Patents by Inventor Ming Yeh

Ming Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200190605
    Abstract: The invention relates to a detective molecule, and more particularly to a detective molecule and a kit for detecting a target molecule, a method for predicting fragrance production in an orchid, and a method for breeding a scented orchid.
    Type: Application
    Filed: December 17, 2018
    Publication date: June 18, 2020
    Inventors: HONG-HWA CHEN, YU-CHEN CHUANG, WEN-CHIEH TSAI, YI-CHU HUNG, WEN-HUEI CHEN, CHI-YU HSU, CHUAN-MING YEH, NOBUTAKA MITSUDA, MASARU OHME-TAKAGI
  • Publication number: 20200161100
    Abstract: An apparatus for PVD is provided. The apparatus includes a chamber, a pedestal disposed in the chamber to accommodate a wafer, and a ring. The ring includes a ring body having a first top surface and a second top surface, and a barrier structure disposed between the first top surface and the second top surface. The barrier structure can further include at least a first portion and a second portion separated from each other. The second vertical distance is equal to or greater than the first vertical distance.
    Type: Application
    Filed: October 15, 2019
    Publication date: May 21, 2020
    Inventors: HSIN-LIANG CHEN, WEN-CHIH WANG, CHIA-HUNG LIAO, CHENG-CHIEH CHEN, YI-MING YEH, HUNG-TING LIN, YUNG-YAO LEE
  • Publication number: 20200152186
    Abstract: Methods and systems for providing a correct voice command. One system includes a communication device that includes an electronic processor configured to receive a first voice command via a microphone and analyze the first voice command using a first type of voice recognition. The electronic processor determines that an action to be performed in accordance with the first voice command is unrecognizable based on the analysis using the first type of voice recognition. The electronic processor transmits the first voice command to a remote electronic computing device accompanying a request requesting that the first voice command be analyzed using a second type of voice recognition different from the first type of voice recognition. The electronic processor receives, from the remote electronic computing device, a second voice command corresponding to the action and different from the first voice command, and outputs, with a speaker, the second voice command.
    Type: Application
    Filed: November 13, 2018
    Publication date: May 14, 2020
    Inventors: Ming Yeh Koh, Hee Tat Goey, Bing Qin Lim, Yan Pin Ong
  • Publication number: 20200135947
    Abstract: A solar cell includes an N-type silicon substrate, a P-type doped region, an anti-reflective layer, an n+ back surface field (BSF), aluminum electrodes, aluminum doped regions, and a backside electrode. The N-type silicon substrate has a first surface and a second surface opposite to the first surface. The P-type doped region is formed in the first surface of the N-type silicon substrate. The anti-reflective layer is formed on the P-type doped region. The aluminum electrodes are formed on the P-type doped region, and the aluminum doped regions are formed in the P-type doped region under the aluminum electrodes, wherein the aluminum doped regions are in direct contact with the aluminum electrodes. The n+ BSF is formed in the second surface of the N-type silicon substrate, and the backside electrode is formed on the second surface of the N-type silicon substrate.
    Type: Application
    Filed: January 9, 2019
    Publication date: April 30, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Chun-Ming Yeh, Chorng-Jye Huang, Chun-Chieh Lo
  • Patent number: 10630881
    Abstract: A lens detection system includes a system chip, and the system chip includes a first lens selection pin and a protocol path pin. A lens detection method includes performing a reset step by the system chip; enabling the first lens selection pin by the system chip; detecting a first lens identification code via the protocol path pin by the system chip; loading first lens data by the system chip and entering a first lens operation mode for controlling an externally connected first lens if the first lens identification code is detected; and disabling the first lens selection pin by the system chip if the first lens identification code is undetected.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: April 21, 2020
    Assignee: VIVOTEK INC.
    Inventors: Chien-Ming Yeh, Ting-Chia Chang, Ren-Wei Lin, Wen-Yuan Li
  • Publication number: 20200087383
    Abstract: Disclosed herein is an anti-DENV antibody, a pharmaceutical composition comprising the same, and uses thereof. According to embodiments of the present disclosure, the anti-DENV antibody comprises a heavy chain variable region and a light chain variable region, in which the heavy chain variable region comprises amino acid sequences of SEQ ID NOs: 1-3, and the light chain variable region comprises amino acid sequences of SEQ ID NOs: 5-7.
    Type: Application
    Filed: May 22, 2018
    Publication date: March 19, 2020
    Applicants: NATIONAL CHENG KUNG UNIVERSITY, DCB-USA LLC
    Inventors: Trai-Ming YEH, Yung-Chun CHUANG, Yen-Chung LAI
  • Patent number: 10586730
    Abstract: An electronic device includes an isolated region surrounded by an isolation ring over a semiconductor substrate. A well of a first conductivity type is located within the isolated region. A source region and a drain region of a second conductivity type are located over the well. A local-oxidation-of-silicon (LOCOS) layer is located on the well between the source and the drain, between the source and the isolation ring, and between the drain and the isolation ring. A gate electrode located between the source and the drain on said LOCOS layer.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: March 10, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Ming-Yeh Chuang
  • Publication number: 20200051809
    Abstract: A system for performing a chemical mechanical polishing (CMP) process is provided. The system includes a CMP tool configured to polish a semiconductor wafer. The processing system further includes a wafer stage configured to support the semiconductor wafer for facilitating the insertion of the semiconductor wafer into, and its subsequent removal from, the CMP tool. The processing system also includes a number of spray nozzles positioned relative to the wafer stage. In addition, the processing system includes a spray generator connected to the spray nozzles and configured to convert a mixture to a mist spray. The processing system further includes a controller configured to activate flow of the mist spray from the spray generator to the spray nozzles to discharge the mist spray over the semiconductor wafer supported by the wafer stage.
    Type: Application
    Filed: October 21, 2019
    Publication date: February 13, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-I PENG, Hsiu-Ming YEH, Yi-Chang LIU
  • Publication number: 20190384905
    Abstract: A method for image based authentication of a human computer user as opposed to a robot is applied in a server. The server generates a CAPTCHA image and preprocesses the CAPTCHA image. The CAPTCHA image is preprocessed by halftoning and mapping pixel sparsity onto pre-computed levels by block based operation. The server then encrypts the preprocessed CAPTCHA image into two shared images and transmits same to the client device. The client device renders the two shared images on a display through a user interface to facilitate superimposition of the two shared images and the user can visually decrypt the preprocessed CAPTCHA image and input an authentication code according to the CAPTCHA characters.
    Type: Application
    Filed: June 13, 2018
    Publication date: December 19, 2019
    Inventors: CHIA-MING YEH, RUI-TANG HUANG
  • Publication number: 20190366771
    Abstract: A vehicle tire comprises first and second bead cores spaced apart from each other, a first casing layer wrapped around the bead cores, a second casing layer wrapped around the bead cores, and a tread layer. The first casing layer has first edge sections that overlap with each other at a zenith of the tire and terminate at first edges on opposing sides of the zenith. The second casing layer has second edge sections that do not overlap with each other and that terminate at second edges that are each substantially aligned with one of the first edges. The first and second casing layers are each made of a single unidirectional ply that are in different directions to each other. The sidewall regions and the zenith comprise four plies of casing layers throughout the tire. The tire can further include first and second sidewall reinforcements (e.g., rubber strips) positioned in the first and second sidewall regions.
    Type: Application
    Filed: May 29, 2018
    Publication date: December 5, 2019
    Inventors: Eva Lutz, RĂ¼diger Schulte, Chun Ming Yeh
  • Patent number: 10499202
    Abstract: An Internet of Things (IoT) device contact has a talkgroup/contact name modified based on an IoT location, a device location, and a heading from the device to the IoT location.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: December 3, 2019
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Ming Yeh Koh, Soon Hoe Lim, Bing Qin Lim, Syed Isa Syed Idrus
  • Patent number: 10460926
    Abstract: A method for processing a semiconductor wafer is provided. The method includes transferring the semiconductor wafer from an interface tool to a Chemical Mechanical Polishing (CMP) tool. The method further includes polishing the semiconductor wafer with the CMP tool. The method also includes transferring the semiconductor wafer back to the interface tool from the CMP tool. In addition, the method includes converting a mixture to a mist spray and discharging the mist spray over the semiconductor wafer in the interface tool after the semiconductor wafer is polished by the CMP tool.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: October 29, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-I Peng, Hsiu-Ming Yeh, Yi-Chang Liu
  • Patent number: 10440526
    Abstract: A method and apparatus for PTT over IoT is described herein. During operation each IoT device will be assigned to a talkgroup. Some talkgroups may have a single IoT device assigned, some IoT device may have multiple talkgroups assigned, and other talkgroups may have multiple IoT devices assigned. During operation, an action command is received over a first talkgroup and a first command type is issued to a first IoT device assigned to that talkgroup. A second action command is received over a second talkgroup and a second command type is issued to a second IoT device assigned to the second talkgroup. When determine that multiple radios are issuing action command to the same IoT device through PTT talkgroup, create a new PTT talkgroup to be populated with the multiple radios.
    Type: Grant
    Filed: November 12, 2018
    Date of Patent: October 8, 2019
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Bing Qin Lim, Soon Hoe Lim, Ming Yeh Koh, Syed Isa Syed Idrus
  • Publication number: 20190221701
    Abstract: A solar cell includes a photoelectric conversion layer, a doped layer, a first passivation layer, a first TCO layer, a front electrode and a back electrode. The doped layer is disposed on the front surface of the photoelectric conversion layer. The first passivation layer is disposed on the doped layer, wherein the first passivation layer has a plurality of openings exposing a portion of the doped layer. The first TCO layer is disposed on the first passivation layer and in the openings, and directly contacts the exposed doped layer via the openings, wherein a ratio of an area of the openings to an area of the first TCO layer is between 0.01 and 0.5. The front electrode is disposed on the first TCO layer. The back electrode is disposed on the back surface of the photoelectric conversion layer.
    Type: Application
    Filed: January 15, 2018
    Publication date: July 18, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Chao-Cheng Lin, Chorng-Jye Huang, Chen-Cheng Lin, Chun-Heng Chen, Chen-Hsun Du, Chun-Ming Yeh, Jui-Chung Hsiao
  • Publication number: 20190199911
    Abstract: A lens detection system includes a system chip, and the system chip includes a first lens selection pin and a protocol path pin. A lens detection method includes performing a reset step by the system chip; enabling the first lens selection pin by the system chip; detecting a first lens identification code via the protocol path pin by the system chip; loading first lens data by the system chip and entering a first lens operation mode for controlling an externally connected first lens if the first lens identification code is detected; and disabling the first lens selection pin by the system chip if the first lens identification code is undetected.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 27, 2019
    Inventors: Chien-Ming Yeh, Ting-Chia Chang, Ren-Wei Lin, Wen-Yuan Li
  • Patent number: 10312384
    Abstract: A solar cell is provided. The solar cell includes a Si substrate having a first surface and a second surface opposite to each other, an emitter, a first electrode, a doped region, a passivation layer, a doped polysilicon layer, a semiconductor layer, and a second electrode. The emitter is disposed on the first surface. The first electrode is disposed on the emitter. The doped region is disposed in the second surface. The passivation layer is disposed on the second surface. The doped polysilicon layer is disposed on the passivation layer, wherein a plurality of holes penetrates the doped polysilicon layer and the passivation layer and exposes a portion of the second surface. The semiconductor layer is disposed on the doped polysilicon layer and in the holes. The band gap of the semiconductor layer is greater than that of the Si substrate. The second electrode is disposed on the semiconductor layer.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: June 4, 2019
    Assignee: Industrial Technology Research Institute
    Inventors: Chao-Cheng Lin, Chien-Kai Peng, Chen-Cheng Lin, Chen-Hsun Du, Chorng-Jye Huang, Chun-Ming Yeh
  • Publication number: 20190165168
    Abstract: A power transistor is provided with at least one transistor finger that lies within a semiconductor material. The gate oxide is segmented into a set of segments with thick field oxide between each segment in order to reduce gate capacitance and thereby improve a resistance times gate charge figure of merit.
    Type: Application
    Filed: February 1, 2019
    Publication date: May 30, 2019
    Inventors: Sameer Pendharkar, Ming-yeh Chuang
  • Publication number: 20190157071
    Abstract: A method for processing a semiconductor wafer is provided. The method includes transferring the semiconductor wafer from an interface tool to a Chemical Mechanical Polishing (CMP) tool. The method further includes polishing the semiconductor wafer with the CMP tool. The method also includes transferring the semiconductor wafer back to the interface tool from the CMP tool. In addition, the method includes converting a mixture to a mist spray and discharging the mist spray over the semiconductor wafer in the interface tool after the semiconductor wafer is polished by the CMP tool.
    Type: Application
    Filed: April 27, 2018
    Publication date: May 23, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-I PENG, Hsiu-Ming YEH, Yi-Chang LIU
  • Patent number: 10299101
    Abstract: A device, system and method for controlling quality of service of communication devices based on a predicted hazard path is provided. From an initial location of a hazard in a building and an electronic representation of the building, a predicted hazard path through the building is determined, as well as geofences, each associated with a respective weight. Geofences that include the predicted hazard path have a higher weight than geofences that exclude the predicted hazard path. Respective network quality of service for communication devices is controlled based on their locations in the building, relative to the geofences, such that a first communication device located in a first geofence that includes the predicted hazard path receives better network quality of service than a second communication device located in a second geofence that excludes the predicted hazard path, the second geofence having a lower weight than the first geofence.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: May 21, 2019
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Bing Qin Lim, Ming Yeh Koh, Cecilia Liaw Wei Ling
  • Publication number: 20190131472
    Abstract: A solar cell includes a silicon substrate, a passivation structure, and a metal electrode. The passivation structure is disposed on a surface of the silicon substrate, and the passivation structure includes a tunneling layer and a doped polysilicon layer. The tunneling layer is disposed on the surface of the silicon substrate. The doped polysilicon layer is disposed on the tunneling layer and includes a first region and a second region having different thicknesses from each other, and the thickness of the first region is greater than that of the second region, wherein the thickness of the first region is between 50 nm and 500 nm, and the thickness of the second region is greater than 0 and equal to or less than 250 nm. The metal electrode is disposed on the first region of the doped polysilicon layer.
    Type: Application
    Filed: December 11, 2017
    Publication date: May 2, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Jui-Chung Hsiao, Chun-Ming Yeh, Chao-Cheng Lin, Chorng-Jye Huang, Chen-Hsun Du, Chun-Heng Chen