Grooves formed around a semiconductor device on a circuit board

- Nitto Denko Corporation
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Description

FIG. 1 shows a plan view of the grooves formed around a semiconductor on a circuit board showing the design according to the invention.

FIG. 2 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1.

FIG. 3 shows an enlarged sectional view along the line 3—3 in FIG. 2; and,

FIG. 4 shows an enlarged sectional view along the line 4—4 in FIG. 2.

The elements shown in broken lines and dash-dot-dash lines are for illustrative purposes only and form no part of the claimed invention.

Claims

The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.

Referenced Cited
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Patent History
Patent number: D584250
Type: Grant
Filed: Feb 15, 2008
Date of Patent: Jan 6, 2009
Assignee: Nitto Denko Corporation (Osaka)
Inventors: Emiko Tani (Osaka), Tetsuya Ohsawa (Osaka)
Primary Examiner: Selina Sikder
Attorney: Osha • Liang LLP
Application Number: 29/303,707