Patents by Inventor Pei Yu

Pei Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11410930
    Abstract: In an embodiment, a device includes: a first fin; a gate structure over the first fin; a first source/drain region adjacent the gate structure; an etch stop layer over the first source/drain region; a conductive line over the etch stop layer, the conductive line isolated from the first source/drain region by the etch stop layer, a top surface of the conductive line being coplanar with a top surface of the gate structure; and a power rail contact extending through the first fin, the power rail contact connected to the first source/drain region.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: August 9, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Pei-Yu Wang, Yu-Xuan Huang
  • Patent number: 11411560
    Abstract: An electronic system, an integrated circuit die and an operation method thereof are provided. The integrated circuit die includes a plurality of interface circuit slices and a merging circuit. The transmission data stream sent from the transmitter die is split into a plurality of sub-data streams. Each of the interface circuit slices provides a physical layer to receive the corresponding one of the sub-data streams. The merging circuit is coupled to the interface circuit slices to receive the sub-data streams. The merging circuit merges the sub-data streams from the interface circuit slices back to the original data corresponding to the transmission data stream to be provided to an application layer. The merging circuit aligns the sub-data streams from the interface circuit slices in timing to mitigate different delays of the interface circuit slices.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: August 9, 2022
    Assignees: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pei Yu, Yung-Sheng Fang, Chang-Ming Liu, Igor Elkanovich
  • Publication number: 20220238370
    Abstract: Semiconductor devices and methods of forming the same are provided. A method according to the present disclosure includes providing a workpiece including a frontside and a backside. The workpiece includes a substrate, a first plurality of channel members over a first portion of the substrate, a second plurality of channel members over a second portion of the substrate, an isolation feature sandwiched between the first and second portions of the substrate. The method also includes forming a joint gate structure to wrap around each of the first and second pluralities of channel members, forming a pilot opening in the isolation feature, extending the pilot opening through the join gate structure to form a gate cut opening that separates the joint gate structure into a first gate structure and a second gate structure, and depositing a dielectric material into the gate cut opening to form a gate cut feature.
    Type: Application
    Filed: September 1, 2021
    Publication date: July 28, 2022
    Inventors: Chun-Yuan Chen, Pei-Yu Wang, Huan-Chieh Su, Yi-Hsun Chiu, Cheng-Chi Chuang, Ching-Wei Tsai, Kuan-Lun Cheng, Chih-Hao Wang
  • Publication number: 20220223422
    Abstract: A method includes forming a dummy gate stack on a semiconductor fin, forming gate spacers on sidewalls of the dummy gate stack, forming a first inter-layer dielectric, with the gate spacers and the dummy gate stack being in the first inter-layer dielectric, removing the dummy gate stack to form a trench between the gate spacers, forming a replacement gate stack in the trench, and depositing a dielectric capping layer. A bottom surface of the dielectric capping layer contacts a first top surface of the replacement gate stack and a second top surface of the first inter-layer dielectric. A second inter-layer dielectric is deposited over the dielectric capping layer. A source/drain contact plug is formed and extends into the second inter-layer dielectric, the dielectric capping layer, and the first inter-layer dielectric.
    Type: Application
    Filed: March 3, 2021
    Publication date: July 14, 2022
    Inventors: Pei-Yu Chou, Tze-Liang Lee
  • Patent number: 11387233
    Abstract: A semiconductor device structure, along with methods of forming such, are described. The structure includes a source region, a drain region, and a gate electrode layer disposed between the source region and the drain region. The gate electrode layer includes a first surface facing the source region, and the first surface includes an edge portion having a first height. The gate electrode layer further includes a second surface opposite the first surface and facing the drain region. The second surface includes an edge portion having a second height. The second height is different from the first height.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: July 12, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Huan-Chieh Su, Chun-Yuan Chen, Pei-Yu Wang, Cheng-Chi Chuang, Chih-Hao Wang
  • Publication number: 20220212373
    Abstract: A UV (ultraviolet) curing apparatus for a contact-lens polymerization process is provided. A UV curing module is equipped for the mold cavities of contact-lens curing molds, including a plurality of first UV light sources arranged above the mold cavities and a plurality of second UV light sources arranged below the mold cavities. A plurality of light output areas of a first light guide device guides the light beams emitted by the first UV light sources to illuminate upper light receiving surfaces of the molds. A plurality of reflecting plates of a second light guide device reflects and scatters the light beams emitted by the second UV light sources to lower light receiving surfaces of the molds. Thereby, the contact-lens polymer inside the molds is uniformly cured, and the yield is raised.
    Type: Application
    Filed: March 16, 2021
    Publication date: July 7, 2022
    Inventors: SHIH HONG CHU, ZHENG JUN SU, CHENG TAI JAO, HSIN PEI YU, HUAN CHIU TSEN
  • Publication number: 20220216147
    Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes a substrate, a gate structure, a dielectric structure and a contact structure. The substrate has source/drain (S/D) regions. The gate structure is on the substrate and between the S/D regions. The dielectric structure covers the gate structure. The contact structure penetrates through the dielectric structure to connect to the S/D region. A lower portion of a sidewall of the contact structure is spaced apart from the dielectric structure by an air gap therebetween, while an upper portion of the sidewall of the contact structure is in contact with the dielectric structure.
    Type: Application
    Filed: March 23, 2022
    Publication date: July 7, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pei-Yu Chou, Jr-Hung Li, Liang-Yin Chen, Su-Hao Liu, Tze-Liang Lee, Meng-Han Chou, Kuo-Ju Chen, Huicheng Chang, Tsai-Jung Ho, Tzu-Yang Ho
  • Publication number: 20220212427
    Abstract: A UV (ultraviolet) curing apparatus for a contact-lens polymerization process is provided. A UV curing module is equipped for the mold cavities of contact-lens curing molds, including a plurality of first UV light sources arranged above the mold cavities and a plurality of second UV light sources arranged below the mold cavities. A plurality of first light output areas of a first light guide device guides the light beams emitted by the first UV light sources to illuminate upper light receiving surfaces of the molds. A plurality of second light output areas of a second light guide device guides the light beams emitted by the second UV light sources to illuminate lower light receiving surfaces of the molds. Thereby, the contact-lens polymer inside the molds is uniformly cured, and the yield is raised.
    Type: Application
    Filed: March 17, 2021
    Publication date: July 7, 2022
    Inventors: SHIH HONG CHU, ZHENG JUN SU, CHENG TAI JAO, HSIN PEI YU, HUAN CHIU TSEN
  • Publication number: 20220208623
    Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.
    Type: Application
    Filed: March 15, 2022
    Publication date: June 30, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tsung-Yu LIN, Pei-Yu WANG, Chung-Wei HSU
  • Publication number: 20220202812
    Abstract: The present invention relates to the use of ligustrazine nitrone derivatives and pharmaceutical composition thereof for the treatment and prevention of diseases of diabetic complications, which include renal anemia. The ligustrazine nitrone derivatives have the structure of the general formula (I). Experimental results indicated that the ligustrazine nitrone derivatives can significantly increase the levels of serum iron and erythropoietin in STZ induced SD rats and spontaneously hypertensive rats, and can be used for treating and preventing renal anemia caused by decrease in renal EPO production and/or concomitant iron deficiency. Therefore, the ligustrazine nitrone derivatives can be made into various dosage forms with a drug carrier. The derivatives can be prepared into various dose forms together with drug carriers.
    Type: Application
    Filed: November 3, 2021
    Publication date: June 30, 2022
    Applicant: QINGDAO HAILAN PHARMACEUTICALS CO., LTD.
    Inventors: Yuqiang Wang, Yewei Sun, Lipeng Xu, Mei Jing, Zaijun Zhang, Gaoxiao Zhang, Pei Yu, Peng Yi
  • Publication number: 20220208684
    Abstract: An interface of integrated circuit (IC) die includes a plurality of the contact elements formed as a contact element pattern corresponding to a parallel bus. The contact elements are arranged in an array of rows and columns and divided into a transmitting group and a receiving group. The contact elements of the transmitting group have a first contact element sequence and the contact elements of the receiving group have a second contact element sequence, the first contact element sequence is identical to the second contact element sequence. The contact elements with the first contact element sequence and the second contact element sequence are matched when the contact element pattern is geometrically rotated by 180° with respect to a row direction and a column direction.
    Type: Application
    Filed: December 28, 2020
    Publication date: June 30, 2022
    Applicants: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Hao Wang, Ting-Chin Cho, Igor Elkanovich, Amnon Parnass, Chia-Hsiang Chang, Tsai-Ming Yang, Yen-Chung T. Chen, Ting-Hsu Chien, Yuan-Hung Lin, Chao-Ching Huang, Li-Ya Tseng, Pei Yu, Jia-Liang Chen, Yen-Wei Chen, Chung-Kai Wang, Chun-Hsu Chen, Yu-Ju Chang, Li-Hua Lin, Zanyu Yang
  • Publication number: 20220203359
    Abstract: The present invention relates to a near-field acoustic platform capable of synthesizing high resolution, arbitrarily shaped energy potential wells. A thin and viscoelastic membrane is utilized to modulate acoustic wavefront on a deep, sub-wavelength scale by suppressing the structural vibration selectively on the platform. This new acoustic wavefront modulation mechanism is powerful for manufacturing complex biologic products.
    Type: Application
    Filed: April 24, 2020
    Publication date: June 30, 2022
    Inventors: Pei Yu E. Chiou, Kuan-Wen Tung, Benjamin M. Wu
  • Publication number: 20220199523
    Abstract: Semiconductor devices and method of forming the same are disclosed herein. A semiconductor device according to the present disclosure includes a first dielectric layer having a first top surface and a contact via extending through the first dielectric layer and rising above the first top surface of the first dielectric layer.
    Type: Application
    Filed: March 14, 2022
    Publication date: June 23, 2022
    Inventors: Pei-Yu Wang, Cheng-Ting Chung, Wei Ju Lee
  • Publication number: 20220192906
    Abstract: A transmission device of a hospital bed, the hospital bed includes a body, a head, and a bed end. The transmission device contains: a main motor, a connection rod unit, and a driver. The main motor is disposed on a bottom of the body and includes a socket. The connection rod unit includes a first fixing rod connected to the head and a second fixing rod connected to the bed end. The driver is mounted on the main motor and includes an accommodation space, a driving motor, a reducer, a power cable, and a drive shaft. The first case has a first coupling orifice, and the second case has a second coupling orifice. The power cable is connected between the socket and the driving motor so as to supply a power to the driving motor and to lift or descend the head and the bed end synchronously.
    Type: Application
    Filed: December 20, 2020
    Publication date: June 23, 2022
    Inventor: Pei-Yu Hsu
  • Publication number: 20220187149
    Abstract: A spindle shaft device including a shaft, a first torque sensor, and a second torque sensor. The shaft extends along an axial direction and comprises a first side portion, a second side portion, and a central portion located between the first side portion and the second side portion. The central portion has a central torsional rigidity with respect to the axial direction. The first side portion has a first torsional rigidity with respect to the axial direction. The second side portion has a second torsional rigidity with respect to the axial direction. The first torsional rigidity is smaller than the central torsional rigidity. The second torsional rigidity is smaller than the central torsional rigidity. The first torque sensor is disposed on the first side portion. The second torque sensor is disposed on the second side portion.
    Type: Application
    Filed: April 19, 2021
    Publication date: June 16, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chien-Nan YEH, Pei-Yu CHANG, Shih-Ting LIN, Chao-Ta HUANG
  • Publication number: 20220176372
    Abstract: A cartridge for a bioreactor adapted for accommodating a plurality of objects includes a cartridge main body defining a plurality of spaced-apart accommodating slots for respectively accommodating the objects therein. The cartridge main body includes a retaining portion extending into at least one of the accommodating slots, and adapted to retain a corresponding one of the objects in a corresponding one of the accommodating slots. The retaining portion is pushable to move resiliently in the corresponding one of the accommodating slots.
    Type: Application
    Filed: March 31, 2021
    Publication date: June 9, 2022
    Applicant: GENEREACH BIOTECHNOLOGY CORPORATION
    Inventors: Wen-Shan YANG, Ching-Ko LIN, Chia-Lin HSU, Fu-Chun LI, Pin-Hsing CHOU, Yun-Lung TSAI, Pei-Yu LEE, Hsiao-Fen CHANG
  • Patent number: 11356246
    Abstract: The application discloses a data analysis system and a data analysis method. The data analysis system includes a data provider host and a data analysis host. The data provider host is configured to perform a stream cipher algorithm based on raw data to obtain first data. The data analysis host is configured to perform a data analysis based on the first data to obtain an analysis result. The data provider host or the data analysis host is further configured to perform a block cipher algorithm based on the analysis result to obtain second data, and send the second data to an external device. The data provider host is further configured to calculate an attribute-value correspondence between the raw data and the second data, and send the attribute-value correspondence to the external device.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: June 7, 2022
    Assignee: PEGATRON CORPORATION
    Inventors: Wei-Cheng Lin, Pei-Yu Chen, Jia-Shiung Yang
  • Patent number: 11351553
    Abstract: Provided is a heating mechanism for a biochemical reaction device, including: a heat-conducting body including: at least one accommodating groove each including a chamber and an opening communicating with the chamber; a clamping hole, in communication with the opening and for inserting a reaction tube; and at least one heat-conducting block, movably disposed in the chamber and having one end connected with an elastic element and another opposite end provided with an abutting portion, the elastic element enabling the abutting portion of the heat-conducting block to protrude from the opening and locate in the clamping hole; and a temperature control element connected to the heat-conducting body for heating and regulating a temperature of the heat-conducting block.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: June 7, 2022
    Assignee: GENEREACH BIOTECHNOLOGY CORP.
    Inventors: Chun-Ming Lee, Ching-Ko Lin, Yun-Lung Tsai, Pei-Yu Lee, Chen Su, Hsiao-Fen Chang, Fu-Chun Li
  • Publication number: 20220165885
    Abstract: In an embodiment, a device includes: a first interconnect structure including metallization patterns; a second interconnect structure including a power rail; a device layer between the first interconnect structure and the second interconnect structure, the device layer including a first transistor, the first transistor including an epitaxial source/drain region; and a conductive via extending through the device layer, the conductive via connecting the power rail to the metallization patterns, the conductive via contacting the epitaxial source/drain region.
    Type: Application
    Filed: February 14, 2022
    Publication date: May 26, 2022
    Inventors: Yi-Bo Liao, Yu-Xuan Huang, Pei-Yu Wang, Cheng-Ting Chung, Ching-Wei Tsai, Hou-Yu Chen
  • Publication number: 20220163876
    Abstract: A color wheel module and a projector are provided. The projector includes the color wheel module, and the color wheel module includes a disk, an isolation framework, an assembly member, and a colloidal filler. The disk is configured to rotate around an axis. The isolation framework and the assembly member are disposed on the disk. The isolation framework is located between the disk and the assembly member. An air layer is formed between the assembly member and the isolation framework. The colloidal filler is disposed on the assembly member.
    Type: Application
    Filed: November 9, 2021
    Publication date: May 26, 2022
    Applicant: Coretronic Corporation
    Inventor: Pei-Yu Hsu