the wet bench, or more specifically, the chemical tank of the wet bench, the space filling device will occupy a portion of the interior volume space. As a result, less purging chemicals are used to fill and bath the wet bench.

Abstract: The structure of a semiconductor device with core-shell nanostructured channel regions between source/drain regions of FET devices and a method of fabricating the semiconductor device are disclosed. A semiconductor device includes a substrate, a stack of nanostructured layers with first and second nanostructured regions disposed on the substrate, and nanostructured shell regions wrapped around the second nanostructured regions. The nanostructured shell regions and the second nanostructured regions have semiconductor materials different from each other. The semiconductor device further includes first and second source/drain (S/D) regions disposed on the substrate and a gate-all-around (GAA) structure disposed between the first and second S/D regions. Each of the first and second S/D regions includes an epitaxial region wrapped around each of the first nanostructured regions and the GAA structure is wrapped around each of the nanostructured shell regions.

Abstract: A backlight module includes a circuit board, a light-emitting element, and a light guide plate. The light-emitting element is disposed on the circuit board. The light guide plate is located above the circuit board and has adjacent first and second single-key light guide regions. The first single-key light guide region has an accommodating groove accommodating the light-emitting element. The light-emitting surface of the he light-emitting element faces the second single-key light guiding region. The first single-key light guide region has light guide structures extending along the normal direction of the light-emitting surface. The light guide structures include a first group, a second group, and a third group arranged in sequence. The light-emitting surface is opposite to the second group in the normal direction. A spacing of the second group is larger than a spacing of the first group and a spacing of the third group.

Abstract: A planar insulating spacer layer is formed over a substrate, and a vertical stack of a gate electrode, a gate dielectric layer, and a first semiconducting metal oxide layer may be formed thereabove. The first semiconducting metal oxide layer includes atoms of a first n-type dopant at a first average dopant concentration. A second semiconducting metal oxide layer is formed over the first semiconducting metal oxide layer. Portions of the second semiconducting metal oxide layer are doped with the second n-type dopant to provide a source-side n-doped region and a drain-side n-doped region that include atoms of the second n-type dopant at a second average dopant concentration that is greater than the first average dopant concentration. Various dopants may be introduced to enhance performance of the thin film transistor.

Abstract: An optical imaging lens assembly, which is applied for an endoscopic optical device, from an object side to an image side aligned in order includes a first lens element, a second lens element and a third lens element. The first lens element has negative refracting power, and further has a first convex object-side surface and a first image-side surface. The second lens element has positive refracting power, and further has a second convex object-side surface and a second concave image-side surface. The third lens element has positive refracting power, and further has a third convex image-side surface and a third object-side surface.

Abstract: The structure of a semiconductor device with inner spacer structures between source/drain (S/D) regions and gate-all-around structures and a method of fabricating the semiconductor device are disclosed. The semiconductor device includes a substrate, a stack of nanostructured layers with first and second nanostructured regions disposed on the substrate and first and second source/drain (S/D) regions disposed on the substrate. Each of the first and second S/D regions includes an epitaxial region wrapped around each of the first nanostructured regions.

Abstract: A method of testing a non-volatile memory (NVM) array includes heating the NVM array to a target temperature, and while the NVM array is heated to the target temperature, programming a subset of the NVM cells to first resistance levels and obtaining a first current distribution, programming the subset of NVM cells to second resistance levels and obtaining a second current distribution, calculating a current threshold level from the first and second current distributions, and for each of the NVM cells, programing the NVM cell to one of the first or second resistance levels, and using the current threshold level to determine a first pass/fail (P/F) status and a second P/F status at the programmed resistance level. A bit error rate (BER) of the NVM array is calculated based on the first and second current distributions and the first and second P/F status of each of the NVM cells.

Abstract: The structure of a semiconductor device with core-shell nanostructured channel regions between source/drain regions of FET devices and a method of fabricating the semiconductor device are disclosed. A semiconductor device includes a substrate, a stack of nanostructured layers with first and second nanostructured regions disposed on the substrate, and nanostructured shell regions wrapped around the second nanostructured regions. The nanostructured shell regions and the second nanostructured regions have semiconductor materials different from each other. The semiconductor device further includes first and second source/drain (S/D) regions disposed on the substrate and a gate-all-around (GAA) structure disposed between the first and second S/D regions, Each of the first and second S/D regions includes an epitaxial region wrapped around each of the first nanostructured regions and the GAA structure is wrapped around each of the nanostructured shell regions.

Abstract: A non-access point (non-AP) station (STA) multi-link device (MLD) receives a transmission from an access point (AP) MLD. In response to receiving the transmission, the non-AP STA MLD communicates with the AP MLD using an increased number of spatial streams with multi-link dynamic antenna switching at the non-AP STA MLD.

Abstract: A hybrid power conversion circuit includes a high-side switch, a low-side switch, a transformer, a resonance tank, a first switch, a second switch, a first synchronous rectification switch, a second synchronous rectification switch, and a third switch. The resonance tank has an external inductor, an external capacitance, and an internal inductor. The first switch is connected to the external inductor. The second switch and a first capacitance form a series-connected path, and is connected to the external capacitance. The first and second synchronous rectification switches are respectively coupled to a first winding and a second winding. The third switch is connected to the second synchronous rectification switch. When an output voltage is less than a voltage interval, the hybrid power conversion circuit operates in a hybrid flyback conversion mode, and otherwise the hybrid power conversion circuit operates in a resonance conversion mode.

Abstract: A semiconductor structure includes a substrate, a semiconductor fin extending from the substrate, and a silicon germanium (SiGe) epitaxial feature disposed over the semiconductor fin. A gallium-implanted layer is disposed over a top surface of the SiGe epitaxial feature, and a silicide feature is disposed over and in contact with the gallium-implanted layer.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes a fin active region formed on a semiconductor substrate and spanning between a first sidewall of a first shallow trench isolation (STI) feature and a second sidewall of a second STI feature; an anti-punch through (APT) feature of a first type conductivity; and a channel material layer of the first type conductivity, disposed on the APT feature and having a second doping concentration less than the first doping concentration. The APT feature is formed on the fin active region, spans between the first sidewall and the second sidewall, and has a first doping concentration.

Abstract: A method for performing data access performance shaping of a memory device and associated apparatus are provided. The method may include: receiving a plurality of host commands from a host device, for performing data access on the NV memory according to the plurality of host commands; and monitoring the plurality of host commands to control respective performance metrics of a plurality of access control groups of the memory device with a dual-state leaky bucket (LB) model, wherein regarding any access control group, for example: determining at least one first performance metric according to at least one first command to be a first LB fill level of a dual-state LB; in response to the first LB fill level being below a state threshold, determining the dual-state LB to be in a first predetermined state, and configuring the dual-state LB to have a first predetermined drain rate, for dynamically adjusting performance quota.

Abstract: A dual-band antenna module includes a first antenna structure and a second antenna structure. The first antenna structure includes a first insulating substrate, a conductive metal layer, a plurality of grounding supports, and a first feeding pin. The second antenna structure includes a second insulating substrate, a top metal layer, a bottom metal layer, and a second feeding pin. The conductive metal layer is disposed on the first insulating substrate. The grounding supports are configured for supporting the first insulating substrate. The second insulating substrate is disposed above the first insulating substrate. The top metal layer and the bottom metal layer are respectively disposed on a top side and a bottom side of the second insulating substrate. The first frequency band signal transmitted or received by the first antenna structure is smaller than the second frequency band signal transmitted or received by the second antenna structure.

Abstract: The present invention relates to crystalline forms of a KRas G12C inhibitor and salt thereof. In particular, the present invention relates to crystalline forms of the KRas GT2C inhibitor 2-[(2S)-4-[7-(8-chloro-1-naphthyI)-2-[[(2S)-1-methylpyrrolidin-2-yl]methoxy]-6,8-dihydro-5H-pyrido[3,4-d]pyrimidin-4-yI]-1-(2-fluoroprop-2-enoyi)piperazin-2-yl]acetonitrile, pharmaceutical compositions comprising the crystalline forms, processes for preparing the crystalline forms and methods of use thereof.

Abstract: Examples of the disclosure include a bootloader system including a volatile memory, a first non-volatile memory configured to store a first bootloader, a second non-volatile memory configured to store a second bootloader, and a microprocessor configured to control, responsive to executing the first bootloader, the volatile memory to receive an updated second bootloader and provide the updated second bootloader to the second non-volatile memory, and control the second non-volatile memory to update the second bootloader with the updated second bootloader.

Abstract: Transistor structures and methods of forming transistor structures are provided. The transistor structures include alternating layers of a first epitaxial material and a second epitaxial material. In some embodiments, one of the first epitaxial material and the second epitaxial material may be removed for one of an n-type or p-type transistor. A bottommost layer of the first epitaxial material and the second epitaxial material maybe be removed, and sidewalls of one of the first epitaxial material and the second epitaxial material may be indented or recessed.

Abstract: An apparatus is described that includes an image sensor and a light source driver circuit integrated in a same semiconductor chip package. The image sensor includes visible light pixels and depth pixels. The depth pixels are to sense light generated with a light source drive signal. The light source drive signal is generated with the light source driver circuit.