Abstract: An examination method comprises: generating a received audio signal according to sound generated from rotation of the fan by an audio receiving device; performing Fourier transform on the received audio signal to obtain a reference frequency domain signal; recognizing a plurality of characteristic bands according to the reference frequency domain signal; adjusting the received audio signal according to the characteristic bands respectively to form a plurality of casting audio signals corresponding to frequency components in the characteristic bands respectively; playing the casting signals sequentially by an audio casting device; and recognizing at least one key band among the characteristic bands according to the transmission rate of the hard drive upon playing the casting signals.

Abstract: A minimally invasive bone fracture positioning device includes a sleeve, a movable unit, and a support. The sleeve includes an alignment portion located on a longitudinal axis of the sleeve. The movable unit includes a positioning portion. The positioning portion is located on the longitudinal axis and is spaced from the alignment portion. The movable unit is mounted in a radial direction of the sleeve. The movable unit is slideable relative to the sleeve along the longitudinal axis. A support is coupled to the sleeve and the movable unit. The movable unit is spaced from the sleeve by the support.

Abstract: Systems and methods are provided for contact formation. A semiconductor structure is provided. The semiconductor structure includes an opening formed by a bottom surface and one or more side surfaces. A first conductive material is formed on the bottom surface and the one or more side surfaces to partially fill the opening, the first conductive material including a top portion and a bottom portion. Ion implantation is formed on the first conductive material, the top portion of the first conductive material being associated with a first ion density, the bottom portion of the first conductive material being associated with a second ion density lower than the first ion density. At least part of the top portion of the first conductive material is removed. A second conductive material is formed to fill the opening.

Abstract: According to an exemplary embodiment, a chip is provided. The chip includes a first vertical device having a first threshold and second vertical device having a second threshold. The first vertical device includes a first source; a first channel over the first source; a first drain over the first channel; a first conductive layer adjacent to the first channel; and a first gate adjacent to the first conductive layer. The second vertical device includes a second source; a second channel over the second source; a second drain over the second channel; a second conductive layer adjacent to the second channel; and a second gate adjacent to the second conductive layer.

Abstract: A mandibular fixation device overcomes the low operability of the conventional mandibular fixation device. The mandibular fixation device includes a sleeve, a first screw rod, a second screw rod and two positioning members. The sleeve includes two ends respectively provided with first and second screw holes. The first and second screw holes have opposite spiral directions. The first screw rod has a first threaded portion and a first assembly portion. The first threaded portion is threadedly engaged with the first screw hole, and the first assembly portion is located outside of the sleeve. The second screw rod has a second threaded portion and a second assembly portion. The second threaded portion is threadedly engaged with the second screw hole, and the second assembly portion is located outside of the sleeve. The two positioning members are coupled with the first and second assembly portions, respectively.

Abstract: A femur supporting device includes a femoral stem having a plurality of inclined passages. The femoral stem includes an inner side and an outer side. Each inclined passage includes an outlet in the inner side and an inlet in the outer side. Each inclined passage inclines upward from the inlet to the outlet. A plurality of supporting rods extends through the inclined passages. A first engaging end of each supporting rod extends out of the outlet of one of the inclined passages. A second engaging end of each supporting rod extends out of the inlet of one of the inclined passages. The first engaging end of each supporting rod is engaged with one of a plurality of first engaging portions in a trochanter head. The second engaging end of each supporting rod is engaged with one of a plurality of second engaging portions of a fixing unit.

Abstract: A linking rod clamping mechanism for connecting a coaxial connector with a printed circuit board includes a fine adjustment assembly that includes a cam and a screw to link with each other, an elastic assembly, and a connecting rod assembly consisting of at least two rectangular bodies. The positioning is achieved in a push manner by pushing the rotating handle down or lifting the rotating handle up, providing a stable structure, reliable operation, simple and quick operation. The linking rod clamping mechanism not only exerts an even force but also can determine the yield and decrease the adjustment time greatly. Furthermore, after the fine adjustment assembly is adjusted, the printed circuit board is clamped for performing a test. The same printed circuit boards in thickness can be quickly replaced and reused, thereby improving the yield and increasing the error tolerance.

Abstract: A liquid-crystal antenna apparatus is provided. The liquid-crystal antenna apparatus includes: a liquid-crystal antenna unit and a control unit. The liquid-crystal antenna unit is configured to receive a wireless signal. The liquid-crystal antenna unit includes a plurality of microwave elements, and each of the microwave elements includes a first electrode, a second electrode opposite to the first electrode, and a liquid-crystal cell disposed between the first electrode and the second electrode. The control unit is electrically connected to the liquid-crystal antenna unit, and is configured to control the liquid-crystal antenna unit to form a first beam having a first direction. The control unit determines a source orientation of the wireless signal according to the wireless signal received by the liquid-crystal antenna unit, and controls the first direction of the first beam to direct toward the source orientation.

Abstract: A power connector includes housing, partition plate, first and second pins, first and second wires and filler. The housing has an interior space, first and second slots. The partition plate divides the interior space into first and second wire channels. Each first and second pin has an inserting portion and a wire connecting portion. The wire connecting portions of the first and second pins are respectively located in the first and second wire channels. The first and the second wires are respectively located in the first and second wire channels. The first and second wires are electrically connected to the wire connecting portions of the first and the second pins respectively. A material of the filler is different from the housing. The filler is filled in the interior space to enclose and separate the first wires and the second wires.

Abstract: A method includes forming a gate stack over a semiconductor region, depositing an impurity layer over the semiconductor region, and depositing a metal layer over the impurity layer. An annealing is then performed, wherein the elements in the impurity layer are diffused into a portion of the semiconductor region by the annealing to form a source/drain region, and wherein the metal layer reacts with a surface layer of the portion of the semiconductor region to form a source/drain silicide region over the source/drain region.

Abstract: According to an exemplary embodiment, a method of forming an isolation layer is provided. The method includes the following operations: providing a substrate; providing a vertical structure having a first layer over the substrate; providing a first interlayer dielectric over the first layer; performing CMP on the first interlayer dielectric; and etching back the first interlayer dielectric and the first layer to form the isolation layer corresponding to a source of the vertical structure.

Abstract: A light emitting diode including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode, and a Bragg reflector structure. The emitting layer is configured to emit a light beam and is located between the first-type semiconductor layer and the second-type semiconductor layer. The light beam has a peak wavelength in a light emitting wavelength range. The first-type semiconductor layer, the emitting layer, and the second-type semiconductor layer are located on a same side of the Bragg reflector structure. A reflectance of the Bragg reflector structure is greater than or equal to 95% in a reflective wavelength range at least covering 0.8X nm to 1.8X nm, and X is the peak wavelength of the light emitting wavelength range.

Abstract: The invention provides an LED including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode, a Bragg reflector structure, a conductive layer and insulation patterns. The first electrode and the second electrode are located on the same side of the Bragg reflector structure. The conductive layer is disposed between the Bragg reflector structure and the second-type semiconductor layer. The insulation patterns are disposed between the conductive layer and the second-type semiconductor layer. Each insulating layer has a first surface facing toward the second-type semiconductor layer, a second surface facing away from the second-type semiconductor layer, and an inclined surface. The inclined surface connects the first surface and the second surface and is inclined with respect to the first surface and the second surface.

Abstract: Provided is a light emitting diode (LED) mounted on a carrier substrate and including a semiconductor epitaxial structure and at least one electrode pad structure. The semiconductor epitaxial structure is electrically connected to the carrier substrate. The electrode pad structure includes a eutectic layer, a barrier layer and a ductility layer. The eutectic layer is adapted for eutectic bonding to the carrier substrate. The barrier layer is between the eutectic layer and the semiconductor epitaxial structure. The barrier layer blocks the diffusion of the material of the eutectic layer in the eutectic bonding process. The ductility layer is between the eutectic layer and the semiconductor epitaxial structure. The ductility layer reduces the stress on the LED produced by thermal expansion and contraction of the substrate during the eutectic bonding process, so as to prevent the electrode pad structure from cracking, and maintain the quality of the LED.

Abstract: According to an exemplary embodiment, a method of forming a vertical structure with at least two barrier layers is provided. The method includes the following operations: providing a substrate; providing a vertical structure over the substrate; providing a first barrier layer over a source, a channel, and a drain of the vertical structure; and providing a second barrier layer over a gate and the drain of the vertical structure.

Abstract: A light emitting diode including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode, and a Bragg reflector structure. The emitting layer is configured to emit a light beam and is located between the first-type semiconductor layer and the second-type semiconductor layer. The light beam has a peak wavelength in a light emitting wavelength range. The first-type semiconductor layer, the emitting layer, and the second-type semiconductor layer are located on a same side of the Bragg reflector structure. A reflectance of the Bragg reflector structure is greater than or equal to 95% in a reflective wavelength range at least covering 0.8X nm to 1.8X nm, and X is the peak wavelength of the light emitting wavelength range.

Abstract: Systems and methods are provided for fabricating nanowire devices on a substrate. A first nanowire and a second nanowire are formed on a substrate, the first nanowire and the second nanowire extending substantially vertically relative to the substrate. A first source region and a first drain region are formed with n-type dopants, the first nanowire being disposed between the first source region and the first drain region. A second source region and a second drain region are formed with p-type dopants, the second nanowire being disposed between the second source region and the second drain region.

Abstract: An electronic device and a method for detecting a malicious file are provided. The method includes the following steps: An executable file is searched, and an import table is extracted from the executable file. The import table includes at least a name of a first DDL and a name of a second DDL. A distance between the first DLL and the second DLL is calculated. Whether the distance exceeds a threshold is determined. If the distance exceeds the threshold, then whether a duplicate content of the import table exists in the executable file is checked. The executable file is regarded as a malicious file if the duplicate content of the import table exists in the executable file.

Abstract: A mandibular fixation device is provided to overcome the low operability of the conventional mandibular fixation device. The mandibular fixation device includes a sleeve, a first screw rod, a second screw rod and two positioning members. The sleeve includes two ends respectively provided with first and second screw holes. The first and second screw holes have opposite spiral directions. The first screw rod has a first threaded portion and a first assembly portion. The first threaded portion is threadedly engaged with the first screw hole, and the first assembly portion is located outside of the sleeve. The second screw rod has a second threaded portion and a second assembly portion. The second threaded portion is threadedly engaged with the second screw hole, and the second assembly portion is located outside of the sleeve. The two positioning members are coupled with the first and second assembly portions, respectively.

Abstract: An exhaust system includes an inlet configured to receive an exhaust mixture. The exhaust system further includes an exhaust line connected to the inlet. The exhaust system further includes an oscillating assembly connected to the exhaust line. The exhaust system further includes a by-pass line connected to the exhaust line. The exhaust system further includes a feedback path extending from an external gas source to the oscillating assembly, wherein the feedback path is separate from the exhaust line.