Patents by Inventor Wen Chou

Wen Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE
    Publication number: 20190051609
    Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure and a first antenna layer. The first antenna layer is formed on at least one of the first layer structure and the second layer structure. The first layer structure is formed between the first substrate and the second layer structure.
    Type: Application
    Filed: October 18, 2018
    Publication date: February 14, 2019
    Inventors: Wen-Sung HSU, Tao CHENG, Nan-Cheng CHEN, Che-Ya CHOU, Wen-Chou WU, Yen-Ju LU, Chih-Ming HUNG, Wei-Hsiu HSU
  • Universal omni adaptor
    Patent number: 10174549
    Abstract: A universal omni adaptor includes a connection board as a main body. The connection board includes a board main body, a first connection section and a second connection section. The board main body is for installing a blind assembly thereunder. The board main body is formed with several breakage slits, whereby the connection board can be broken along one of the breakage slits to shorten the length in adaptation to different sizes of windows, whereby the blind can be installed on different sizes of windows. The first and second connection sections are formed with toothed stripes at different heights, whereby the decorative panel can be selectively assembled in a higher position or a lower position for installation on different sizes of windows to speed the installation of the blind assembly.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: January 8, 2019
    Inventor: Tser Wen Chou
  • Electric window cleaning device
    Patent number: 10165911
    Abstract: An electric window cleaning device includes an operating portion and a wiping portion which are attracted to both sides of a glass of a window by magnets, and are free to move along the glass by virtue of balls. The wiping portion includes a power mechanism and a power supply device. The power mechanism includes an output shaft, a rotary disc and a duster removably fixed to the rotary disc. The power device includes a switch and a battery which are electrically connected to the power mechanism. When the power mechanism is turned on, the output shaft rotates the rotary disc and the duster to clean the outer surface of the glass, as an user moves the operating portion which is attracted to the inner surface of the glass, the wiping portion will also move along the outer surface of the glass to perform cleaning operation.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: January 1, 2019
    Inventor: Wen Chou Chen
  • SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE
    Publication number: 20180358685
    Abstract: One embodiment of the present disclosure provides a semiconductor package including a bottom chip package having a first side and a second side opposing the first side, and a top antenna package mounted on the first side of the bottom chip package. The bottom chip package further includes a semiconductor chip. The semiconductor chip may include a RFIC chip. The top antenna package has at least one radiative antenna element.
    Type: Application
    Filed: May 9, 2018
    Publication date: December 13, 2018
    Inventors: Fu-Yi Han, Che-Ya Chou, Che-Hung Kuo, Wen-Chou Wu, Nan-Cheng Chen
  • MICROELECTRONIC ASSEMBLY WITH ELECTROMAGNETIC SHIELDING
    Publication number: 20180350751
    Abstract: A microelectronic assembly includes a substrate and a first microelectronic component mounted on the substrate. The first microelectronic component includes a digital/analog IP block and a RF IP block. A shielding case is mounted on the substrate. The shielding case includes a plurality of sidewalls, one intermediate wall, and a lid. A thermal interface material (TIM) layer is situated between the lid and the first microelectronic component. A noise suppressing structure is interposed between the TIM layer and the first microelectronic component.
    Type: Application
    Filed: May 8, 2018
    Publication date: December 6, 2018
    Inventors: Ruey-Bo Sun, Wen-Chou Wu
  • UNLOCKING METHOD AND ELECTRONIC DEVICE
    Publication number: 20180341764
    Abstract: An unlocking method and an electronic device are provided. The electronic device stores a predetermined color sequence. The unlocking method is adapted for an electronic device having a display interface. The method includes: defining a plurality of blocks on the display interface; randomly allocating a plurality of colors to be displayed to the blocks; receiving locations of a plurality of tapping operations to generate a color sequence according to the colors displayed on the blocks which are tapped; comparing the color sequence with the predetermined color sequence; unlocking the electronic device if the color sequence is the same as the predetermined color sequence.
    Type: Application
    Filed: May 25, 2018
    Publication date: November 29, 2018
    Applicant: PEGATRON CORPORATION
    Inventor: Yu-Wen Chou
  • HORIZONTAL BLIND
    Publication number: 20180328108
    Abstract: A horizontal blind includes a fixing frame, more than one slat control unit and more than one cord winding unit. The fixing frame is mounted on an upper side of a window. The bottom section of the fixing frame has a connection face for connecting with the slat control unit. The slat control unit includes a fixing seat securely connected with the bottom section of the fixing frame and a controlling polygonal barrel received in the fixing seat. The controlling polygonal barrel is connected with a ladder belt to control the rotation of the slats into a horizontal state or a vertical state to shade the sunlight. The cord winding unit is disposed under the fixing seat, including a cord restriction seat, a cord reel passing through the cord restriction seat and a movable conic tube movably fitted on the cord reel for winding the pull cord thereon.
    Type: Application
    Filed: May 9, 2017
    Publication date: November 15, 2018
    Inventor: Tser Wen CHOU
  • TOUCH-CONTROLLED ASSEMBLY
    Publication number: 20180279969
    Abstract: A touch-controlled assembly adapted to an electronic device is provided. The electronic device has a front casing, a rear casing and a display surface, where the display surface is located on the front casing. The touch-controlled assembly includes a circuit board and at least one touch key. The circuit board is disposed between the front casing and the rear casing. The circuit board has at least one pad, which contacts one surface of the rear casing. The at least one touch key is disposed on another surface of the rear casing for corresponding to the at least one pad, where an orthogonal projection of the at least one touch key on the at least on pad is partially overlapped with the at least one pad.
    Type: Application
    Filed: June 3, 2017
    Publication date: October 4, 2018
    Applicant: CAL-COMP BIG DATA, INC.
    Inventor: Yi-Wen Chou
  • Semiconductor package assembly
    Patent number: 10068857
    Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a substrate, a semiconductor die, a base and a first inductor structure. The substrate has a die-attach surface and a solder-ball-attach surface opposite to the die-attach surface. The semiconductor die is mounted on the die-attach surface of the substrate. The semiconductor die includes a radio-frequency (RF) circuit and a first RF die pad electrically connected to the RF circuit. The base is mounted on the solder-ball-attach surface of the substrate. The first inductor structure is positioned on the substrate, the semiconductor die or the base. The first inductor structure includes a first terminal electrically connected to the first die pad and a second terminal electrically connected to a ground terminal.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: September 4, 2018
    Assignee: MEDIATEK INC.
    Inventors: Ruey-Bo Sun, Sheng-Mou Lin, Wen-Chou Wu
  • COUPLING REDUCTION METHOD FOR ANTENNAS IN PACKAGE
    Publication number: 20180248258
    Abstract: A Radio Frequency (RF) device may include a plurality of antennas and one or more conductive traces configured to trap a portion of energy transmitted from at least one of the plurality of antennas. The one or more conductive traces are sized and positioned such that undesired coupling between the plurality of antennas may be suppressed while maintaining performance parameters of at least one of the plurality of antennas. The plurality of antennas and the one or more conductive traces may be formed using a redistribution layer coupled to a chip embedded in a molding layer.
    Type: Application
    Filed: August 24, 2017
    Publication date: August 30, 2018
    Applicant: MediaTek Inc.
    Inventors: Yen-Ju Lu, Yi-Chieh Lin, Wen-Chou Wu
  • PLANTING POT AND PLANTING HOLDING PLATE
    Publication number: 20180184596
    Abstract: A planting pot includes a straight cylinder part and a diameter-enlarged part. The diameter-enlarged part has a first end and a second end. The first end is connected to the straight cylinder part. The second end is opposite to the first end. An outer diameter of the diameter-enlarged part is gradually increased in a direction from the first end to the second end. A planting holding plate includes a plate body and a plurality of planting pots. The planting pots are connected to the plate body, and the planting pots are arranged at intervals.
    Type: Application
    Filed: February 13, 2017
    Publication date: July 5, 2018
    Inventors: JUI-FANG LIANG, HUNG-WEN CHOU
  • Multi-chip package structure manufacturing process and wafer level chip package structure manufacturing process
    Patent number: 10002815
    Abstract: A wafer level chip package manufacturing process is provided. A wafer includes a plurality of first chips and a circuit layer disposed on the first chips, wherein each of the first chips has a chip bonding region, a plurality of first inner pads located in the chip bonding region and a plurality of first outer pads located outside the chip bonding region, the circuit layer includes a plurality of insulating layers, the insulating layers have at least one groove, the groove is disposed between the first inner pads and the first outer pads, and the groove surrounds the first inner pads. A plurality of second chips are flipped on the chip bonding regions, so that second conductive bumps are located between and connected to the first inner pads and second pads of the second chips.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: June 19, 2018
    Assignee: ChipMOS Technologies Inc.
    Inventor: Shih-Wen Chou
  • Power supply for redundant power system
    Patent number: 9966794
    Abstract: A power supply for a redundant power system includes a housing, a first circuit board, a second circuit board and a cooling fan. The first and second circuit boards are sequentially disposed in the housing. The length of the first circuit board is smaller than that of the second circuit board. Between the first and second circuit boards is a gap. The first and second circuit boards are each distributed with multiple electronic elements, and are connected by at least one electrical connecting line. The electronic elements form a power supply circuit, in which a bridge rectification module is disposed on the first circuit board and close to the gap. The cooling fan is at least connected to the first circuit board and a second circuit board to locate in the gap, and directly provides the bridge rectification module with a first cooling air current when activated.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: May 8, 2018
    Assignee: ZIPPY TECHNOLOGY CORP.
    Inventors: Chin-Wen Chou, Yung-Hsin Huang, Yu-Yuan Chang, Tzung-Han Lee, Heng-Chia Chang
  • SEMICONDUCTOR PACKAGE ASSEMBLY
    Publication number: 20180122747
    Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a substrate, a semiconductor die, a base and a first inductor structure. The substrate has a die-attach surface and a solder-ball-attach surface opposite to the die-attach surface. The semiconductor die is mounted on the die-attach surface of the substrate. The semiconductor die includes a radio-frequency (RF) circuit and a first RF die pad electrically connected to the RF circuit. The base is mounted on the solder-ball-attach surface of the substrate. The first inductor structure is positioned on the substrate, the semiconductor die or the base. The first inductor structure includes a first terminal electrically connected to the first die pad and a second terminal electrically connected to a ground terminal.
    Type: Application
    Filed: October 26, 2017
    Publication date: May 3, 2018
    Inventors: Ruey-Bo Sun, Sheng-Mou Lin, Wen-Chou Wu
  • Manufacturing process of wafer level chip package structure having block structure
    Patent number: 9953960
    Abstract: A multi-chip package structure includes a first chip, at least one blocking structure, a plurality of first conductive bumps, a second chip, a plurality of second conductive bumps and an underfill. The first chip has a chip connecting zone, a plurality of first inner pads in the chip connecting zone and a plurality of first outer pads outside of the chip connecting zone. The blocking structure is disposed between the first inner pads and the first outer pads and surrounds the first inner pads. The first conductive bumps are disposed on the first outer pads. The second chip is flipped on the chip connecting zone and has a plurality of second pads. The second conductive bumps are disposed between the first inner pads and the second pads. The underfill is disposed between the first chip and the second chip so as to cover the second conductive bumps.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: April 24, 2018
    Assignee: ChipMOS Technologies Inc.
    Inventor: Shih-Wen Chou
  • COUPLING REDUCTION METHOD FOR ANTENNAS IN PACKAGE
    Publication number: 20180069307
    Abstract: A Radio Frequency (RF) device may include a plurality of antennas and one or more conductive traces configured to trap a portion of energy transmitted from at least one of the plurality of antennas. The one or more conductive traces are sized and positioned such that undesired coupling between the plurality of antennas may be suppressed while maintaining performance parameters of at least one of the plurality of antennas. The plurality of antennas and the one or more conductive traces may be formed using a redistribution layer coupled to a chip embedded in a molding layer.
    Type: Application
    Filed: August 24, 2017
    Publication date: March 8, 2018
    Applicant: MediaTek Inc.
    Inventors: Yen-Ju Lu, Yi-Chieh Lin, Wen-Chou Wu
  • SEMICONDUCTOR PACKAGE INTEGRATED WITH MEMORY DIE
    Publication number: 20180061786
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a package substrate. An integrated circuit (IC) die having a radio frequency (RF) circuit and a memory die are stacked over the package substrate. The memory die entirely covers a first surface portion of the package substrate to define a second surface portion of the package substrate exposed from the memory die, and the IC die partially covers the first surface portion and the second surface portion of the package substrate. The RF circuit includes a first sensitive device region corresponding to the second surface portion of the package substrate and a second sensitive device region corresponding to the first surface portion of the package substrate and offsetting a memory input/output (I/O) electrical path of the memory die, as viewed from a top-view perspective.
    Type: Application
    Filed: August 22, 2017
    Publication date: March 1, 2018
    Inventors: Sheng-Mou LIN, Chih-Chun HSU, Wen-Chou WU
  • Method and apparatus for determining silence time
    Patent number: 9894466
    Abstract: A transmission method comprises: connecting a first wireless device to a second wireless device; determining by the first wireless device whether a silence time is assigned to the second wireless device; setting a communication period with the second wireless device according to the assigned silence time if the silence time assigned to the second wireless device is recorded in the first wireless device; and determining by the first wireless device the silence time according to a traffic transmitted from the second wireless device if the silence time assigned to the second wireless device is not recorded in the first wireless device.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: February 13, 2018
    Assignee: MEDIATEK INC.
    Inventors: Yu-Ju Lee, Po-Hsun Huang, Chao-Wen Chou
  • Bracket for decorative frame for a window curtain rail
    Patent number: D811124
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: February 27, 2018
    Inventor: Tser Wen Chou
  • Bracket for decorative frame for a window curtain rail
    Patent number: D811203
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: February 27, 2018
    Inventor: Tser Wen Chou