Patents by Inventor Wen Chou

Wen Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LADDER STRAP STRUCTURE INSTALLABLE ON HIGH/LOW RAIL
    Publication number: 20190145162
    Abstract: A ladder strap structure installable on high/low rail includes two vertical straps, multiple horizontal straps and a polygonal control drum. Multiple perforations are formed on the vertical straps at equal intervals. A securing bolt is passed through the perforations of the vertical straps to secure the ladder strap on the polygonal control drum. By means of selecting the perforations positioned at different heights, the ladder strap can be secured on the polygonal control drum according to the height of the high/low blind rails so that the application range of the ladder strap is widened.
    Type: Application
    Filed: July 10, 2018
    Publication date: May 16, 2019
    Inventor: Tser Wen CHOU
  • RADAR MODULE INCORPORATED WITH A PATTERN-SHAPING DEVICE
    Publication number: 20190129023
    Abstract: A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.
    Type: Application
    Filed: September 27, 2018
    Publication date: May 2, 2019
    Inventors: Yen-Ju Lu, Chih-Ming Hung, Wen-Chou Wu
  • ANTENNA-IN-PACKAGE WITH BETTER ANTENNA PERFORMANCE
    Publication number: 20190131690
    Abstract: An Antenna-in-Package (AiP) includes an interface layer, an integrated circuit die disposed on the interface layer, a molding compound disposed on the interface layer and encapsulating the integrated circuit die, and a plurality of solder balls disposed on a bottom surface of the interface layer. The interface layer includes an antenna layer, and an insulating layer between the antenna layer and the ground reflector layer. The antenna layer includes a first antenna region and a second antenna region spaced apart from the first antenna region. The integrated circuit die is interposed between the first antenna region and the second antenna region. The first antenna region is disposed adjacent to a first edge of the integrated circuit die, and the second antenna region is disposed adjacent to a second edge of the integrated circuit die, which is opposite to the first edge.
    Type: Application
    Filed: September 27, 2018
    Publication date: May 2, 2019
    Inventors: Yen-Ju Lu, Wen-Chou Wu
  • ANTENNA-IN-PACKAGE WITH FREQUENCY-SELECTIVE SURFACE STRUCTURE
    Publication number: 20190115646
    Abstract: A semiconductor package includes a substrate having thereon at least an antenna layer and a ground reflector layer under the antenna layer, a radio frequency (RF) die disposed on or in the substrate, an encapsulation layer disposed on the antenna layer of the substrate, and a frequency-selective surface (FSS) structure disposed on the encapsulation layer. The FSS structure is a two-dimensional periodic array of metal patterns of same shape and size. The FSS structure has highly reflective characteristic.
    Type: Application
    Filed: September 3, 2018
    Publication date: April 18, 2019
    Inventors: Shih-Chia Chiu, Yen-Ju Lu, Wen-Chou Wu, Nan-Cheng Chen
  • Blind co-used sheet
    Patent number: 10253562
    Abstract: A blind co-used sheet includes a vertical first blind sheet, a vertical second blind sheet, transverse double-layered blind sheets sown between the first and second blind sheets and fixing plate assemblies for securely holding front ends of the transverse double-layered blind sheets. The transverse double-layered blind sheets can be turned from a transverse state into a vertical state and used as a vertical blind. Alternatively, the transverse double-layered blind sheets can be 90-degree turned back from the vertical state into the transverse state and used as a Shangri-la blind. Two sides of the transverse double-layered blind sheet have upward and downward extending sunshade sections, which can overlap each other. A sunshade sheet is disposed in the transverse double-layered blind sheet to locate the blind sheets.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: April 9, 2019
    Inventor: Tser Wen Chou
  • POWER SUPPLY MODULE WITH ENHANCED HEAT DISSIPATION EFFECT
    Publication number: 20190075679
    Abstract: A power supply module with enhanced heat dissipation effect includes a rack including an opening and an accommodating room connected to the opening, as well as at least one power supply including a fitting section inserted from the opening while positioned within the accommodating room, and a heat dissipation section extending toward the outside of the opening from the opening, in which the power supply is formed in the heat dissipation section with a plurality of heat dissipation holes, in such a way that air is capable of entering the power supply from an output end to form heat convection together with the dissipation holes, so as to form a heat dissipation effect with respect to the power supply.
    Type: Application
    Filed: September 6, 2017
    Publication date: March 7, 2019
    Inventors: Chin-Wen CHOU, Yung-Hsin HUANG, Yu-Yuan CHANG, Chun-Lung SU, Yung-Feng CHIU, Chih-Hao CHEN
  • OVER THE AIR WIRELESS TEST SYSTEM FOR TESTING MICROELECTRONIC DEVICES INTEGRATED WITH ANTENNA
    Publication number: 20190068300
    Abstract: An over-the-air (OTA) wireless test system includes a container, a machine plate disposed on the container, a supporter disposed on the machine plate, a load board disposed on the supporter, a socket disposed on the load board, a device under test (DUT) installed in the socket, and a wave-guiding feature in the socket and the load board configured to pass and guide electromagnetic waves to and/or from an antenna structure of the DUT. The wave-guiding feature comprises a wave-guiding channel in the socket defined by a plurality of pogo pins surrounding the antenna structure of the DUT. The wave-guiding feature may further comprise a radiation passage in the load board defined by rows of via fence extending through an entire thickness of the load board.
    Type: Application
    Filed: August 7, 2018
    Publication date: February 28, 2019
    Inventors: Yen-Ju Lu, Chih-Ming Hung, Wen-Chou Wu, Nan-Cheng Chen
  • SEMICONDUCTOR PACKAGE
    Publication number: 20190051609
    Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure and a first antenna layer. The first antenna layer is formed on at least one of the first layer structure and the second layer structure. The first layer structure is formed between the first substrate and the second layer structure.
    Type: Application
    Filed: October 18, 2018
    Publication date: February 14, 2019
    Inventors: Wen-Sung HSU, Tao CHENG, Nan-Cheng CHEN, Che-Ya CHOU, Wen-Chou WU, Yen-Ju LU, Chih-Ming HUNG, Wei-Hsiu HSU
  • Universal omni adaptor
    Patent number: 10174549
    Abstract: A universal omni adaptor includes a connection board as a main body. The connection board includes a board main body, a first connection section and a second connection section. The board main body is for installing a blind assembly thereunder. The board main body is formed with several breakage slits, whereby the connection board can be broken along one of the breakage slits to shorten the length in adaptation to different sizes of windows, whereby the blind can be installed on different sizes of windows. The first and second connection sections are formed with toothed stripes at different heights, whereby the decorative panel can be selectively assembled in a higher position or a lower position for installation on different sizes of windows to speed the installation of the blind assembly.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: January 8, 2019
    Inventor: Tser Wen Chou
  • Electric window cleaning device
    Patent number: 10165911
    Abstract: An electric window cleaning device includes an operating portion and a wiping portion which are attracted to both sides of a glass of a window by magnets, and are free to move along the glass by virtue of balls. The wiping portion includes a power mechanism and a power supply device. The power mechanism includes an output shaft, a rotary disc and a duster removably fixed to the rotary disc. The power device includes a switch and a battery which are electrically connected to the power mechanism. When the power mechanism is turned on, the output shaft rotates the rotary disc and the duster to clean the outer surface of the glass, as an user moves the operating portion which is attracted to the inner surface of the glass, the wiping portion will also move along the outer surface of the glass to perform cleaning operation.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: January 1, 2019
    Inventor: Wen Chou Chen
  • SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE
    Publication number: 20180358685
    Abstract: One embodiment of the present disclosure provides a semiconductor package including a bottom chip package having a first side and a second side opposing the first side, and a top antenna package mounted on the first side of the bottom chip package. The bottom chip package further includes a semiconductor chip. The semiconductor chip may include a RFIC chip. The top antenna package has at least one radiative antenna element.
    Type: Application
    Filed: May 9, 2018
    Publication date: December 13, 2018
    Inventors: Fu-Yi Han, Che-Ya Chou, Che-Hung Kuo, Wen-Chou Wu, Nan-Cheng Chen
  • MICROELECTRONIC ASSEMBLY WITH ELECTROMAGNETIC SHIELDING
    Publication number: 20180350751
    Abstract: A microelectronic assembly includes a substrate and a first microelectronic component mounted on the substrate. The first microelectronic component includes a digital/analog IP block and a RF IP block. A shielding case is mounted on the substrate. The shielding case includes a plurality of sidewalls, one intermediate wall, and a lid. A thermal interface material (TIM) layer is situated between the lid and the first microelectronic component. A noise suppressing structure is interposed between the TIM layer and the first microelectronic component.
    Type: Application
    Filed: May 8, 2018
    Publication date: December 6, 2018
    Inventors: Ruey-Bo Sun, Wen-Chou Wu
  • UNLOCKING METHOD AND ELECTRONIC DEVICE
    Publication number: 20180341764
    Abstract: An unlocking method and an electronic device are provided. The electronic device stores a predetermined color sequence. The unlocking method is adapted for an electronic device having a display interface. The method includes: defining a plurality of blocks on the display interface; randomly allocating a plurality of colors to be displayed to the blocks; receiving locations of a plurality of tapping operations to generate a color sequence according to the colors displayed on the blocks which are tapped; comparing the color sequence with the predetermined color sequence; unlocking the electronic device if the color sequence is the same as the predetermined color sequence.
    Type: Application
    Filed: May 25, 2018
    Publication date: November 29, 2018
    Applicant: PEGATRON CORPORATION
    Inventor: Yu-Wen Chou
  • HORIZONTAL BLIND
    Publication number: 20180328108
    Abstract: A horizontal blind includes a fixing frame, more than one slat control unit and more than one cord winding unit. The fixing frame is mounted on an upper side of a window. The bottom section of the fixing frame has a connection face for connecting with the slat control unit. The slat control unit includes a fixing seat securely connected with the bottom section of the fixing frame and a controlling polygonal barrel received in the fixing seat. The controlling polygonal barrel is connected with a ladder belt to control the rotation of the slats into a horizontal state or a vertical state to shade the sunlight. The cord winding unit is disposed under the fixing seat, including a cord restriction seat, a cord reel passing through the cord restriction seat and a movable conic tube movably fitted on the cord reel for winding the pull cord thereon.
    Type: Application
    Filed: May 9, 2017
    Publication date: November 15, 2018
    Inventor: Tser Wen CHOU
  • TOUCH-CONTROLLED ASSEMBLY
    Publication number: 20180279969
    Abstract: A touch-controlled assembly adapted to an electronic device is provided. The electronic device has a front casing, a rear casing and a display surface, where the display surface is located on the front casing. The touch-controlled assembly includes a circuit board and at least one touch key. The circuit board is disposed between the front casing and the rear casing. The circuit board has at least one pad, which contacts one surface of the rear casing. The at least one touch key is disposed on another surface of the rear casing for corresponding to the at least one pad, where an orthogonal projection of the at least one touch key on the at least on pad is partially overlapped with the at least one pad.
    Type: Application
    Filed: June 3, 2017
    Publication date: October 4, 2018
    Applicant: CAL-COMP BIG DATA, INC.
    Inventor: Yi-Wen Chou
  • Semiconductor package assembly
    Patent number: 10068857
    Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a substrate, a semiconductor die, a base and a first inductor structure. The substrate has a die-attach surface and a solder-ball-attach surface opposite to the die-attach surface. The semiconductor die is mounted on the die-attach surface of the substrate. The semiconductor die includes a radio-frequency (RF) circuit and a first RF die pad electrically connected to the RF circuit. The base is mounted on the solder-ball-attach surface of the substrate. The first inductor structure is positioned on the substrate, the semiconductor die or the base. The first inductor structure includes a first terminal electrically connected to the first die pad and a second terminal electrically connected to a ground terminal.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: September 4, 2018
    Assignee: MEDIATEK INC.
    Inventors: Ruey-Bo Sun, Sheng-Mou Lin, Wen-Chou Wu
  • COUPLING REDUCTION METHOD FOR ANTENNAS IN PACKAGE
    Publication number: 20180248258
    Abstract: A Radio Frequency (RF) device may include a plurality of antennas and one or more conductive traces configured to trap a portion of energy transmitted from at least one of the plurality of antennas. The one or more conductive traces are sized and positioned such that undesired coupling between the plurality of antennas may be suppressed while maintaining performance parameters of at least one of the plurality of antennas. The plurality of antennas and the one or more conductive traces may be formed using a redistribution layer coupled to a chip embedded in a molding layer.
    Type: Application
    Filed: August 24, 2017
    Publication date: August 30, 2018
    Applicant: MediaTek Inc.
    Inventors: Yen-Ju Lu, Yi-Chieh Lin, Wen-Chou Wu
  • PLANTING POT AND PLANTING HOLDING PLATE
    Publication number: 20180184596
    Abstract: A planting pot includes a straight cylinder part and a diameter-enlarged part. The diameter-enlarged part has a first end and a second end. The first end is connected to the straight cylinder part. The second end is opposite to the first end. An outer diameter of the diameter-enlarged part is gradually increased in a direction from the first end to the second end. A planting holding plate includes a plate body and a plurality of planting pots. The planting pots are connected to the plate body, and the planting pots are arranged at intervals.
    Type: Application
    Filed: February 13, 2017
    Publication date: July 5, 2018
    Inventors: JUI-FANG LIANG, HUNG-WEN CHOU
  • Curtain
    Patent number: D843131
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: March 19, 2019
    Inventor: Tser Wen Chou
  • Power supply
    Patent number: D852151
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: June 25, 2019
    Assignee: ZIPPY TECHNOLOGY CORP.
    Inventors: Chin-Wen Chou, Yung-Hsin Huang, Yu-Yuan Chang, Yung-Feng Chiu, Chun-Lung Su, Chih-Hao Chen