Abstract: A semiconductor memory according to an embodiment includes first and second memory cells, first and second memory cell arrays, first and second word lines, and controller. The first and second memory cell array include the first and second memory cells, respectively. The first and second word lines are coupled to the first and second memory cells, respectively. Data of six or more bits including a first bit, a second bit, a third bit, a fourth bit, a fifth bit, and a sixth bit is stored with the use of a combination of a threshold voltage of the first memory cell and a threshold voltage of the second memory cell.

Abstract: According to one embodiment, a semiconductor memory device includes first to nth string units (n being a natural number of 3 or more), a plurality of layers of word lines, and (n?1) layers of select gate layers. The first to nth string units each includes a memory string. The memory string includes a plurality of memory cells and a plurality of select transistors connected in series in a first direction. The (n?1) layers of select gate layers include first to (2×(n?1))th select gates electrically isolated from each other. The first string unit is selected by the first to (n?1)th select gates. The kth string unit (k being not less than 1 and not more than n) is selected by the kth to (n+k?2)th select gates. The nth string unit is selected by the nth to (2×(n?1))th select gates.

Abstract: A semiconductor memory device includes a first memory cell for storing data using at least three levels of threshold voltages, including a first level, a second level higher than the first level and a third level higher than the second level. A first word line is connected to the first memory cell. In writing of data to the first memory cell from a state where a threshold voltage of the first memory cell is the first level, a plurality of program operations and verify operations are performed, each program operation including applying a program voltage to the first word line, each verify operation including applying a read voltage lower than the program voltage. The program operations include a program operation for the second level and a program operation for the third level, and the verify operations include a verify operation for the second level, and do not include a verify operation for the third level.

Abstract: A memory cell array is configured to have a plurality of memory cells arranged in a matrix, each of the memory cells being connected to a word line and a bit line and being capable of storing n values (n is a natural number equal to or larger than 3). A control circuit controls the potentials of the word line and bit line according to input data and writes data into a memory cell. The control circuit writes data into the memory cell to a k-valued threshold voltage (k<=n) in a write operation, precharges the bit line once, and then changes the potential of the word line an i number of times to verify whether the memory cell has reached an i-valued (i<=k) threshold voltage.

Abstract: A communication line is connected to first and second chips, and held at a first signal level. A monitor circuit changes a signal level of the communication line from the first signal to a second signal level while one of the first and second chips uses a current larger than a reference current. When the signal level of the communication line is the second signal level, the other of the first and second chips is controlled to a wait state that does not transfer to an operating state of using a current larger than the reference current.

Abstract: A memory system has a nonvolatile memory which comprises memory cells capable of storing 4-bit data of first to fourth bits by sixteen threshold regions including a first threshold region corresponding to an erased state and second to sixteenth threshold regions having higher voltage levels than a voltage level of the first threshold region corresponding to a written state; and a controller which causes the nonvolatile memory to execute a first program for writing data of the first bit and the second bit and then causes the nonvolatile memory to execute a second program for writing data of the third bit and the fourth bit. The controller controls such that the threshold region is any threshold region of a seventeenth threshold region corresponding to an erased state and eighteenth to twentieth threshold regions having higher voltage levels than that of the seventeenth threshold region corresponding to a written state.

Abstract: Data storage circuits are connected to the bit lines in a one-to-one correspondence. A write circuit writes the data on a first page into a plurality of 5 first memory cells selected simultaneously by a word line. Thereafter, the write circuit writes the data on a second page into the plurality of first memory cell. Then, the write circuit writes the data on the first and second pages into second memory cells adjoining 10 the first memory cells in the bit line direction.

Abstract: According to one embodiment, a memory system includes a semiconductor memory device including a memory cell capable of holding at least 4-bit data and a controller configured to control a first write operation and a second write operation based on the 4-bit data. The controller includes a conversion circuit configured to convert 4-bit data into 2-bit data. The semiconductor memory device includes a recovery controller configured to recover the 4-bit data based on the converted 2-bit data and data written in the memory cell by the first write operation. The first write operation is executed based on the 4-bit data received from the controller, and the second write operation is executed based on the 4-bit data recovered by the recovery controller.

Abstract: According to one embodiment, three bits stored in one memory cell of a nonvolatile memory correspond to three pages. In first page writing, a threshold voltage becomes within a first or second region base on a bit value. In second page writing, if being within the first region, it becomes within the first or fourth region; and if being within the second region, it becomes within the second or third region. In the third page writing, if being within the first region, it becomes within the first or sixth region; if being within the second region, it becomes within the second or seventh region; if being within the third region, it becomes within the third or eighth region; and if being within the fourth region, it becomes within the fourth or fifth region.

Abstract: According to one embodiment, a semiconductor memory device includes a first memory cell capable of storing 3-bit data. When first data including a first bit is received from an external controller, the received first data is written to the first memory cell. When second data including a second bit and a third bit is received from the controller after the first data is received, the first bit is read from the first memory cell and the 3-bit data is written to the first memory cell based on the read first bit and the received second data. In the 3-bit data written to the first memory cell, lower bit data is determined by three read operations, middle bit data is determined by two read operations, and upper bit data is determined by two read operations.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cell array, a data storage circuit and a control circuit. The data storage circuit holds first data to be written into the memory cell and holds 1 bit data calculated from the first data. The control circuit writes the data of n bits into the memory cell in a first write operation and then executes a second write operation. The control circuit carries out the following control in the second write operation. It reads data stored in the memory cell in the first write operation. It restores the first data based on the data read from the memory cell and the 1 bit data held in the data storage circuit. It writes the restored first data into the memory cell.

Abstract: According to one embodiment, a semiconductor memory device includes first to nth string units (n being a natural number of 3 or more), a plurality of layers of word lines, and (n?1) layers of select gate layers. The first to nth string units each includes a memory string. The memory string includes a plurality of memory cells and a plurality of select transistors connected in series in a first direction. The (n?1) layers of select gate layers include first to (2×(n?1))th select gates electrically isolated from each other. The first string unit is selected by the first to (n?1)th select gates. The kth string unit (k being not less than 1 and not more than n) is selected by the kth to (n+k?2)th select gates. The nth string unit is selected by the nth to (2×(n?1))th select gates.

Abstract: According to one embodiment, a first well of the first conductivity type which is formed in a substrate. a second well of a second conductivity type which is formed in the first well. The plurality of memory cells, the plurality of first bit line select transistors, and the plurality of second bit line select transistors are formed in the second well, and the plurality of first bit line select transistors and the plurality of second bit line select transistors are arranged on a side of the sense amplifier with respect to the plurality of memory cells of the plurality of bit lines.

Abstract: A memory cell array is configured to have a plurality of memory cells arranged in a matrix, each of the memory cells being connected to a word line and a bit line and being capable of storing n values (n is a natural number equal to or larger than 3). A control circuit controls the potentials of the word line and bit line according to input data and writes data into a memory cell. The control circuit writes data into the memory cell to a k-valued threshold voltage (k<=n) in a write operation, precharges the bit line once, and then changes the potential of the word line an i number of times to verify whether the memory cell has reached an i-valued (i<=k) threshold voltage.

Abstract: Data storage circuits are connected to the bit lines in a one-to-one correspondence. A write circuit writes the data on a first page into a plurality of 5 first memory cells selected simultaneously by a word line. Thereafter, the write circuit writes the data on a second page into the plurality of first memory cell. Then, the write circuit writes the data on the first and second pages into second memory cells adjoining 10 the first memory cells in the bit line direction.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cell array, a data storage circuit and a control circuit. The data storage circuit holds first data to be written into the memory cell and holds 1 bit data calculated from the first data. The control circuit writes the data of n bits into the memory cell in a first write operation and then executes a second write operation. The control circuit carries out the following control in the second write operation. It reads data stored in the memory cell in the first write operation. It restores the first data based on the data read from the memory cell and the 1 bit data held in the data storage circuit. It writes the restored first data into the memory cell.

Abstract: According to one embodiment, three bits stored in one memory cell of a nonvolatile memory correspond to three pages. In first page writing, a threshold voltage becomes within a first or second region base on a bit value. In second page writing, if being within the first region, it becomes within the first or fourth region; and if being within the second region, it becomes within the second or third region. In the third page writing, if being within the first region, it becomes within the first or sixth region; if being within the second region, it becomes within the second or seventh region; if being within the third region, it becomes within the third or eighth region; and if being within the fourth region, it becomes within the fourth or fifth region.

Abstract: A semiconductor memory device includes a first memory cell which is capable of being set to any one of at least eight threshold voltages, a first bit line connected to the first memory cell, a word line connected to a gate of the first memory cell, a sense amplifier connected to the first bit line, wherein the sense amplifier has at least four data latch circuits, and an extra data latch circuit connected to the sense amplifier through a data bus. A verification operation for verifying the threshold voltage of the first memory cell is performed after a programming operation is performed on the first memory cell, and the verification operation includes seven verification operations during which the four data latch circuits, but not the extra data latch circuit, are accessed.

Abstract: According to one embodiment, three bits stored in one memory cell of a nonvolatile memory correspond to three pages. In first page writing, a threshold voltage becomes within a first or second region base on a bit value. In second page writing, if being within the first region, it becomes within the first or fourth region; and if being within the second region, it becomes within the second or third region. In the third page writing, if being within the first region, it becomes within the first or sixth region; if being within the second region, it becomes within the second or seventh region; if being within the third region, it becomes within the third or eighth region; and if being within the fourth region, it becomes within the fourth or fifth region.

Abstract: According to one embodiment, a semiconductor memory device includes a first memory cell capable of storing 3-bit data. When first data including a first bit is received from an external controller, the received first data is written to the first memory cell. When second data including a second bit and a third bit is received from the controller after the first data is received, the first bit is read from the first memory cell and the 3-bit data is written to the first memory cell based on the read first bit and the received second data. In the 3-bit data written to the first memory cell, lower bit data is determined by three read operations, middle bit data is determined by two read operations, and upper bit data is determined by two read operations.