Patents by Inventor Wei Peng

Wei Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230367950
    Abstract: A complementary field effect transistor (CFET) structure includes a vertical stack of first and second transistors, wherein the first transistor includes a first channel extending in a first direction from a first source/drain (S/D) region to a second S/D region through a gate extending in a second direction perpendicular to the first direction and the second transistor includes a second channel extending in the first direction from a third S/D region to a fourth S/D region through the gate. A first conductive trace extends in the first direction over the gate, a first via extends from the first S/D region to the first conductive trace and is aligned with the third S/D region along the second direction, a second via extends from the fourth S/D region to the first conductive trace, and the first via has a first height greater than a second height of the second via.
    Type: Application
    Filed: July 25, 2023
    Publication date: November 16, 2023
    Inventors: Shih-Wei PENG, Jiann-Tyng TZENG, Wei-Cheng LIN
  • Patent number: 11817392
    Abstract: An integrated circuit is disclosed. The integrated circuit includes conductive rails, signal rails, at least one first via, and at least one first conductive segment. The at least one first via is disposed between the first conductive layer and the second conductive layer, and couples a first signal rail of the signal rails to at least one of the conductive rails. The first signal rail is configured to transmit a supply signal through the at least one first via and the at least one of the conductive rails to at least one element of the integrated circuit. The at least one first conductive segment is disposed between the first conductive layer and the second conductive layer. The at least one first conductive segment is coupled to the at least one of the conductive rails and is separate from the first signal rail.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: November 14, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Wei Peng, Chia-Tien Wu, Jiann-Tyng Tzeng
  • Publication number: 20230357740
    Abstract: The present invention relates to compositions comprising polypeptides having xylanase activity and polypeptides having arabinofuranosidase activity for use in, e.g., animal feed. The present invention further relates to polypeptides having arabinofuranosidase activity, polypeptides having xylanase activity and polynucleotides encoding the polypeptides. The invention also relates to nucleic acid constructs, vectors, and host cells comprising the polynucleotides as well as methods of producing and using the polypeptides.
    Type: Application
    Filed: June 8, 2023
    Publication date: November 9, 2023
    Applicant: NOVOZYMES A/S
    Inventors: Ninfa Rangel Pedersen, Dan Pettersson, Jens Magnus Eklof, Soeren Nymand-Grarup, Lorena Gonzalez Palmen, Rune Nygaard Monrad, Wei Peng, Nikolaj Spodsberg, Mary Ann Stringer, Charlotte Blom, Lars Kiemer, Kristian Krogh, Jesper Salomon
  • Patent number: 11810949
    Abstract: A method of forming a semiconductor arrangement includes forming a first source pad over a semiconductor layer. A first nanosheet is formed contacting the first source pad. A gate pad is formed adjacent the first nanosheet. A first drain pad is formed over the gate pad and contacting the first nanosheet. A backside interconnect line is formed under the gate pad and the first source pad. A first backside contact is formed contacting at least one of the backside interconnect line, the first source pad, or the gate pad.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: November 7, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Shih-Wei Peng, Jiann-Tyng Tzeng
  • Publication number: 20230354572
    Abstract: A memory device is provided. The memory device includes first and second pull-up transistors. The first pull-up transistor is disposed over a semiconductor substrate, and including a first gate structure and two first source/drain structures at opposite sides of the first gate structure. The second pull-up transistor is laterally spaced apart from the first pull-up transistor, and including a second gate structure and two second source/drain structures at opposite sides of the second gate structure. The first and second gate structures extend along a first direction and laterally spaced apart from each other along a second direction intersected with the first direction. The first gate structure further extends along a sidewall of one of the second source/drain structures, and the second gate structure further extends along a sidewall of one of the first source/drain structures.
    Type: Application
    Filed: June 26, 2023
    Publication date: November 2, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Te-Hsin Chiu, Jiann-Tyng Tzeng, Shih-Wei Peng, Wei-An Lai
  • Publication number: 20230352339
    Abstract: A method includes doping a region through a first surface of a semiconductor substrate; forming a plurality of doped structures within the semiconductor substrate, wherein each of the plurality of doped structures extends along a vertical direction and is in contact with the doped region; forming a plurality of transistors over the first surface, wherein each of the transistors comprises one or more source/drain structures electrically coupled to the doped region through a corresponding one of the doped structures; forming a plurality of interconnect structures over the first surface, wherein each of the interconnect structures is electrically coupled to at least one of the transistors; and testing electrical connections between the interconnect structures and the transistors based on detecting signals present on the doped region through a second surface of the semiconductor substrate, the second surface opposite to the first surface.
    Type: Application
    Filed: June 29, 2023
    Publication date: November 2, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Te-Hsin Chiu, Shih-Wei Peng, Wei-An Lai, Jiann-Tyng Tzeng
  • Publication number: 20230352628
    Abstract: According to the disclosure, the light emitting device includes a substrate, a semiconductor structure, a first electrode unit, a second electrode unit, a plurality of micro elements. The substrate has a first surface and a second surface opposite to the first surface. The semiconductor structure located on top of the first surface of the substrate, and has a first semiconductor layer, an active layer, and a second semiconductor layer that are stacked sequentially. The first electrode unit is electrically connected to the first semiconductor layer. The second electrode unit is electrically connected to the second semiconductor layer. The plurality of micro elements are located on the second surface of the substrate. Each of the micro elements has a base that is protrusion that has a base diameter ranging from 400 nm to 1000 nm.
    Type: Application
    Filed: April 21, 2023
    Publication date: November 2, 2023
    Inventors: Bin JIANG, Yashu ZANG, Chung-Ying CHANG, Kang-Wei PENG, Sihe CHEN, Gong CHEN, Weichun TSENG, Ming-Chun TSENG, Siyi LONG
  • Publication number: 20230352633
    Abstract: A light-emitting diode (LED) includes a light-transmissive substrate having a first surface, an epitaxial structure disposed on the first surface, an insulation structure, and first and second electrodes. The epitaxial structure has an upper surface opposite to the first surface, and a side wall interconnecting the upper surface and the first surface. The insulation structure includes a first insulation layer covering the side wall and the upper surface, and a second insulation layer covering a portion of the first surface that is exposed from the epitaxial structure and the first insulation layer. The first insulation layer is formed with first and second holes through which the first and second electrodes are electrically connected to the epitaxial structure. The second insulation layer is formed with an opening. The insulation structure is made of at least one material selected from silicon oxide, silicon nitride, magnesium fluoride, Al2O3, TiO2 and Ti2O5.
    Type: Application
    Filed: July 7, 2023
    Publication date: November 2, 2023
    Inventors: Feng WANG, Zhanggen XIA, Yu ZHAN, En-song NIE, Anhe HE, Kang-Wei PENG, Su-Hui LIN
  • Publication number: 20230342535
    Abstract: An integrated circuit includes a first power rail, a first signal line, a first transistor and a second transistor. The first power rail is on a back-side of a substrate and is configured to supply a first supply voltage. The first signal line is on the back-side of the substrate and is separated from the first power rail. The first transistor has a first active region is in a front-side of the substrate. The first active region is overlapped by the first power rail and is electrically coupled to the first power rail. The second transistor has a second active region that is in the front-side of the substrate. The second active region is separated from the first active region, is overlapped by the first signal line, and is configured to receive the first supply voltage of the first power rail through the first active region of the first transistor.
    Type: Application
    Filed: June 12, 2023
    Publication date: October 26, 2023
    Inventors: Shih-Wei PENG, Te-Hsin CHIU, Jiann-Tyng TZENG
  • Publication number: 20230343708
    Abstract: A semiconductor device, including: a transistor layer, including a first active region configured to be a source/drain terminal of a first transistor and a second active region configured to be a source/drain terminal of a second transistor; a dielectric layer, disposed on the source/drain terminals of the first and second transistors; a conductive strip, included in the dielectric layer and extending from the first active region toward the second active region for signal connection.
    Type: Application
    Filed: June 27, 2023
    Publication date: October 26, 2023
    Inventors: SHIH-WEI PENG, WEI-CHENG LIN, JIANN-TYNG TZENG
  • Publication number: 20230342224
    Abstract: A document management system processes application programming interface (API) requests received from entities. The document management system processes the API requests to perform operations such as modifying a document, executing a document, or sending a set of documents to another entity. The document management system enforces API limits on API requests received from entities and processed by the document management system. The document management system allows an entity to request a modification to an API limit to a target API limit and determines whether to approve the requested modification. The document management system determines whether to approve the requested API limits based on a comparison with other entities that are similar to the entity based on past API requests received from the other entities.
    Type: Application
    Filed: April 25, 2022
    Publication date: October 26, 2023
    Inventors: Joey Jia Wei Peng, Abhishek Ram Battepati, Timofei Borisovich Bolshakov
  • Patent number: 11793849
    Abstract: Disclosed is a new drug application of a Pithecellobium Clypearia Benth Extract (EA), and particularly is a method of the EA used for treating multiple diseases caused by drug resistant bacteria infection. Related drug resistant bacteria include a Multi-Drug Resistant (MDR) Acinetobacter Baumannii (MDRAB), an MDR Pseudomonas Aeruginosa (MDRPA), an Extended-Spectrum Beta-Lactamase (ESBL) producing Escherichia Coli (ECO) and an ESBL-producing Klebsiella Pneumonia (KPN).
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: October 24, 2023
    Assignee: SUN YAT-SEN UNIVERSITY
    Inventors: Weiwei Su, Chong Liu, Qian Zhou, Peibo Li, Wei Peng, Yonggang Wang
  • Patent number: 11797745
    Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a first conductive pattern disposed within a first region from a top view perspective and extending along a first direction, a first phase shift circuit disposed within the first region, a first transmission circuit disposed within a second region from the top view perspective, and a first gate conductor extending from the first region to the second region along a second direction perpendicular to the first direction. The first phase shift circuit and the first transmission circuit are electrically connected with the first conductive pattern through the first gate conductor.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: October 24, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Wei Peng, Ching-Yu Huang, Jiann-Tyng Tzeng
  • Patent number: 11788079
    Abstract: The present invention relates to compositions comprising polypeptides having xylanase activity and polypeptides having arabinofuranosidase activity for use in, e.g., animal feed. The present invention further relates to polypeptides having arabinofuranosidase activity, polypeptides having xylanase activity and polynucleotides encoding the polypeptides. The invention also relates to nucleic acid constructs, vectors, and host cells comprising the polynucleotides as well as methods of producing and using the polypeptides.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: October 17, 2023
    Assignee: Novozymes A/S
    Inventors: Ninfa Rangel Pedersen, Dan Pettersson, Jens Magnus Eklof, Soeren Nymand-Grarup, Lorena Gonzalez Palmen, Rune Nygaard Monrad, Wei Peng, Nikolaj Spodsberg, Mary Ann Stringer, Charlotte Blom, Lars Kiemer, Kristian Bertel Romer M. Krogh, Jesper Salomon
  • Publication number: 20230325669
    Abstract: In one aspect, a method includes obtaining videos and for each video: obtaining a set of anchors for the video, each anchor beginning at the playback time and including anchor text; identifying, from text generated from audio of the video, a set of entities specified in the text, wherein each entity in the set of entities is associated with a times stamp at which the entity is mentioned; determining, by a language model and from the text generated from the audio of the video, an importance value for each entity; for a subset of the videos, receiving rater data that describes, for each anchor, the accuracy of the anchor text in describing subject matter of the video; and training, using the human rater data, the importance values, the text, and the set of entities, an anchor model that predicts an entity label for an anchor for a video.
    Type: Application
    Filed: June 14, 2023
    Publication date: October 12, 2023
    Inventors: Gabe Culbertson, Wei Peng, Nicolas Crowell
  • Publication number: 20230326741
    Abstract: A method of manufacturing a semiconductor device, including: providing a substrate including a first cell and a second cell; forming a plurality of first metal strips on a first plane; forming a first trench over a boundary between the first cell and the second cell, wherein a bottom surface of the first trench is located on a second plane over the first plane; filling the first trench with a nonconductive material, resulting in a separating wall; and forming a plurality of second metal strips on a third plane over the second plane, wherein the plurality of second metal strips comprise a first second metal strip and a second second metal strip separated from each other by the separating wall.
    Type: Application
    Filed: June 8, 2023
    Publication date: October 12, 2023
    Inventors: SHIH-WEI PENG, CHIA-TIEN WU, JIANN-TYNG TZENG
  • Patent number: 11784179
    Abstract: A layout method and a layout system are disclosed. The layout method includes generating a design data comprising an electronic circuit, and generating a design layout by placing a first cell corresponding to the electronic circuit. The first cell includes a first source/drain region, a second source/drain region and a gate electrode, wherein the gate electrode define an odd-numbered track and an even-numbered track. The first cell also includes a first power rail, a first conductive via within the odd-numbered track, a second power rail and a second conductive via within the even-numbered track. The first source/drain region is electrically connected to the first power rail through the first conducive via, and the second source/drain region is electrically connected to the second power rail through the second conducive via.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: October 10, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Shih-Wei Peng, Jiann-Tyng Tzeng
  • Patent number: 11783109
    Abstract: A method of forming an IC device includes creating a recess by removing at least a portion of a channel of a first transistor and a portion of a gate electrode, the gate electrode being common to the first transistor and an underlying second transistor. The method includes filling the recess with a dielectric material to form an isolation layer, and constructing a slot via overlying the isolation layer.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: October 10, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Wei Peng, Guo-Huei Wu, Wei-Cheng Lin, Hui-Zhong Zhuang, Jiann-Tyng Tzeng
  • Publication number: 20230315442
    Abstract: According to an aspect of an embodiment, operations include receiving, as an output of a code generation tool, a file that includes a computer-executable code and a non-executable description. The operations further include modifying blocks of the computer-executable code into modular code blocks and determining a set of trigger conditions from the modified computer-executable code and the non-executable description. The operations further include matching the set of trigger conditions with template conditions in a set of revision rules and determining, based on the match, a set of changes applicable to portions of the modified computer-executable code and the non-executable description. The operations further include updating the modified computer-executable code and the non-executable description based on the set of changes and generating a tutorial-style code file that includes the updated computer-executable code and the updated non-executable description.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Applicant: FUJITSU LIMITED
    Inventors: Mehdi BAHRAMI, Wei-Peng CHEN
  • Publication number: 20230317888
    Abstract: A light emitting device includes a semiconductor stack, and an insulating layer partially covering the semiconductor stack. The semiconductor stack includes a first conductivity type semiconductor layer, a light emitting layer and a second conductivity type semiconductor layer that are stacked in sequence. A reflective layer is disposed in the insulating layer, and includes a metal reflective layer and an anti-oxidation layer stacked one on top of the other. A light emitting apparatus is also disclosed.
    Type: Application
    Filed: February 24, 2023
    Publication date: October 5, 2023
    Inventors: Ming-Chun TSENG, Kang-Wei PENG, Su-Hui LIN, Chung-Ying CHANG