Abstract: Dark current from a transfer transistor is suppressed and power-supply voltage in a second semiconductor substrate is lowered. A solid-state image pickup device includes a pixel array, a plurality of common output lines receiving signals read out from a plurality of pixels, a transfer scanning unit sequentially driving the plurality of transfer transistors, a signal processing unit processing the signals output to the common signal lines, and a level shift unit making amplitude of a pulse supplied to a gate of the transfer transistor larger than amplitude of a pulse supplied to a gate of a transistor constituting the signal processing unit. The pixel array and the level shift unit are arranged on a first semiconductor substrate, whereas the plurality of common output lines and the signal processing unit are arranged on a second semiconductor substrate.

Abstract: An image sensing device includes pixels forming rows and columns, sets of control lines respectively assigned to the rows such that one set of control lines is connected to one of the rows, a row drive circuit configured to drive the sets of control lines, and an assist circuit. Each set includes a first control line and a second control line. The row drive circuit includes a first drive circuit connected to a first end of the first control line and a second drive circuit connected to first end of the second control line. The assist circuit includes an assist drive circuit connected to a second end of the first control line so as to drive the first control line in accordance with a control signal supplied to the second control line.

Abstract: First processing of causing a hold unit to hold a first signal from an amplification unit based on reset of the amplification unit, second processing of performing AD conversion of the held first signal and outputting a second signal obtained by superposing a signal based on charges generated in a photoelectric conversion unit of a first-row pixel on the first signal, third processing of performing an operation of performing AD conversion of the held second signal and an operation of resetting the amplification unit at least partly in parallel, and fourth processing of causing the hold unit to hold a fourth signal obtained by superposing a signal based on charges generated in the photoelectric conversion unit of a second-row pixel on a third signal from the amplification unit based on resetting of the amplification unit and is output from the amplification unit are performed.

Abstract: A milling cutter is composed of a tool body having an approximately cylindrical or disk-like shape and a plurality of edge portions provided on at least an outer peripheral portion of one end of the tool body at predetermined intervals along a circumferential direction. The edge portion has a major cutting edge and a minor cutting edge that perform an operation of cutting a workpiece, the major cutting edge is positioned outside the minor cutting edge in a radial direction, and the minor cutting edge has a cutting edge angle that is an angle with respect to a plane orthogonal to a center axis of the tool body and set so as to be an elevation angle open outward in the radial direction. When surface machining is performed on a workpiece with the milling cutter, a high degree of machined surface accuracy equivalent to that obtained by grinding is obtained.

Abstract: An electronic circuit includes a generating circuit for generating a first group of signals and a second group of signals, and a transmission path for transmitting the first group of signals and the second group of signals. The first group of signals are composed of signals synchronized with a first edge that is one of the rising edge and the falling edge of a reference clock, and the second group of signals are composed of signals synchronized with a second edge that is the other of the rising edge and falling edge. The transmission path includes first transmission lines for transmitting the signals composing the first group and second transmission lines for transmitting the signals composing the second group, and the first and second transmission lines are alternately arranged.

Abstract: An image sensor comprises a pixel portion formed by arraying pixels including photoelectric conversion portions in a matrix, a plurality of A/D converters which are provided in a one-to-one correspondence to pixel columns of the pixel portion, an adding unit which adds pixel signals from a plurality of pixel columns to each other, and a connecting portion capable of inputting, to an arbitrary A/D converter, a sum signal obtained by adding the pixel signals by the adding unit.

Abstract: For each of the signal corresponding to a signal of a photoelectric converting unit being only a part of an effective pixel and the signal corresponding to a signal obtained by adding signals of a plurality of photoelectric converting units, the difference corresponding to the signal corresponding to the signal obtained by adding the signals of the plurality of photoelectric converting units of a light-shielded pixel.

Abstract: An apparatus according to the present invention in which a first substrate including a photoelectric conversion element and a gate electrode of a transistor, and a second substrate including a peripheral circuit portion are placed upon each other. The first substrate does not include a high-melting-metal compound layer, and the second substrate includes a high-melting-metal compound layer.

Abstract: An electronic circuit includes a generating circuit for generating a first group of signals and a second group of signals, and a transmission path for transmitting the first group of signals and the second group of signals. The first group of signals are composed of signals synchronized with a first edge that is one of the rising edge and the falling edge of a reference clock, and the second group of signals are composed of signals synchronized with a second edge that is the other of the rising edge and falling edge. The transmission path includes first transmission lines for transmitting the signals composing the first group and second transmission lines for transmitting the signals composing the second group, and the first and second transmission lines are alternately arranged.

Abstract: An image pickup apparatus includes a pixel array including a plurality of pixels arranged in a plurality of rows and a plurality of columns, and a plurality of column signal processing circuits provided respectively for the columns of the pixel array, each being configured to receive output signals from the pixels and an analog signal varying with time. The plurality of column signal processing circuits include a first column signal processing circuit and a second column signal processing circuit configured such that each of the first column signal processing circuit and the second column signal processing circuit is configured to be independently switched between a driving state and a power saving state. A signal line for supplying the analog signal to the first column signal processing circuit and a signal line for supplying the analog signal to the second column signal processing circuit are electrically isolated from each other.

Abstract: A photoelectric convertor of a pixel is reset in a second row, which is different from a first row, among plural rows during a period in which the pixel in the first row among the plural rows is being selected as a pixel to output an optical signal. The reset of the photoelectric convertor of the pixel in the second row is canceled in a period other than a period in which an A/D converting unit converts the optical signal of the pixel in the first row into a digital signal.

Abstract: A signal based on a pixel signal of a first pixel sampled by a capacitor element is held by a signal holding unit with a switch left turned on.

Abstract: An apparatus according to the present invention in which a first substrate including a photoelectric conversion element and a gate electrode of a transistor, and a second substrate including a peripheral circuit portion are placed upon each other. The first substrate does not include a high-melting-metal compound layer, and the second substrate includes a high-melting-metal compound layer.

Abstract: A method for generating control data is a method for generating control data for manufacturing a product having a designated shape using an additive manufacturing technology. The control data includes a path of a nozzle for supplying a material. The method for generating the control data includes: determining a cutting path for cutting the designated shape by a tool; and determining the path of the nozzle by reproducing the cutting path temporally reversely.

Abstract: A member for a solid-state image pickup device having a bonding plane with no gaps and a method for manufacturing the same are provided. The manufacturing method includes the steps of providing a first substrate provided with a photoelectric converter on its primary face and a first wiring structure, providing a second substrate provided with a part of a peripheral circuit on its primary face and a second wiring structure, and performing bonding so that the first substrate, the first wiring structure, the second wiring structure, and the second substrate are disposed in this order. In addition, at least one of an upper face of the first wiring structure and an upper face of the second wiring structure has a concave portion, and a conductive material forms a bottom face of the concave portion.

Abstract: In an imaging device including a pixel array in which a plurality of pixels is arranged, each of the pixels including first and second photoelectric conversion units, and a micro lens that collects incident light to the first and second photoelectric conversion units, in a first frame period, a first signal based on a signal electric charge generated in the first photoelectric conversion unit and a second signal based on a signal electric charge generated in at least the second photoelectric conversion unit are read out from a plurality of pixels included in a part of the pixel array, and in a second frame period, a third signal based on the signal electric charges generated in the first and the second photoelectric conversion units is read out from a plurality of pixels included in another part of the pixel array.

Abstract: A reinstalling method which, when reinstalling an object to be supported, precisely restores the object to an initial installing state in a short period of time without requiring special skills. In a state before supporting of an object to be supported by support tools is released and in each of states in which the supporting is sequentially released, load acting on at least one support tool selected from among the support tools being in a supporting state is obtained. When reinstalling, the object is sequentially supported at the same positions as those before the release by the support tools in the reverse order to that of the release, and, a vertical-direction supporting position of each support tool is adjusted so that a load cell of the selected support tool detects the same value as the load obtained in the supporting state before the support tool was released.

Abstract: For each of the signal corresponding to a signal of a photoelectric converting unit being only a part of an effective pixel and the signal corresponding to a signal obtained by adding signals of a plurality of photoelectric converting units, the difference corresponding to the signal corresponding to the signal obtained by adding the signals of the plurality of photoelectric converting units of a light-shielded pixel.

Abstract: In a solid-state imaging device, a photoelectric conversion unit, a transfer transistor, and at least a part of electric charge holding unit, among pixel constituent elements, are disposed on a first semiconductor substrate. An amplifying transistor, a signal processing circuit other than a reset transistor, and a plurality of common output lines, to which signals are read out from a plurality of pixels, are disposed on a second semiconductor substrate.

Abstract: A workpiece fixing jig 1 includes a base 2 to be fixed on a table, and a clamping mechanism 10 provided on the base 2 for clamping a workpiece. The clamping mechanism 10 includes a first clamping portion 20 and a second clamping portion 30 provided to face each other. At least one of the first and second clamping portions 20 and 30 is configured to move forward and backward with respect to the other along a moving direction and the moving direction is set to a direction intersecting a direction in which the base 2 is fixed on the table. In using this workpiece fixing jig 1, the base 2 is fixed on the table after the workpiece is clamped between the first clamping portion 20 and the second clamping portion 30.