Patents by Inventor Chien Liu

Chien Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170177117
    Abstract: A detecting method for a conductive matter on a capacitive sensor device includes obtaining a positive signal, computing a signal summation of a plurality of sensing points in at least an electrode line where the positive signal is occurred, comparing the signal summation to a predetermined value, determining a touch object inducing the positive signal is not an irregular conductive matter if the signal summation is larger than the predetermined value, and determining the touch object inducing the positive signal is the irregular conductive matter if the signal summation is not larger than the predetermined value.
    Type: Application
    Filed: December 14, 2016
    Publication date: June 22, 2017
    Inventors: ZONG-BIN LIAO, MENG-CHIEN LIU
  • Patent number: 9673053
    Abstract: A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate; forming a first material layer on the substrate; forming a stop layer on the first material layer; forming a second material layer on the stop layer; and performing a planarizing process to remove the second material layer, the stop layer, and part of the first material layer for forming a gate layer.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: June 6, 2017
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Rung-Yuan Lee, Yu-Ting Li, Jing-Yin Jhang, Chen-Yi Weng, Jia-Feng Fang, Yi-Wei Chen, Wei-Jen Wu, Po-Cheng Huang, Fu-Shou Tsai, Kun-Ju Li, Wen-Chin Lin, Chih-Chien Liu, Chih-Hsun Lin, Chun-Yuan Wu
  • Publication number: 20170135142
    Abstract: Systems, methods, architectures, and computer program products for linking multiple devices are disclosed. In an example for linking a mobile device with a desktop device, an identifier of a mobile device can be received from a desktop computer. The identifier can be used to send a link to the mobile device. When the link is accessed, a code and a channel are generated. The mobile device is connected to the channel and the code is provided to the mobile device. The code is entered at the desktop device and the desktop device is connected to the channel responsive to the code being validated, thereby linking the desktop and mobile devices.
    Type: Application
    Filed: November 2, 2016
    Publication date: May 11, 2017
    Inventors: Rush L. Bartlett, II, Kan-Yueh Chen, Ching-Cheng Chou, David Lin, Po-Min Lin, I-Chien Liu, Matthew S. Taylor, Ryan J.F. Wert, Frank Wang, Jack Yeh
  • Patent number: 9648237
    Abstract: A portable device and a manipulation method are disclosed. The portable device includes a camera unit, a first sensor and a control module. The camera unit has a plurality of functional modes. The functional modes include a photo-capturing mode and a video-recording mode. The first sensor is disposed on the portable device and configured for sensing a manipulation input. The manipulation input has a manipulation pattern and duration information of the manipulation pattern. The control module is coupled with the camera unit and the first sensor. The control module is configured for selecting one of the functional modes corresponding to the manipulation pattern and the duration information sensed by the first sensor, and triggering the camera unit into the selected functional mode.
    Type: Grant
    Filed: May 25, 2015
    Date of Patent: May 9, 2017
    Assignee: HTC Corporation
    Inventors: Yuan-Kang Wang, Wen-Chuan Lee, Wen-Chien Liu, Ko-Hsin Hsiang
  • Patent number: 9629195
    Abstract: The disclosure is directed to a remote access method and related devices using the same. In one of the exemplary embodiments, the method would include not limited to initiating a first connection between a first wireless interface of a first mobile device and a first wireless interface of a third mobile device; activating a first wireless access point by using a second wireless interface of a second mobile device; detecting the first wireless access point by using a second wireless interface of the third mobile device; disconnecting the first connection by the third mobile device in response to the first wireless access point being detected; and initiating a second connection between a first wireless interface of the second mobile device and a first wireless interface of the third mobile device.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: April 18, 2017
    Assignee: HTC Corporation
    Inventors: Yuan-Kang Wang, Wen-Chuan Lee, Ko-Hsin Hsiang, Wen-Chien Liu
  • Publication number: 20170095917
    Abstract: A nail gun having a protection structure includes a body, a protection cover and a resilient release. The body includes a nail magazine loaded with nails and includes a barrel connected to the nail magazine. One end of the barrel has a nozzle, and the nail magazine forms a notch close to the nozzle and includes a fastening recess. The protection cover is slidably disposed on the nail magazine. The protection cover includes an engagement board, a sliding board connected to the same, and an engagement hole formed on the engagement board. The resilient release is resiliently assembled in the fastening recess and contacts and presses against an inner edge of the engagement hole, so that the protection cover is positioned by the resilient release, and the sliding board covers the notch.
    Type: Application
    Filed: September 23, 2016
    Publication date: April 6, 2017
    Inventors: Chun-Chi LAI, Chien-An LIU
  • Publication number: 20170098710
    Abstract: The present invention provides a non-planar FET and a method of manufacturing the same. The non-planar FET includes a substrate, a fin structure, a gate and a gate dielectric layer. The fin structure is disposed on the substrate. The fin structure includes a first portion adjacent to the substrate wherein the first portion shrinks towards a side of the substrate. The gate is disposed on the fin structure. The gate dielectric layer is disposed between the fin structure and the gate. The present invention further provides a method of manufacturing the non-planar FET.
    Type: Application
    Filed: December 15, 2016
    Publication date: April 6, 2017
    Inventors: Chin-Cheng Chien, Chun-Yuan Wu, Chih-Chien Liu, Chin-Fu Lin, Chia-Lin Hsu
  • Patent number: 9595836
    Abstract: A power transfer circuit for achieving power transfer between stacked rechargeable battery cells is disclosed. The power transfer circuit includes an inductor, a first switch, a second switch and a controller. A loop of the rechargeable battery cell having higher power and the inductor is conducted so that the inductor stores power until the current flowing through the inductor meets the cutoff amount. Then, a loop of the rechargeable battery cell having lower power and the inductor is conducted so that the inductor releases the power saved in the inductor to the rechargeable battery cell having lower power until current flowing through the inductor changes direction. Therefore, balance between the rechargeable battery cells can be achieved.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: March 14, 2017
    Assignee: Hycon Technology Corp.
    Inventors: Chuan Sheng Wang, Po Yin Chao, Jui Chien Liu
  • Patent number: 9559189
    Abstract: The present invention provides a non-planar FET which includes a substrate, a fin structure, a gate and a gate dielectric layer. The fin structure is disposed on the substrate. The fin structure includes a first portion adjacent to the substrate wherein the first portion shrinks towards a side of the substrate. The gate is disposed on the fin structure. The gate dielectric layer is disposed between the fin structure and the gate. The present invention further provides a method of manufacturing the non-planar FET.
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: January 31, 2017
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chin-Cheng Chien, Chun-Yuan Wu, Chih-Chien Liu, Chin-Fu Lin, Chia-Lin Hsu
  • Publication number: 20160367493
    Abstract: The present disclosure relates to the use of an agent that enhances transdermal delivery of a PDE-5 inhibitor. More particularly, the present disclosure provides improved method and composition that promotes transdermal delivery of a PDE-5 inhibitor for the treatment of the PDE-5 mediated conditions and/or diseases.
    Type: Application
    Filed: June 16, 2016
    Publication date: December 22, 2016
    Inventors: Yee-Chien LIU, Pei-Ling WU
  • Patent number: 9491336
    Abstract: A camera device. A housing includes a first portion, a second portion and a curved portion disposed between the first portion and the second portion and including a curved surface. The lens is disposed on an end surface of the housing. The image sensor is coupled to the lens for obtaining image data captured by the lens. The first input unit is disposed on the curved surface and provided as a first input interface for a user. The grip sensor is disposed on the first portion for sensing whether the first portion is held by the user. The lens and the image sensor operate in a sleep mode by default to reduce power consumption. When the grip sensor senses that the first portion is held by the user, the grip sensor generates a sensing signal to wake up the lens and the image sensor.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: November 8, 2016
    Assignee: HTC Corporation
    Inventors: Ko-Hsin Hsiang, Kenneth Todd Culos, Wen-Chien Liu, Wen-Chuan Lee
  • Patent number: 9461150
    Abstract: A method for fabricating semiconductor device with fin-shaped structure is disclosed. The method includes the steps of: forming a fin-shaped structure on a substrate; forming a first dielectric layer on the substrate and the fin-shaped structure; depositing a second dielectric layer on the first dielectric layer; etching back a portion of the second dielectric layer; removing part of the first dielectric layer to expose a top surface and part of the sidewall of the fin-shaped structure; forming an epitaxial layer to cover the exposed top surface and part of the sidewall of the fin-shaped structure; and removing a portion of the second dielectric layer.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: October 4, 2016
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chin-Cheng Chien, Hsin-Kuo Hsu, Chih-Chien Liu, Chin-Fu Lin, Chun-Yuan Wu
  • Patent number: 9427471
    Abstract: The present disclosure relates to the use of an agent that enhances transdermal delivery of a PDE-5 inhibitor. More particularly, the present disclosure provides improved method and composition that promotes transdermal delivery of a PDE-5 inhibitor for the treatment of the PDE-5 mediated conditions and/or diseases.
    Type: Grant
    Filed: December 26, 2011
    Date of Patent: August 30, 2016
    Assignee: Tritech Biopharmaceuticals Co., Ltd.
    Inventors: Yee-Chien Liu, Pei-Ling Wu
  • Publication number: 20160226873
    Abstract: A non-transitory computer readable storage medium for storing an application program for network certification is disclosed. The application program is implemented by an electrical device for executing a wireless network certification process. The wireless network certification process includes the following steps: driving a network module of the electrical device to receive a certification code broadcasted by a wireless network access point (AP), determining if the certification code is in an identified list, executing an action to limit communication between the electrical device and the network AP when the certification code is not in the identified list, and receiving a password for removing the limitation of the communication.
    Type: Application
    Filed: April 13, 2016
    Publication date: August 4, 2016
    Inventors: Chih-Chien LIU, Yi-Chang CHEN, Chih-Hsing KANG
  • Patent number: 9401429
    Abstract: A semiconductor structure includes a fin-shaped structure and a gate. The fin-shaped structure is located in a substrate, wherein the fin-shaped structure has a through hole located right below a suspended part. The gate surrounds the suspended part. Moreover, the present invention also provides a semiconductor process including the following steps for forming said semiconductor structure. A substrate is provided. A fin-shaped structure is formed in the substrate, wherein the fin-shaped structure has a bottom part and a top part. A part of the bottom part is removed to form a suspended part in the corresponding top part, thereby forming the suspended part over a through hole. A gate is formed to surround the suspended part.
    Type: Grant
    Filed: June 13, 2013
    Date of Patent: July 26, 2016
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chin-Cheng Chien, Chun-Yuan Wu, Chin-Fu Lin, Chih-Chien Liu, Chia-Lin Hsu
  • Publication number: 20160211144
    Abstract: An epitaxial process applying light illumination includes the following steps. A substrate is provided. A dry etching process and a wet etching process are performed to form a recess in the substrate, wherein an infrared light illuminates while the wet etching process is performed. An epitaxial structure is formed in the recess.
    Type: Application
    Filed: February 25, 2015
    Publication date: July 21, 2016
    Inventors: Yu-Ying Lin, Ted Ming-Lang Guo, Chin-Cheng Chien, Chih-Chien Liu, Hsin-Kuo Hsu, Chin-Fu Lin, Chun-Yuan Wu
  • Patent number: 9384996
    Abstract: A method for manufacturing a semiconductor device and a device manufactured by the same are provided. According to the embodiment, a substrate having at least a first area with a plurality of first gates and a second area with a plurality of second gates is provided, wherein the adjacent first gates and the adjacent second gates separated by an insulation, and a top surface of the insulation has a plurality of recesses. Then, a capping layer is formed over the first gate, the second gates and the insulation, and filling the recesses. The capping layer is removed until reaching the top surface of the insulation, thereby forming the insulating depositions filling up the recesses, wherein the upper surfaces of the insulating depositions are substantially aligned with the top surface of the insulation.
    Type: Grant
    Filed: May 8, 2014
    Date of Patent: July 5, 2016
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Po-Cheng Huang, Yu-Ting Li, Jen-Chieh Lin, Kun-Ju Li, Chang-Hung Kung, Yue-Han Wu, Chih-Chien Liu
  • Publication number: 20160164314
    Abstract: A power transfer circuit for achieving power transfer between stacked rechargeable battery cells is disclosed. The power transfer circuit includes an inductor, a first switch, a second switch and a controller. A loop of the rechargeable battery cell having higher power and the inductor is conducted so that the inductor stores power until the current flowing through the inductor meets the cutoff amount. Then, a loop of the rechargeable battery cell having lower power and the inductor is conducted so that the inductor releases the power saved in the inductor to the rechargeable battery cell having lower power until current flowing through the inductor changes direction. Therefore, balance between the rechargeable battery cells can be achieved.
    Type: Application
    Filed: February 16, 2016
    Publication date: June 9, 2016
    Applicant: HYCON TECHNOLOGY CORP.
    Inventors: Chuan Sheng WANG, Po Yin CHAO, Jui Chien LIU
  • Patent number: 9362358
    Abstract: A method of fabricating a spatial semiconductor structure includes steps as follows. Firstly, a semiconductor substrate is provided. Then, a first mask layer is formed above the semiconductor substrate. Then, at least a first opening is formed in the first mask layer and exposes a portion of a surface of the semiconductor substrate. Then, a first semiconductor pattern is formed in the first opening. Then, a second mask layer is formed over the first semiconductor pattern and the first mask layer. Then, at least a second opening is formed through the second mask layer to the first mask layer and exposes another portion of the surface of the semiconductor substrate. And, a second semiconductor pattern is formed in the second opening.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: June 7, 2016
    Assignee: UNITED MICROELECTRONICS CORPORATION
    Inventors: Hung-Lin Shih, Chih-Chien Liu, Jei-Ming Chen, Wen-Yi Teng, Chieh-Wen Lo
  • Publication number: 20160148816
    Abstract: A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate; forming a first material layer on the substrate; forming a stop layer on the first material layer; forming a second material layer on the stop layer; and performing a planarizing process to remove the second material layer, the stop layer, and part of the first material layer for forming a gate layer.
    Type: Application
    Filed: November 20, 2014
    Publication date: May 26, 2016
    Inventors: Rung-Yuan Lee, Yu-Ting Li, Jing-Yin Jhang, Chen-Yi Weng, Jia-Feng Fang, Yi-Wei Chen, Wei-Jen Wu, Po-Cheng Huang, Fu-Shou Tsai, Kun-Ju Li, Wen-Chin Lin, Chih-Chien Liu, Chih-Hsun Lin, Chun-Yuan Wu